Abstract: The present invention provides a moisture-curable polyurethane hot-melt resin composition containing an isocyanate group-containing urethane prepolymer (i), where the moisture-curable polyurethane hot-melt resin composition further contains a curing catalyst (ii) represented by General Formula (1) below in an amount in a range of 0.2 to 1 parts by mass with respect to 100 parts by mass of the urethane prepolymer (i) and an organic acid (iii) having a sulfur atom in an amount in a range of 0.0001 to 0.5 parts by mass with respect to 100 parts by mass of the urethane prepolymer (i). The present invention also provides an article including at least two members bonded using the moisture-curable polyurethane hot-melt resin composition.

Abstract: The present invention provides a release agent for a reactive hot melt resin, wherein a dispersion term (?D) in the Hansen solubility parameters falls within the range of 14.0 to 21.0 MPa0.5, a dipole interaction force term (?P) falls within the range of 0 to 10.5 MPa0.5, and a hydrogen bond term (?H) falls within the range of 0 to 13.5 MPa0.5. Preferably, the adhesive for a reactive hot melt resin is at least one type of solvent selected from a group consisting of benzoic acid esters, tetrahydrofurfuryl alcohol, and tetrahydrofurfuryl (meth)acrylate. The reactive hot melt resin preferably contains an urethane prepolymer having an isocyanate group, and the urethane bond content in the urethane prepolymer is preferably within the range of 0.1 to 3 mol/kg.

Abstract: There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.

Abstract: An object to be achieved by the present invention is to provide a conductive pattern having such a level of adhesion that a conductive layer containing a conductive substance such as silver does not separate from a primer layer with time. The present invention relates to a conductive pattern including a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2); a primer layer (B) containing a compound (b1) having a functional group [X]; and a substrate layer (C), the conductive layer (A), the primer layer (B), and the substrate layer (C) being stacked, in which a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) contained in the conductive layer (A) with the functional group [X] of the compound (b1) contained in the primer layer (B).

Abstract: The present invention provides an absorbing-layer-forming composition including a blocked isocyanate such that the amount of the blocked isocyanate is 50% by mass to 100% by mass of the solid content of the absorbing-layer-forming composition and an absorbing substrate, a printed item, and a conductive pattern that are formed using the absorbing-layer-forming composition. The absorbing-layer-forming composition according to the present invention can be used for forming an absorbing layer which is capable of carrying a fluid such as an ink therein and which enables good adhesion between various types of supports and a conductive layer to be achieved. In particular, using a blocked isocyanate having a number-average molecular weight of 1,000 to 5,000 further increases the adhesion between various types of supports and the conductive layer.

Abstract: Provided are a method for forming a high-definition metal pattern which including the steps of (1) forming a receiving layer on a substrate by coating the substrate with a resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin and a medium, (2) forming a plating-core pattern on the receiving layer by printing an ink including a particle that serves as a plating core on the receiving layer by reverse offset printing, and (3) depositing a metal on the plating-core pattern by electroless plating, a high-definition metal pattern formed by the above-described method, and an electronic component including the high-definition metal pattern.

Abstract: An object to be achieved by the present invention is to provide a conductive pattern having such a level of adhesion that a conductive layer containing a conductive substance such as silver does not separate from a primer layer with time. The present invention relates to a conductive pattern including a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2); a primer layer (B) containing a compound (b1) having a functional group [X]; and a substrate layer (C), the conductive layer (A), the primer layer (B), and the substrate layer (C) being stacked, in which a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) contained in the conductive layer (A) with the functional group [X] of the compound (b1) contained in the primer layer (B).

Abstract: Provided is a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

Abstract: The present invention provides a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

Abstract: Provided is a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

Abstract: There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.

Abstract: The present invention provides a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

Abstract: The present invention provides an absorbing-layer-forming composition including a blocked isocyanate such that the amount of the blocked isocyanate is 50% by mass to 100% by mass of the solid content of the absorbing-layer-forming composition and an absorbing substrate, a printed item, and a conductive pattern that are formed using the absorbing-layer-forming composition. The absorbing-layer-forming composition according to the present invention can be used for forming an absorbing layer which is capable of carrying a fluid such as an ink therein and which enables good adhesion between various types of supports and a conductive layer to be achieved. In particular, using a blocked isocyanate having a number-average molecular weight of 1,000 to 5,000 further increases the adhesion between various types of supports and the conductive layer.

