Abstract: A method for manufacturing a contact probe includes: a lithography step of obtaining a resin mold by forming a pattern for the contact probe, a pattern for a tie bar in a shape of a frame therearound, and a pattern for a coupling portion coupling these two patterns, in a resist formed on a conductive substrate, by lithography; an electroforming step of forming a layer made of a metal material on the resin mold by electroforming to form a metal structure in which the contact probe is integral with the tie bar at the coupling portion; a removal step of removing the resin mold and the conductive substrate; a plating step of forming a plating layer on a surface of the metal structure by electroplating after the removal step; and a separation step of separating the contact probe from the metal structure after the plating step.

Abstract: The solder film manufacturing method has a step for laminating a plurality of unit layers, each unit layer formed by laminating a plurality of layers including layers of only Zn, Bi or Sn, or layers of alloys of two of the metals Zn, Bi and Sn. This manufacturing method also preferably also has a step for forming an Sn layer as the top surface layer. A heat sink has a solder film manufactured by this process. A solder junction connects a semiconductor device characterized by having a semiconductor element mounted on this heat sink with a heat sink having this solder film.

Abstract: The solder film manufacturing method has a step for laminating a plurality of unit layers, each unit layer formed by laminating a plurality of layers including layers of only Zn, Bi or Sn, or layers of alloys of two of the metals Zn, Bi and Sn. This manufacturing method also preferably also has a step for forming an Sn layer as the top surface layer. A heat sink has a solder film manufactured by this process. A solder junction connects a semiconductor device characterized by having a semiconductor element mounted on this heat sink with a heat sink having this solder film.

Abstract: The material for an electrical resistivity element contains at least 20 mass % and at most 60 mass % of nickel, less than 5 mass % of iron and the remaining part including unavoidable impurities and cobalt. The material for the electrical resistivity element is manufactured by preparing a composition that contains at least 20 mass % and at most 60 mass % of nickel, less than 5 mass % of iron and the remaining part including cobalt, melting and casting the composition to obtain an ingot, removing the surface of the ingot by hot working, and performing cold-working and heat treatment on the hot-worked body.

Abstract: The invention provides a glow plug with an electric resistor made of a material comprising 20 to 60% by weight nickel and less than 5% by weight iron and the balance of cobalt and unavoidable impurities. The glow plug pf the invention attains an excellent quick heating ability, a self-temperature control function, high oxidation resistance, long durability and good workability.

Abstract: A cable wire having a core conductor 11, an insulator 12 surrounding the core conductor, and an outer conductor 13 surrounding the insulator 12 is provided. The core conductor 11 is made of a metallic material including copper and silver so as to have a tensile strength of 120 kg/mm2 or more and an electric conductivity of 60 to 90% by IACS. The cable wire 1 is also employed in a coaxial cable 2 and a coaxial cable bundle.

Abstract: The invention provides a glow plug with an electric resistor made of a material comprising 20 to 60% by weight nickel and less than 5% by weight iron and the balance of cobalt and unavoidable impurities. The glow plug of the invention attains an excellent quick heating ability, a self-temperature control function, high oxidation resistance, long durability and good workability.