Patents by Inventor Yukihiko Shirakawa
Yukihiko Shirakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9659713Abstract: An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.Type: GrantFiled: January 7, 2016Date of Patent: May 23, 2017Assignee: TDK CORPORATIONInventors: Yukihiko Shirakawa, Kazuhiro Nakamura, Shintaro Kon, Hiromitsu Nogiwa
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Patent number: 9496088Abstract: An electronic component comprises an element body and an outer electrode. The element body has a pair of end faces opposing each other, a pair of main faces opposing each other while extending so as to connect the pair of end faces to each other, and a pair of side faces opposing each other while extending so as to connect the pair of main faces to each other. The outer electrode is formed on the end face side of the element body and covers a portion of the main and side faces adjacent to the end face. At least a surface of an electrode portion of the outer electrode located on the side face side thereof is covered with an insulating layer.Type: GrantFiled: October 27, 2015Date of Patent: November 15, 2016Assignee: TDK CORPORATIONInventors: Yukihiko Shirakawa, Tatsuo Inagaki, Shintaro Kon, Osamu Hirose, Masahiko Konno
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Publication number: 20160118193Abstract: An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.Type: ApplicationFiled: January 7, 2016Publication date: April 28, 2016Applicant: TDK CORPORATIONInventors: Yukihiko SHIRAKAWA, Kazuhiro NAKAMURA, Shintaro KON, Hiromitsu NOGIWA
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Publication number: 20160049257Abstract: An electronic component comprises an element body and an outer electrode. The element body has a pair of end faces opposing each other, a pair of main faces opposing each other while extending so as to connect the pair of end faces to each other, and a pair of side faces opposing each other while extending so as to connect the pair of main faces to each other. The outer electrode is formed on the end face side of the element body and covers a portion of the main and side faces adjacent to the end face. At least a surface of an electrode portion of the outer electrode located on the side face side thereof is covered with an insulating layer.Type: ApplicationFiled: October 27, 2015Publication date: February 18, 2016Applicant: TDK CORPORATIONInventors: Yukihiko SHIRAKAWA, Tatsuo INAGAKI, Shintaro KON, Osamu HIROSE, Masahiko KONNO
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Patent number: 9263191Abstract: An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.Type: GrantFiled: May 19, 2015Date of Patent: February 16, 2016Assignee: TDK CORPORATIONInventors: Yukihiko Shirakawa, Kazuhiro Nakamura, Shintaro Kon, Hiromitsu Nogiwa
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Patent number: 9202627Abstract: An electronic component comprises an element body and an outer electrode. The element body has a pair of end faces opposing each other, a pair of main faces opposing each other while extending so as to connect the pair of end faces to each other, and a pair of side faces opposing each other while extending so as to connect the pair of main faces to each other. The outer electrode is formed on the end face side of the element body and covers a portion of the main and side faces adjacent to the end face. At least a surface of an electrode portion of the outer electrode located on the side face side thereof is covered with an insulating layer.Type: GrantFiled: June 4, 2012Date of Patent: December 1, 2015Assignee: TDK CORPORATIONInventors: Yukihiko Shirakawa, Tatsuo Inagaki, Shintaro Kon, Osamu Hirose, Masahiko Konno
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Publication number: 20150255215Abstract: An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.Type: ApplicationFiled: May 19, 2015Publication date: September 10, 2015Inventors: Yukihiko SHIRAKAWA, Kazuhiro NAKAMURA, Shintaro KON, Hiromitsu NOGIWA
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Patent number: 9064623Abstract: An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.Type: GrantFiled: August 31, 2012Date of Patent: June 23, 2015Assignee: TDK CORPORATIONInventors: Yukihiko Shirakawa, Kazuhiro Nakamura, Shintaro Kon, Hiromitsu Nogiwa
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Publication number: 20130057112Abstract: An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.Type: ApplicationFiled: August 31, 2012Publication date: March 7, 2013Applicant: TDK CORPORATIONInventors: Yukihiko SHIRAKAWA, Kazuhiro NAKAMURA, Shintaro KON, Hiromitsu NOGIWA
