Abstract: A high-speed interface connector is used for connecting a cable or a memory card each having a differential transmission system signal pin arrangement including a pair of differential transmission signaling pins that are adjacent to each other and two stable potential pins provided on both sides of the pair of differential transmission signaling pins, the two stable potential pins having potentials different from each other. The connector includes: a first and a second contact terminals for differential transmission respectively connected to the pair of differential transmission signaling pins; and a third and a fourth contact terminals provided on both sides of the first and the second contact terminal, the third contact terminal adjacent to the first contact terminal being connected to one of the two stable potential pins, and the fourth contact terminal adjacent to the second contact terminal having a potential identical to that of the third contact terminal.

Abstract: A high-speed interface connector is used for connecting a cable or a memory card each having a differential transmission system signal pin arrangement including a pair of differential transmission signaling pins that are adjacent to each other and two stable potential pins provided on both sides of the pair of differential transmission signaling pins, the two stable potential pins having potentials different from each other. The connector includes: a first and a second contact terminals for differential transmission respectively connected to the pair of differential transmission signaling pins; and a third and a fourth contact terminals provided on both sides of the first and the second contact terminal, the third contact terminal adjacent to the first contact terminal being connected to one of the two stable potential pins, and the fourth contact terminal adjacent to the second contact terminal having a potential identical to that of the third contact terminal.

Abstract: According to the present invention, the setting height position of a first terminal is set to be lower than the setting height position of a second terminal on the terminal formation surface of a printed substrate, so that the protection of an internal circuit and the transmission of a high-speed signal can be both achieved.

Abstract: A method of evaluating noise immunity of a semiconductor device is provided. An actual circuit including the semiconductor device is represented by an equivalent circuit which has a target equivalent circuit, a noise source equivalent circuit, and an external equivalent circuit connected in parallel. The target equivalent circuit represents the semiconductor device. The noise source equivalent circuit represents a noise source outside the semiconductor device, and supplies noise to the target equivalent circuit. The external equivalent circuit represents a circuit outside the semiconductor device. The noise immunity is evaluated based on a voltage or current which arises in the target equivalent circuit by the noise. In this way, the immunity of the semiconductor device against extraneous noise can be evaluated in consideration of the effects of the circuitry outside the semiconductor device.

Abstract: A CAD apparatus includes a determining unit for determining a component order in ascending order of impedance of components for passive components amongst components to be placed on a printed wiring board. The CAD apparatus places each passive component in the determined component order in a vicinity of power pins of non-passive components that are already placed.

Abstract: The power line carrier system provides with a filter in a power branch apparatus removable from an external power line. The filter passes a power line carrier signal in a signal mode for the external power line, and interrupts another power line carrier signal which is in a signal mode different from the mode for the external power line.

Abstract: A signal line, being in a six-layer board and connecting terminal 102 of component 101 with terminal 115 of component 114, requires tamper-resistance. The signal line is composed of foil 103 on an outside layer, a via 104, foil 111 on the third layer, via 105, foil 112 on the fourth layer, via 106, and foil 113 on the sixth layer. Portions of the signal line that exist on outside layers are all hidden under circuit components. Foil 103 and an end of via 104 are placed under component 101 on first layer 116, an end of via 105 is placed under component 107 on layer 116, an end of via 106 is placed under component 108 on layer 116, the other end of via 104 is placed under component 109 on sixth layer 121, the other end of via 105 is placed under component 110 on layer 121, and foil 113 and the other end of via 106 are placed under component 114 on layer 121.

Abstract: A bidirectional transmission circuit for inputting/outputting a signal from/onto a bidirectional transmission line includes: a transceiver for transmitting/receiving a signal; a first element having an impedance; a second element being a short line; and a switching unit for coupling the transceiver to the bidirectional transmission line via the first element when the transceiver transmits a signal, and coupling the transceiver to the bidirectional transmission line via the second element when the transceiver receives a signal.

Abstract: A net detecting unit detects a set of component terminal interconnection information showing a critical net from a component terminal interconnection information list. A conductor detecting unit detects a conductor corresponding to the critical net. A component detecting unit detects two components from the set of component terminal interconnection information. A terminal detecting unit detects a power and/or ground terminal of each of the detected components. A power/ground layer detecting unit detects at least one layer, among power and ground layers, to which the detected power and/or ground terminals are connected. A layer detecting unit specifies a layer, among the detected layers, that is nearest to a signal layer on which the conductor is placed. A prohibition area generating unit generates a via prohibition area on the specified layer. As a result, vias are placed on the specified layer, avoiding the via prohibition area.

