Abstract: The plasma display of the present invention is a plasma display in which a dielectric layer and stripe-shaped barrier ribs are formed on a substrate, and it is characterized in that there are inclined regions at the lengthwise direction ends of said barrier ribs and, furthermore, the height (Y) of the inclined regions and the length (X) of the base of the inclined regions are within the range 0.5≦X/Y≦100. Moreover, the method of the present invention for manufacturing a plasma display is characterized in that the aforesaid stripe-shaped barrier ribs are formed via a process in which a pattern of stripe-shaped barrier ribs having inclined regions at the ends is formed on a substrate using a barrier rib paste comprising inorganic material and organic component, and a process in which said barrier rib pattern is fired.

Abstract: An electrical insulating polyester film has an apparent density of 1.37 to 0.85 g/cm.sup.3 and a tensile modulus of 2.0 to 4.5 GPa.A film having low oligomer content, low cost, high heat resistance, high impact resistance, superior machinability and processability, assembling stability, and superior visibility is obtained. Furthermore, leakage of current is reduced when it is used for motor insulation.

Abstract: A laminated polyphenylene sulfide film having excellent adhesiveness, especially heatsealability, and good mechanical properties and heat resistance, as well as a process for producing the same are disclosed. A central layer is constituted by a biaxially oriented polyphenylene sulfide film and a surface layer is constituted by phenylene sulfide copolymer containing a copolymerization unit other than p-phenylene sulfide unit in an amount of not less than 3 mol % and less than 50 mol %, so that the film has an improved adhesiveness and heatsealability while retaining the heat resistance and mechanical properties of biaxially oriented polyphenylene sulfide films.

Abstract: The present invention provides a polyphenylene sulfide film which consists essentially of a resin composition containing polyphenylene sulfide as major constituent, in which fine particles with an average particle size of 0.05-3 .mu.m are dispersed, the fine particles having a single particle index of not less than 0.5. The polyphenylene sulfide film of the present invention is excellent in not only the slipping property but also the number of electrical insulation defects are extremely small, so that the film of the present invention is useful for the dielectric film of film capacitor with stable initial characteristics. Further, since the film of the present invention is excellent in the slipping property and surface smoothness, so that it is useful as a base film for magnetic recording media with excellent magnetic conversion characteristics and excellent drop out characteristics.

Abstract: A laminate comprising a non-oriented polyphenylenesulfide film and a biaxially oriented polyphenylenesulfide film bonded on at least one surface of the non-oriented polyphenylenesulfide film without using an adhesive, and process for producing it. The delamination of the laminate can be prevented and the tear strength can be increased by suppressing the crystallization of the non-oriented polyphenylenesulfide film. Since an adhesive is not interposed and the main component of the layers of the laminate is polyphenylenesulfide, the laminate can have excellent heat resistance, chemical resistance, electrical insulating property, wet heat resistance and processability with a good balance.

Abstract: At least a part of a protective layer (1, 4a, 4b, 5a, 5b, 6a, 6b,6c, 7, 8a, 8b) provided on the outer surface of a capacitance generating portion (2) of a film capacitor is constructed from a substantially non-oriented polyphenylenesulfide film (10). Since the non-oriented polyphenylenesulfide film (10) substantially does not accompany thermal shrinkage when it is heat stuck or soldered, and it absorbs the deformation due to the thermal shrinkage of other layers of the protective layer, the sticking stability and dimensional stability in the protective layer can be ensured. As a result, the thermal resistance of the protective layer and the thermal resistance of the capacitor can be improved as well as the simplification of sticking process or omission of an adhesive becomes possible. Moreover, this can serve to further miniaturization of capacitors.

Abstract: The present invention relates to an aluminum deposited film and a process for producing it. Since the surface area coefficient C of the surface of the deposited layer is not greater than 1.00.times.10.sup.-4 or aluminum crystals the [1, 1, 0] planes of which are oriented in parallel with the surface of a base film are contained in an aluminum thin layer in an aluminum deposited film. The corrosion resistance in a high-temperature and high-humidity atomsphere of the aluminum deposited film is excellent. A capacitor coated with the aluminum deposited film has excellent moisture resistance even if its encapsulation is simple, or has increased moisture resistance when its encapsulation is constructed as one similar to that of a conventional capacitor.