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Publication number: 20130020913Abstract: An electronic component has an element body, an external electrode, and an insulating material. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed on the end face side of the element body and covers a partial region of the principal face and/or a partial region of the side face adjacent to the end face. The insulating material covers a surface of the element body except for one face which is the principal face or the side face and at least a part of which is covered by the external electrode, and the external electrode formed on the surface.Type: ApplicationFiled: July 11, 2012Publication date: January 24, 2013Applicant: TDK CORPORATIONInventors: Yukihiko SHIRAKAWA, Tatsuo INAGAKI, Shintaro KON, Hiromitsu NOGIWA
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Publication number: 20120313489Abstract: An electronic component comprises an element body and an outer electrode. The element body has a pair of end faces opposing each other, a pair of main faces opposing each other while extending so as to connect the pair of end faces to each other, and a pair of side faces opposing each other while extending so as to connect the pair of main faces to each other. The outer electrode is formed on the end face side of the element body and covers a portion of the main and side faces adjacent to the end face. At least a surface of an electrode portion of the outer electrode located on the side face side thereof is covered with an insulating layer.Type: ApplicationFiled: June 4, 2012Publication date: December 13, 2012Applicant: TDK CORPORATIONInventors: Yukihiko SHIRAKAWA, Tatsuo INAGAKI, Shintaro KON, Osamu HIROSE, Masahiko KONNO
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Patent number: 7839621Abstract: A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the other principal face, and the electrodes face each other. A first portion of one lead conductor is laid on one side face. A first portion of the other lead conductor is laid on another side face. First portions of the lead wires are connected to the corresponding first portions of the lead conductors.Type: GrantFiled: February 28, 2008Date of Patent: November 23, 2010Assignee: TDK CorporationInventors: Yukihiko Shirakawa, Iwao Miura
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Patent number: 7460353Abstract: A high-voltage capacitor is intended for use in a high-voltage capacitor device having at least two through conductors. The high-voltage capacitor includes a dielectric porcelain, an individual electrode, and a common electrode. At least two spaced individual electrodes are provided on one surface of the dielectric porcelain and intended to be connected one-to-one to the through conductors positioned outside the dielectric porcelain. The common electrode is provided on the other surface of the dielectric porcelain.Type: GrantFiled: March 23, 2006Date of Patent: December 2, 2008Assignee: TDK CorporationInventors: Yukihiko Shirakawa, Tsukasa Sato, Isao Fujiwara, Hisashi Tanaka
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Publication number: 20080225461Abstract: There are provided an electronic component permitting easy surface mounting onto a circuit board and, a mounted structure and an inverter device therewith. A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the other principal face, and the electrodes face each other. A first portion of one lead conductor is laid on one side face. A first portion of the other lead conductor is laid on another side face. First portions of the lead wires are connected to the corresponding first portions of the lead conductors.Type: ApplicationFiled: February 28, 2008Publication date: September 18, 2008Applicant: TDK CORPORATIONInventors: Yukihiko SHIRAKAWA, Iwao MIURA
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Publication number: 20070047174Abstract: A high-voltage feed-through capacitor includes: a capacitor element; a grounding metal fitting; an insulating resin; two through conductors; an insulating cover; and an insulating tube. The capacitor element has two separate electrodes on one side and one common electrode on the other side and is mounted on one side of the grounding metal fitting with the common electrode being connected to the same side of the grounding metal fitting. The insulating resin fills a space inside the capacitor element. Each through conductor has a rod-like conductor portion passing through the grounding metal fitting and the capacitor element and connected to the separate electrode. At least a portion of the insulating tube is attached to the rod-like conductor portion within the capacitor element. The insulating cover is attached to the rod-like conductor portion to have one end thereof in contact with one end of the insulating tube.Type: ApplicationFiled: June 1, 2006Publication date: March 1, 2007Applicant: TDK CorporationInventors: Tsukasa Sato, Yukihiko Shirakawa, Isao Fujiwara, Hisashi Tanaka
