Abstract: Disclosed is the copolymer having a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B having a cationic group, and a (meth)acrylic monomer unit C other than the (meth)acrylic monomer unit A and the (meth)acrylic monomer unit B.

Abstract: A composition having excellent adhesiveness to poorly adhesive materials such as polyolefins is provided. The solution is a composition comprising the following (1) to (2): (1) (meth)acrylates containing the following (1-1) to (1-3): (1-1) a (meth)acrylate having a hydroxyl group, (1-2) an alkyl (meth)acrylate, and (1-3) a (meth)acrylate having a cyclic ether skeleton, and (2) an organoboron compound. The content ratio of (1-1), (1-2), and (1-3) is (1-1):(1-2):(1-3)=(10 to 90):(5 to 80):(5 to 80) in mass ratio in 100 parts by mass of (1) (meth)acrylates.

Abstract: A composition having excellent adhesiveness to poorly adhesive materials such as polyolefins is provided. The solution is a composition comprising the following (1) to (2): (1) (meth)acrylates containing the following (1-1) to (1-3): (1-1) a (meth)acrylate having a hydroxyl group, (1-2) an alkyl (meth)acrylate, and (1-3) a (meth)acrylate having a cyclic ether skeleton, and (2) an organoboron compound. The content ratio of (1-1), (1-2), and (1-3) is (1-1):(1-2):(1-3)=(10 to 90):(5 to 80):(5 to 80) in mass ratio in 100 parts by mass of (1) (meth)acrylates.

Abstract: A composition having excellent adhesiveness to poorly adhesive materials such as polyolefins is provided. The solution is a composition comprising the following (1) to (2): (1) (meth)acrylates containing the following (1-1) to (1-3): (1-1) a (meth)acrylate having a hydroxyl group, (1-2) an alkyl (meth)acrylate, and (1-3) a (meth)acrylate having a cyclic ether skeleton, and (2) an organoboron compound. The content ratio of (1-1), (1-2), and (1-3) is (1-1):(1-2):(1-3)=(10 to 90):(5 to 80):(5 to 80) in mass ratio in 100 parts by mass of (1) (meth)acrylates.

Abstract: The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

Abstract: The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

Abstract: The present invention provides a resin composition, including: a filler that includes alumina particles and boron nitride particles; an elastomer having a weight-average molecular weight of from 10,000 to 100,000; and a curable resin. The present invention also provides a resin sheet, a cured resin sheet, a resin-adhered metal foil and a heat dissipation device, which are formed by using the resin composition.

Abstract: The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.

Abstract: The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.

Abstract: A pseudo cross-link type resin composition made of one of resins or a mixture of the resins; wherein the resin is obtained by mixing a polymer molecule that has an atomic group capable of forming an intermolecular hydrogen bond at least in a molecular side chain or at a molecular tail end of the polymer molecule, and a polymer molecule that has an atomic group capable of forming an intermolecular hydrogen bond at lest in a molecular side chain or in a molecular skeleton of the polymer molecule; wherein the polymer molecule having an atomic group capable of forming an intermolecular hydrogen bond at least in a molecular side chain or at a molecular tail end is a vinylic polymer or a copolymer thereof that has a carboxyl group or a hydroxyl group at least in a molecular side chain or at a molecular tail end, and the polymer molecule that has an atomic group capable of forming an intermolecular hydrogen bond at least in a molecular side chain or in a molecular skeleton is a vinylic polymer or a copolymer thereof

Abstract: A film for optical parts exhibiting high transmittance of short-wavelength light on the order of 400 nm, low birefringence, and excellent flexibility in which warping can be prevented after use for a long term, and a coiled film laminate using the film for optical parts, and an optical parts and an optical discs. The film for optical parts is characterized by comprising a light transmitting layer principally comprising thermosetting resin where an integrated value of the ratio of loss modulus to storage modulus in a temperature range of 30° C. to 80° C. as determined by a dynamic viscoelasticity measurement under a tensile stress mode at a frequency of 10 Hz with a heating rate of 3° C./min is 2 or more.

Abstract: The invention relates to an instruction control apparatus, a function unit, a program conversion apparatus, and a language processing apparatus. An object of the invention is to alter and add functions to the above apparatuses inexpensively and freely. To this end, in an instruction control apparatus according to the invention creates a sequence of summation values of numbers of input operands and a sequence of summation values of the numbers of output operands, and correlates, with input operands and output operands without overlap, input registers and output registers that are lower in rank than corresponding summation values included in the sequences of summation values. Physical registers are assigned to each set of input registers and output registers.

