Patents by Inventor Yukihiko Akamatsu

Yukihiko Akamatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5916478
    Abstract: Heat-accumulating microcapsule dispersion includes a microcapsule provided as a small-diameter heat-accumulating material including organic compound functioning as heat accumulating material in association with a phase change thereof accommodated within a microcapsule, heat transfer fluid medium including a number of the microcapsules dispersed stably therein, and a number of thermal boundary layer stirring particles dispersed in the heat transfer fluid medium. The stirring particles has a volume average particle diameter between 0.1.times.D and 1.9.times.D relative to a layer thickness D of a thermal boundary layer formed inside a heat exchanging passage through which the dispersion is caused to flow. The particles stir the thermal boundary layer in association with movement thereof inside the heat exchanging passage.
    Type: Grant
    Filed: December 20, 1996
    Date of Patent: June 29, 1999
    Assignee: Osaka Gas Co, Ltd
    Inventors: Takatoshi Nakahira, Tetsuo Setoguchi, Masaaki Yoshikawa, Akira Kishimoto, Akio Chikazawa, Mamoru Ishiguro, Yasunori Nakanishi, Shigehiro Maeda, Yukihiko Akamatsu