Patents by Inventor Yukihiko Kurosawa

Yukihiko Kurosawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroconductive composition, electroconductive coating and method for forming electroconductive coating
    Publication number: 20040259007
    Abstract: An electrically conductive composition can be obtained that provides an electrically conductive coating having low volume resistivity and high electrical conductivity comparable to that of metallic silver independent of high-temperature film deposition conditions, while also enabling the line width of an electrical circuit to be sufficiently narrow without having to increase thickness in the case of forming an electrical circuit of a flexible circuit board and so forth.
    Type: Application
    Filed: June 25, 2004
    Publication date: December 23, 2004
    Inventors: Katsuhiko Takahashi, Kiwako Ohmori, Masanori Endo, Hikaru Yasuhara, Akinobu Ono, Takayuki Imai, Yukihiko Kurosawa, Hiroaki Zaima
  • Flexible printed circuit board
    Patent number: 6664479
    Abstract: A flexible printed circuit board (FPC) comprises a base film; a base film side adhesive layer provided on the base film; a metal foil layer on which a pattern circuit is formed, provided on the base film side adhesive layer; and a cover layer side adhesive layer provided on the metal foil layer, wherein at least one of the base film side adhesive and the cover layer side adhesive layer has a higher glass transition temperature than an operating temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: December 16, 2003
    Assignee: Fujikura Ltd.
    Inventors: Nobuo Tanabe, Kenichi Okada, Yukihiko Kurosawa, Takayuki Imai, Sadamitsu Jumonji, Masahiko Arai, Masahiro Kaizu
  • Flexible printed circuit board
    Publication number: 20020189855
    Abstract: A flexible printed circuit board (FPC) comprises a base film; a base film side adhesive layer provided on the base film; a metal foil layer on which a pattern circuit is formed, provided on the base film side adhesive layer; and a cover layer side adhesive layer provided on the metal foil layer, wherein at least one of the base film side adhesive and the cover layer side adhesive layer has a higher glass transition temperature than the working environment temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.
    Type: Application
    Filed: April 27, 2001
    Publication date: December 19, 2002
    Inventors: Nobuo Tanabe, Kenichi Okada, Yukihiko Kurosawa, Takayuki Imai, Sadamitsu Jumonji, Masahiko Arai, Masahiro Kaizu
  • Manufacturing method for a PTC thermistor
    Patent number: 5351390
    Abstract: PTC (positive temperature coefficient) thermistors of a novel configuration and a method for their manufacture. The PTC thermistors have a PTC element sandwiched between two electrodes for which leads are formed as an extension of each of the two electrodes protruding beyond the edge of the PTC element. Several manufacturing methods avoid undue thermal and physical stress to the PTC composition while providing PTC thermistors having a variety of shapes and configurations.
    Type: Grant
    Filed: January 12, 1993
    Date of Patent: October 4, 1994
    Assignee: Fujikura Ltd.
    Inventors: Makoto Yamada, Setsuya Isshiki, Yukihiko Kurosawa, Masakazu Kuroda, Morio Hayashi
  • PTC thermistor and manufacturing method for the same
    Patent number: 5212466
    Abstract: PTC (positive temperature coefficient) thermistors of a novel configuration and a method for their manufacture. The PTC thermistors have a PTC element sandwiched between two electrodes for which leads are formed as an extension of each of the two electrodes protruding beyond the edge of the PTC element. Several manufacturing methods avoid undue thermal and physical stress to the PTC composition while providing PTC thermistors having a variety of shapes and configurations.
    Type: Grant
    Filed: May 18, 1990
    Date of Patent: May 18, 1993
    Assignee: Fujikura Ltd.
    Inventors: Makoto Yamada, Setsuya Isshiki, Yukihiko Kurosawa, Masakazu Kuroda, Mori Hayashi
  • PTC conductive polymer composition containing carbon black having large particle size and high DBP absorption
    Patent number: 5174924
    Abstract: A conductive polymer composition exhibiting positive temperature coefficient behavior comprising:(a) a crystalline polymer having dispersed therein(b) carbon black having an average particle diameter of at least about 60 millimicrons and a DBP absorption of at least about 80 cc/100 g.Circuit protection devices containing a thin layer of this conductive polymer composition between laminar electrodes provide high breakdown voltage in combination with very low resistance and are useful for protecting high-current/high voltage battery-powered devices.
    Type: Grant
    Filed: June 4, 1990
    Date of Patent: December 29, 1992
    Assignee: Fujikura Ltd.
    Inventors: Makoto Yamada, Setsuya Isshiki, Yukihiko Kurosawa