Abstract: The invention provides a pseudo cross-link resin composition comprises at least tow polymer molecules; wherein the resin is obtained by mixing a vinylic polymer molecule A that has an atomic group capable of forming an intermolecular hydrogen bond in a molecular side chain and/or at a molecular tail end of the polymer molecule, and a vinylic polymer molecule B that has an atomic group capable of forming an intermolecular hydrogen bond in a molecular side chain and/or in a molecular skeleton of the polymer molecule; wherein the vinylic polymer molecule A is a polymer and/or copolymer that has a carboxyl group or a hydroxyl group in a molecular side chain and/or at a molecular tail end, and the vinylic polymer molecule B is a polymer and/or copolymer having at least one or more nitrogen atom in a molecular side chain and/or a molecular skeleton; wherein the vinylic polymer molecule A and the vinylic polymer molecule B are mixed together, the intermolecular hydrogen bond is formed therebetween, and adding a sili

Abstract: Low-hygroscopicity low-birefringence resin compositions. One of the compositions is a resin composition (a) comprising the following polymers (A), and (B) and/or (C). Another is a resin composition (b) comprising the following polymers (A), (B) and (H). Still another is a polymer comprising the following polymers (I) and (J), diphenylsilicone (D), and a phenolic antioxidant (E). (A) A polymer comprising one or more kinds of indene and indene derivatives represented by the following general formula (I). (B) A polymer comprising polystyrene or a polystyrene derivative. (C) A polymer comprising a monomer copolymerizable with styrene or a styrene derivative. (H) A graft polymer having a structure wherein a polymer comprising at least one kind of indene and an indene derivative represented by the general formula (I) bonds to a side chain of a polymer comprising a monomer copolymerizable with styrene or a styrene derivative.

Abstract: A pseudo cross-link type resin composition made of one of resins or a mixture of the resins; wherein the resin is obtained by mixing a polymer molecule that has an atomic group capable of forming an intermolecular hydrogen bond at least in a molecular side chain or at a molecular tail end of the polymer molecule, and a polymer molecule that has an atomic group capable of forming an intermolecular hydrogen bond at lest in a molecular side chain or in a molecular skeleton of the polymer molecule; wherein the polymer molecule having an atomic group capable of forming an intermolecular hydrogen bond at least in a molecular side chain or at a molecular tail end is a vinylic polymer or a copolymer thereof that has a carboxyl group or a hydroxyl group at least in a molecular side chain or at a molecular tail end, and the polymer molecule that has an atomic group capable of forming an intermolecular hydrogen bond at least in a molecular side chain or in a molecular skeleton is a vinylic polymer or a copolymer thereof

Abstract: Low-hygroscopicity low-birefringence resin compositions. One of the compositions is a resin composition (a) comprising the following polymers (A), and (B) and/or (C). Another is a resin composition (b) comprising the following polymers (A), (B) and (H). Still another is a polymer comprising the following polymers (I) and (J), diphenylsilicone (D), and a phenolic antioxidant (E). (A) A polymer comprising one or more kinds of indene and indene derivatives represented by the following general formula (I). (B) A polymer comprising polystyrene or a polystyrene derivative. (C) A polymer comprising a monomer copolymerizable with styrene or a styrene derivative. (H) A graft polymer having a structure wherein a polymer comprising at least one kind of indene and an indene derivative represented by the general formula (I) bonds to a side chain of a polymer comprising a monomer copolymerizable with styrene or a styrene derivative.

Abstract: The invention provides a pseudo cross-link resin composition comprises at least tow polymer molecules; wherein the resin is obtained by mixing a vinylic polymer molecule A that has an atomic group capable of forming an intermolecular hydrogen bond in a molecular side chain and/or at a molecular tail end of the polymer molecule, and a vinylic polymer molecule B that has an atomic group capable of forming an intermolecular hydrogen bond in a molecular side chain and/or in a molecular skeleton of the polymer molecule; wherein the vinylic polymer molecule A is a polymer and/or copolymer that has a carboxyl group or a hydroxyl group in a molecular side chain and/or at a molecular tail end, and the vinylic polymer molecule B is a polymer and/or copolymer having at least one or more nitrogen atom in a molecular side chain and/or a molecular skeleton; wherein the vinylic polymer molecule A and the vinylic polymer molecule B are mixed together, the intermolecular hydrogen bond is formed therebetween, and adding a sili

Abstract: A pseudo cross-link type resin composition made of one of resins or a mixture of the resins; wherein the resin is obtained by mixing a polymer molecule that has an atomic group capable of forming an intermolecular hydrogen bond at least in a molecular side chain or at a molecular tail end of the polymer molecule, and a polymer molecule that has an atomic group capable of forming an intermolecular hydrogen bond at lest in a molecular side chain or in a molecular skeleton of the polymer molecule; wherein the polymer molecule having an atomic group capable of forming an intermolecular hydrogen bond at least in a molecular side chain or at a molecular tail end is a vinylic polymer or a copolymer thereof that has a carboxyl group or a hydroxyl group at least in a molecular side chain or at a molecular tail end, and the polymer molecule that has an atomic group capable of forming an intermolecular hydrogen bond at least in a molecular side chain or in a molecular skeleton is a vinylic polymer or a copolymer there

Abstract: A pseudo cross-link type resin composition made of one of resins or a mixture of the resins;

Abstract: A thermosetting resin composition comprising (A) a dibasic acid modified epoxy (meth)acrylate resin obtained by reacting a bromine-containing epoxy resin with a dibasic acid of 4 or more carbon atoms followed by further reacting with acrylic acid or methacrylic acid, (B) a thermosetting resin having an unsaturated group, the unsaturated group being copolymerizable with the resin (A), and (C) a polymerizable monomer; and an electrical laminate produced by using the thermosetting resin composition are disclosed.