Abstract: The power line carrier system provides with a filter in a power branch apparatus removable from an external power line. The filter passes a power line carrier signal in a signal mode for the external power line, and interrupts another power line carrier signal which is in a signal mode different from the mode for the external power line.

Abstract: A CAD apparatus includes a determining unit for determining a component order in ascending order of impedance of components for passive components amongst components to be placed on a printed wiring board. The CAD apparatus places each passive component in the determined component order in a vicinity of power pins of non-passive components that are already placed.

Abstract: A bidirectional transmission circuit for inputting/outputting a signal from/onto a bidirectional transmission line includes: a transceiver for transmitting/receiving a signal; a first element having an impedance; a second element being a short line; and a switching unit for coupling the transceiver to the bidirectional transmission line via the first element when the transceiver transmits a signal, and coupling the transceiver to the bidirectional transmission line via the second element when the transceiver receives a signal.

Abstract: A CAD apparatus includes a determining unit for determining a component order in ascending order of impedance of components for passive components amongst components to be placed on a printed wiring board. The CAD apparatus places each passive component in the determined component order in a vicinity of power pins of non-passive components that are already placed.

Abstract: A design aiding apparatus and a method, and a storage medium storing a design aiding program enable the efficient layout design of components in a multilayer wiring board formed by laminating a plurality of wiring layers. The design aiding apparatus includes (a) a first acquiring unit for acquiring information showing a first location in a lamination direction of the wiring layers, (b) a second acquiring unit for acquiring information showing a second location on a two-dimensional plane that is orthogonal to the lamination direction, and (c) a placement unit for generating information showing a space to be occupied when the component is placed in such a manner that a placement reference point of the component coincides with the second location that is on the two-dimensional plane including the first location. According to the above construction, the present invention is capable of aiding layout design of components in the wiring board.

Abstract: A method of evaluating noise immunity of a semiconductor device is provided. An actual circuit including the semiconductor device is represented by an equivalent circuit which has a target equivalent circuit, a noise source equivalent circuit, and an external equivalent circuit connected in parallel. The target equivalent circuit represents the semiconductor device. The noise source equivalent circuit represents a noise source outside the semiconductor device, and supplies noise to the target equivalent circuit. The external equivalent circuit represents a circuit outside the semiconductor device. The noise immunity is evaluated based on a voltage or current which arises in the target equivalent circuit by the noise. In this way, the immunity of the semiconductor device against extraneous noise can be evaluated in consideration of the effects of the circuitry outside the semiconductor device.

Abstract: A signal line, being in a six-layer board and connecting terminal 102 of component 101 with terminal 115 of component 114, requires tamper-resistance. The signal line is composed of foil 103 on an outside layer, a via 104, foil 111 on the third layer, via 105, foil 112 on the fourth layer, via 106, and foil 113 on the sixth layer. Portions of the signal line that exist on outside layers are all hidden under circuit components. Foil 103 and an end of via 104 are placed under component 101 on first layer 116, an end of via 105 is placed under component 107 on layer 116, an end of via 106 is placed under component 108 on layer 116, the other end of via 104 is placed under component 109 on sixth layer 121, the other end of via 105 is placed under component 110 on layer 121, and foil 113 and the other end of via 106 are placed under component 114 on layer 121.

Abstract: A design aiding apparatus and a method, and a storage medium storing a design aiding program enable the efficient layout design of components in a multilayer wiring board formed by laminating a plurality of wiring layers. The design aiding apparatus includes (a) a first acquiring unit for acquiring information showing a first location in a lamination direction of the wiring layers, (b) a second acquiring unit for acquiring information showing a second location on a two-dimensional plane that is orthogonal to the lamination direction, and (c) a placement unit for generating information showing a space to be occupied when the component is placed in such a manner that a placement reference point of the component coincides with the second location that is on the two-dimensional plane including the first location. According to the above construction, the present invention is capable of aiding layout design of components in the wiring board.

Abstract: The semiconductor package of this invention includes: a semiconductor element having a power supply terminal, a ground terminal, and an output terminal; an inductance; and a capacitance. One of opposing terminals of the capacitance is connected to the power supply terminal of the semiconductor element, and the other terminal is connected to the ground terminal of the semiconductor element. The ground terminal of the semiconductor element is connected to a ground terminal of the semiconductor package, the power supply terminal of the semiconductor element is connected to a power supply terminal of the semiconductor package via the inductance, and the output terminal of the semiconductor element is connected to an output terminal of the semiconductor package.

Abstract: A CAD apparatus includes a determining unit for determining a component order in ascending order of impedance of components for passive components amongst components to be placed on a printed wiring board. The CAD apparatus places each passive component in the determined component order in a vicinity of power pins of non-passive components that are already placed.