Patents by Inventor Yukihiko Tanaka

Yukihiko Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8372577
    Abstract: It is disclosed a photosensitive resin composition comprising (a) a binder polymer based on a copolymer containing benzyl (meth)acrylate as a building block, (b) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule and (c) a photopolymerization initiator based on a hexarylbisimidazole compound, with a light-initiated color former being optionally contained as component (d). The composition has long-term keeping quality, exhibits particularly high resistance to plating and dry etching, as well as assuring improvement in resolution and adhesion; the composition may be used to form a photosensitive dry film.
    Type: Grant
    Filed: June 9, 2010
    Date of Patent: February 12, 2013
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Yukihiko Tanaka, Shinkichi Asahi, Naoya Katsumata
  • Publication number: 20110065046
    Abstract: It is disclosed a photosensitive resin composition comprising (a) a binder polymer based on a copolymer containing benzyl (meth)acrylate as a building block, (b) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule and (c) a photopolymerization initiator based on a hexarylbisimidazole compound, with a light-initiated color former being optionally contained as component (d). The composition has long-term keeping quality, exhibits particularly high resistance to plating and dry etching, as well as assuring improvement in resolution and adhesion; the composition may be used to form a photosensitive dry film.
    Type: Application
    Filed: June 9, 2010
    Publication date: March 17, 2011
    Inventors: Yukihiko Tanaka, Shinkichi Asahi, Naoya Katsumata
  • Patent number: D1024189
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: April 23, 2024
    Assignee: BROTHER INDUSTRIES, LTD.
    Inventors: Hiromitsu Tanaka, Robin Riazi, Daiki Okamoto, Yukihiko Sato