Patents by Inventor Yukihiko Arai

Yukihiko Arai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D optoelectronic micro system
    Patent number: 7387913
    Abstract: A 3D micro optical switching system (3D-MOSS) is fabricated by dividing an optical switching system into several blocks, creating optoelectronic layers where optical switches or tunable filters in each block are disposed, laminating the optoelectronic layers by connecting the layers with optical connections. The fabrication process includes a first step of selectively exposing an adhesive bond whose adhesive strength changes by exposure, a second step of contacting the selectively-exposed adhesive bond with a thin-film device array on a first substrate, and a third step of selectively ring part of thin-film devices in the thin-film device array from the first substrate onto the selectively-exposed adhesive bond in accordance with an exposure pattern.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: June 17, 2008
    Assignees: JSR Corporation, Tetsuzo Yoshimura
    Inventors: Tetsuzo Yoshimura, Yukihiko Arai
  • 3D optoelectronic micro system
    Publication number: 20060261432
    Abstract: A 3D micro optical switching system (3D-MOSS) is fabricated by dividing an optical switching system into several blocks, creating optoelectronic layers where optical switches or tunable filters in each block are disposed, laminating the optoelectronic layers by connecting the layers with optical connections. The fabrication process includes a first step of selectively exposing an adhesive bond whose adhesive strength changes by exposure, a second step of contacting the selectively-exposed adhesive bond with a thin-film device array on a first substrate, and a third step of selectively ring part of thin-film devices in the thin-film device array from the first substrate onto the selectively-exposed adhesive bond in accordance with an exposure pattern.
    Type: Application
    Filed: July 28, 2006
    Publication date: November 23, 2006
    Applicants: JSR Corporation, Tetsuzo YOSHIMURA
    Inventors: Tetsuzo Yoshimura, Yukihiko Arai
  • Three-Dimensional opto-electronic micro-system
    Publication number: 20040247236
    Abstract: A 3D micro optical switching system (3D-MOSS) is fabricated by dividing an optical switching system into several blocks, creating optoelectronic layers where optical switches or tunable filters in each block are disposed, laminating the optoelectronic layers by connecting the layers with optical connections. The fabrication process includes a first step of selectively exposing an adhesive bond whose adhesive strength changes by exposure, a second step of contacting the selectively-exposed adhesive bond with a thin-film device array on a first substrate, and a third step of selectively ring part of thin-film devices in the thin-film device array from the first substrate onto the selectively-exposed adhesive bond in accordance with an exposure pattern.
    Type: Application
    Filed: February 3, 2004
    Publication date: December 9, 2004
    Inventors: Tesuzo Yoshimura, Yukihiko Arai