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Patent number: 7184256Abstract: A high-voltage feed-through capacitor includes: a capacitor element; a grounding metal fitting; an insulating resin; two through conductors; an insulating cover; and an insulating tube. The capacitor element has two separate electrodes on one side and one common electrode on the other side and is mounted on one side of the grounding metal fitting with the common electrode being connected to the same side of the grounding metal fitting. The insulating resin fills a space inside the capacitor element. Each through conductor has a rod-like conductor portion passing through the grounding metal fitting and the capacitor element and connected to the separate electrode. At least a portion of the insulating tube is attached to the rod-like conductor portion within the capacitor element. The insulating cover is attached to the rod-like conductor portion to have one end thereof in contact with one end of the insulating tube.Type: GrantFiled: June 1, 2006Date of Patent: February 27, 2007Assignee: TDK CorporationInventors: Tsukasa Sato, Yukihiko Shirakawa, Isao Fujiwara, Hisashi Tanaka
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Publication number: 20060227470Abstract: A high-voltage capacitor is intended for use in a high-voltage capacitor device having at least two through conductors. The high-voltage capacitor includes a dielectric porcelain, an individual electrode, and a common electrode. At least two spaced individual electrodes are provided on one surface of the dielectric porcelain and intended to be connected one-to-one to the through conductors positioned outside the dielectric porcelain. The common electrode is provided on the other surface of the dielectric porcelain.Type: ApplicationFiled: March 23, 2006Publication date: October 12, 2006Applicant: TDK CORPORATIONInventors: Yukihiko Shirakawa, Tsukasa Sato, Isao Fujiwara, Hisashi Tanaka
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Patent number: 6914023Abstract: The object of the present invention is to provide a flat-panel-display substrate which is high in heat resistance, of which the coefficient of thermal expansion is approximated to that of a thick film dielectric layer, which is low at high temperatures in reactivity with the lead-doped thick film dielectric layer, and which can be made to have a large area. The substrate of the present invention is obtained by sintering a body comprising glass powder and a filler made of metal and/or semi-metal oxide, and is constituted by the sintered body and whose average coefficient of linear thermal expansion is from 7 to 9.5 ppm/° C. in the temperature range of 25 to 700° C. The glass powder includes alkaline-earth oxide, 15 to 50% by weight of silicon oxide, and no greater than 2% by weight of boron oxide. Furthermore, the filler is at a concentration of 10 to 30% by volume of the total amount of the glass powder and the filler in the mould.Type: GrantFiled: July 16, 2003Date of Patent: July 5, 2005Assignee: TDK CorporationInventors: Takaji Shimosaka, Yukihiko Shirakawa, Shirou Ootsuki
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Patent number: 6899916Abstract: A composite substrate includes a substrate, an electrode formed on the substrate, a first dielectric layer of thick film dielectric formed on the electrode, a second dielectric layer formed on the first dielectric layer by a solution coating-and-firing technique, and a buffer layer formed below and/or within the first dielectric layer. The composite substrate keeps the thick-film dielectric layer fully insulating and enables functional thin films formed thereon such as a light emitting layer to perform stable operation, especially stable light emission. An EL panel using the same and a method for preparing the same are also provided.Type: GrantFiled: October 29, 2002Date of Patent: May 31, 2005Assignee: The Westaim CorporationInventors: Yoshio Saita, Jun Hagiwara, Yukihiko Shirakawa, Masato Susukida
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Patent number: 6819044Abstract: A thin-film EL device includes a lower electrode layer, a barrier layer containing a conductive inorganic compound, a lower insulating layer, a light emitting layer, and an upper electrode layer stacked in order on an electrically insulating substrate. An EL device of high display quality is established at a low cost by acquiring satisfactory light emitting properties without using an expensive high-melting point noble metal in the lower electrode layer and without increasing the thickness of the lower electrode layer, even when the lower insulating layer contains a lead base dielectric material.Type: GrantFiled: April 9, 2003Date of Patent: November 16, 2004Assignee: TDK CorporationInventors: Yukihiko Shirakawa, Masatoshi Takizawa, Minoru Ookoba, Shirou Ootsuki