Abstract: Provided are a method for forming a high-definition metal pattern which including the steps of (1) forming a receiving layer on a substrate by coating the substrate with a resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin and a medium, (2) forming a plating-core pattern on the receiving layer by printing an ink including a particle that serves as a plating core on the receiving layer by reverse offset printing, and (3) depositing a metal on the plating-core pattern by electroless plating, a high-definition metal pattern formed by the above-described method, and an electronic component including the high-definition metal pattern.

Abstract: It is an object of the present invention to provide a laminate, such as a conductive pattern, having an excellent adhesion at the interfaces between a layer that serves as a support and a conductive layer containing a conductive material and between the conductive layer and a plating layer. The present invention provides a laminate at least including a support layer (I), a conductive layer (II) having an oxidized surface, and a plating layer (III) formed on the oxidized surface of the conductive layer (II); the present invention also provides a conductive pattern and electric circuit each including such a laminate.

Abstract: An object to be achieved by the present invention is to provide a conductive pattern having such a level of adhesion that a conductive layer containing a conductive substance such as silver does not separate from a primer layer with time. The present invention relates to a conductive pattern including a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2); a primer layer (B) containing a compound (b1) having a functional group [X]; and a substrate layer (C), the conductive layer (A), the primer layer (B), and the substrate layer (C) being stacked, in which a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) contained in the conductive layer (A) with the functional group [X] of the compound (b1) contained in the primer layer (B).

Abstract: An object of the present invention is to provide a resin composition for forming an ink-receiving layer that is capable of forming a printed image having excellent printing properties and water resistance, both in the case of use of a water-based ink and in the case of use of a solvent-based ink. The resin composition for forming an ink-receiving layer includes a binder resin (A) having a weight-average molecular weight of 100,000 or more and an acid value of 90 to 450, an aqueous medium (B), and as required, at least one component (C) selected from the group consisting of a water-soluble resin (c1) and an inorganic filler (c2). The binder resin (A) is dispersed in the aqueous medium (B), and the content of the at least one component (C) relative to the total amount of the binder resin (A) is 0% to 15% by mass.

Abstract: An object to be achieved by the present invention is to provide a resin composition for forming a receiving layer, the resin composition being capable of forming, among receiving layers that can carry a fluid such as an ink, a receiving layer having excellent, adhesion to various types of supports and capable of forming a receiving layer which has excellent printing properties without causing bleeding of a fluid such as an ink. The present invention relates to a resin composition for forming a receiving layer, the resin composition containing a urethane resin (A), a vinyl polymer (B), and an aqueous medium (C), in which the urethane resin (A) has an alicyclic structure in an amount of 2,000 to 5,500 mmol/kg relative to the total amount of the urethane resin (A), and a hydrophilic group.

Abstract: The present invention relates to a conductive pattern including a layer (A) including a substrate, an absorbing layer (B), and a conductive layer (C). The absorbing layer (B) is formed by applying conductive ink containing a conductive substance (c) that constitutes the conductive layer (C) to a surface of a resin layer (B1) including a vinyl resin (b1) produced by polymerizing a monomer mixture containing 10% by mass to 70% by mass of methyl (meth)acrylate; and subsequently forming crosslinks in the resin layer (B1).

Abstract: An object to be achieved by the present invention is to provide a resin composition for forming a receiving layer, the resin composition being capable of forming, among receiving layers that can carry a fluid such as an ink, a receiving layer having excellent, adhesion to various types of supports and capable of forming a receiving layer which has excellent printing properties without causing bleeding of a fluid such as an ink. The present invention relates to a resin composition for forming a receiving layer, the resin composition containing a urethane resin (A), a vinyl polymer (B), and an aqueous medium (C), in which the urethane resin (A) has an alicyclic structure in an amount of 2,000 to 5,500 mmol/kg relative to the total amount of the urethane resin (A), and a hydrophilic group.