Abstract: A laminate comprising a non-oriented polyphenylenesulfide film and a biaxially oriented polyphenylenesulfide film bonded on at least one surface of the non-oriented polyphenylenesulfide film without using an adhesive, and process for producing it. The delamination of the laminate can be prevented and the tear strength can be increased by suppressing the crystallization of the non-oriented polyphenylenesulfide film. Since an adhesive is not interposed and the main component of the layers of the laminate is polyphenylenesulfide, the laminate can have excellent heat resistance, chemical resistance, electrical insulating property, wet heat resistance and processability with a good balance.

Abstract: An aluminum-metallized polyphenylenesulfide film capacitor. The polyphenylenesulfide film serves as at least a portion of dielectric material. The ratio of S/Al at the surface of the aluminum electrode which is determined by X-ray photoelectron spectroscopy method is not more than 0.14, or the ratio of Cl/Al at the surface of the aluminum electrode is not more than 0.013.

Abstract: Disclosed is a biaxially oriented poly-p-phenylene sulfide film prepared from a resin composition comprising poly-p-phenylene sulfide as its principal component, 20-1000 ppm of at least one metal belonging to IA group or IIA group of the periodic table and 100-600 ppm of nitrogen, the poly-p-phenylene sulfide having an weight average molecular weight Mw of 30,000-90,000, and a ratio of weight average molecular weight to number average molecular weight Mw/Mn of 3-10. The film of the present invention has an excellent mechanical properties and dimensional stability, as well as excellent clearness.

Abstract: A capacitor in which the dielectric material comprises a biaxially oriented polyphenylene sulfide film and the electrodes are thin layers or foils of a metal is provided.The biaxially oriented polyphenylene sulfide film comprises a resin composition mainly consisting of poly-p-phenylene sulfide and having a small-protrusion density, Sd, on the surface in the range of from 20 to 300/mm and a large-protrusion density, Ld, in the range of 5/mm or below.

Abstract: A poly-p-phenylene sulfide resin composition comprising poly-p-phenylene sulfide as a principal component and 0.05 to 40 wt % (based on the total weight of the composition) of at least one metal component selected from the group consisting of zinc, lead, magnesium, manganese, barium and tin. The plastic materials prepared from the composition of this invention are greatly improved in resistance to copper contact and thermal resistance in closed air environment, and therefore are very useful for electrical insulation.

Abstract: A polyphenylene sulfide (PPS) molded board reinforced with 15-85 wt. % of glass fibers (GF) having a length of at least 5 mm is provided. The molded board is useful as an insulating substrate of a printed circuit board. The printed circuit board is prepared by compressing under heating a mixture or laminate of PPS and GF to form a composite molded board and, at or after the compression step, bonding a metallic foil to a surface the composite molded board. The printed circuit board is excellent in mechanical properties such as impact resistance, thermal properties such as heat distortion temperature and solder resistance, and adhesion between the insulating substrate and the metallic foil.

Abstract: A sheet-like material and a printed circuit board comprised of the sheet-like material with a metallic film laminated thereon are provided wherein the sheet-like material is comprised of a composition mainly consisting of high molecular weight poly p-phenylenesulfide, characterized in that:a. the amount of related materials extracted through chloroform extraction of the poly p-phenylenesulfide containing related materials is less than 1.5 wt % of the entire weight of said poly p-phenylenesulfide prior to said extraction, andb. as measured by wide angle X-ray diffraction,(i) the index of crystallinity of said poly p-phenylenesulfide is in the range of above 2.5 and below 8.0,(ii) the crystallite size of said poly p-phenylenesulfide is in the range of above 50 A and below 100 A, and(iii) the orientation factors of said poly p-phenylenesulfide, measured in three directions comprising through the sample, edgewise and endwise, are above 0.70, as measured by wide angle x-ray diffraction.

Abstract: Plastic surfaces are treated with electrical corona discharge in an atmosphere of nitrogen and carbon dioxide. Oxygen is substantially excluded, and is kept at less than 0.1% by volume.