Abstract: A semiconductor package, includes: element substrate having first surface, including: functional element on first surface, and extracting electrode on first surface and configured to output a signal of functional element, extracting electrode being disposed around functional element; rim substrate shaped into a frame, and configured to have first junction with element substrate to surround functional element, rim substrate including: first through hole through rim substrate, and connecting electrode which is: formed by packing first through hole with first conductor material, configured to seal signal extracting aperture of extracting electrode, and configured to electrically connect signal extracting aperture with takeout electrode; and cover substrate configured to have second junction with rim substrate to block aperture of rim substrate, cover substrate including: second through hole through cover substrate, and takeout electrode which is: formed by packing second through hole with second conductor materi

Abstract: A getter sheet is secured within a package element in a condition of elastic deformation by positioning the getter sheet between a base and a cap of a package with at least one portion of the getter sheet in contact with the package. When positioned within the package, the condition of elastic deformation may force the getter sheet into a vaulted form. Therefore, the getter sheet may be secured within the package without utilizing any additional parts or fasteners. The getter sheet comprises particulates of a getter applied to a sheet of material. The getter sheet may comprise a rectangular shape, an elliptical shape, or an octagonal shape. The getter sheet may be secured within the package when at least one portion of the getter sheet contacts one or more of a side surface of the cap, a bottom surface of the cap, and a top surface of the base.

Abstract: A semiconductor package, includes: element substrate having first surface, including: functional element on first surface, and extracting electrode on first surface and configured to output a signal of functional element, extracting electrode being disposed around functional element; rim substrate shaped into a frame, and configured to have first junction with element substrate to surround functional element, rim substrate including: first through hole through rim substrate, and connecting electrode which is: formed by packing first through hole with first conductor material, configured to seal signal extracting aperture of extracting electrode, and configured to electrically connect signal extracting aperture with takeout electrode; and cover substrate configured to have second junction with rim substrate to block aperture of rim substrate, cover substrate including: second through hole through cover substrate, and takeout electrode which is: formed by packing second through hole with second conductor materi

Abstract: A getter sheet is secured within a package element in a condition of elastic deformation by positioning the getter sheet between a base and a cap of a package with at least one portion of the getter sheet in contact with the package. When positioned within the package, the condition of elastic deformation may force the getter sheet into a vaulted form. Therefore, the getter sheet may be secured within the package without utilizing any additional parts or fasteners. The getter sheet comprises particulates of a getter applied to a sheet of material. The getter sheet may comprise a rectangular shape, an elliptical shape, or an octagonal shape. The getter sheet may be secured within the package when at least one portion of the getter sheet contacts one or more of a side surface of the cap, a bottom surface of the cap, and a top surface of the base.