Abstract: Disclosed is a probing method including, when the probes are configured to make contact with a chip row including four chips continuously arranged in an oblique direction so that the probe card test four chips at a time, finding a first reference oblique chip row extending in the oblique direction and containing a center chip positioned at the center of the wafer and a plurality of first additional oblique chip rows arranged in parallel with the first reference oblique chip row at an upper side of the first reference oblique chip row, and setting contact positions between the probes and the first oblique chip rows wherein the contact positions are positions of the probes obtained by shifting the probes; setting contact positions between the probes and the second oblique chip rows in an opposite direction to a first step; and setting a plurality of index group and test order.

Abstract: Disclosed is a probing method including, when the probes are configured to make contact with a chip row including four chips continuously arranged in an oblique direction so that the probe card test four chips at a time, finding a first reference oblique chip row extending in the oblique direction and containing a center chip positioned at the center of the wafer and a plurality of first additional oblique chip rows arranged in parallel with the first reference oblique chip row at an upper side of the first reference oblique chip row, and setting contact positions between the probes and the first oblique chip rows wherein the contact positions are positions of the probes obtained by shifting the probes; setting contact positions between the probes and the second oblique chip rows in an opposite direction to a first step; and setting a plurality of index group and test order.

Abstract: A probe device includes a supporting member for supporting the probe card having a plurality of channels. Each of the channels has a group of probes which are brought into contact with plural electrode pads of one of objects to be inspected. The probe device further includes a channel information creation unit for creating channel information containing a layout of a group of the plurality of channels and an identification number of each of the channels and transmitting the created channel information to a controller, a channel information memory unit for storing the channel information received from the channel information creation unit, and an object layout memory unit for storing layout information of the objects. The controller performs an inspection of the objects based on the channel information stored in the channel information memory unit and the layout information of the objects stored in the object layout memory unit.

Abstract: A probe device includes a supporting member for supporting the probe card having a plurality of channels. Each of the channels has a group of probes which are brought into contact with plural electrode pads of one of objects to be inspected. The probe device further includes a channel information creation unit for creating channel information containing a layout of a group of the plurality of channels and an identification number of each of the channels and transmitting the created channel information to a controller, a channel information memory unit for storing the channel information received from the channel information creation unit, and an object layout memory unit for storing layout information of the objects. The controller performs an inspection of the objects based on the channel information stored in the channel information memory unit and the layout information of the objects stored in the object layout memory unit.

Abstract: A probe method is disclosed which inspects the electrical characteristics of an object to be inspected (wafer W) by bringing the electrodes of the object to be inspected placed on a main chuck and probes of a probe card into contact with each other. The main chuck is movable in the X, Y, Z, and .theta. directions and heated to a predetermined inspection temperature. The main chuck retreats to a position separated from the inspection position during high-temperature inspection. The time (retreat time) during which the main chuck stays retreated is calculated by a retreat time calculating mechanism. A preheat execute determination mechanism determines whether the probe card and probes are to be preheated on the basis of the retreat time. When it is determined that preheating is necessary, a preheat time calculation mechanism calculates the preheat execute time. Preheating is executed during the preheat execute time determined by a preheat end determination mechanism, and misalignment of the probes is corrected.

Abstract: Video camera apparatus includes image pick-up equipment, video recording and/or reproducing apparatus, display equipment, and an electronic view finder. In the apparatus, independent power on-off switches are provided in the image pick-up equipment and the video recording and/or reproducing equipment, respectively, and a selecting switch is provided for selecting a television tuner or an external input, and an input of the video recording and/or reproducing equipment. Switching on-off (operation-turn off) of the display equipment or the electronic view finder is automatically controlled in accordance with operation of these switches.