Abstract: Disclosed is a semiconductor package 3 including a socket 1 which is formed on the top surface 3a for enabling electrical conductivity and a connecting terminal 2 which is formed on the bottom surface 3b for enabling electrical conductivity. The socket 1a has a depressed shape, and a spiral contact 1 is formed in the depression 1c. An electronic circuit module is constructed by mounting and electrically connecting a semiconductor module wherein a plurality of semiconductor packages 3 is stacked on a circuit board. A circuit board with sockets is constructed by mounting a socket board on a circuit board.

Abstract: To provide a producing method of a spiral contact that exhibits, even in a hot environment, low permanent set in fatigue, excellent spring characteristic and excellent electrical conductivity. In the producing method in which atoms of a dissimilar metal are diffused and infiltrated into a surface layer of the spiral contact (7) by being heated in a state where the spiral contact (7) is brought into contact with the dissimilar metal, by heating titanium (or aluminum) deposited on the surface of the spiral contact, copper of a Cu substrate (1) and nickel which is a core material of the spiral contact (7), atoms of Ti (or Al) and atoms of Cu are diffused and infiltrated into the surface layer of the core material (Ni) to form alloys (7c) and (7d). The heating temperature is set such that a lower limit thereof is the temperature corresponding to 0.

Abstract: Disclosed is a semiconductor package 3 including a socket 1 which is formed on the top surface 3a for enabling electrical conductivity and a connecting terminal 2 which is formed on the bottom surface 3b for enabling electrical conductivity. The socket 1a has a depressed shape, and a spiral contact 1 is formed in the depression 1c. An electronic circuit module is constructed by mounting and electrically connecting a semiconductor module wherein a plurality of semiconductor packages 3 is stacked on a circuit board. A circuit board with sockets is constructed by mounting a socket board on a circuit board.

Abstract: A micro connector comprising an insulator holding a lever, a printed circuit board which has a plurality of micro contacting terminals at a back surface thereof and an FPC cable which has a plurality of micro contacting pieces in an end thereof, wherein said insulator guides said FPC cable.

Abstract: A micro connector comprising an insulator holding a lever, a printed circuit board which has a plurality of micro contacting terminals at a back surface thereof and an FPC cable which has a plurality of micro contacting pieces in an end thereof, wherein said insulator guides said FPC cable.

Abstract: The present invention relates to a terminal for a spiral contactor performing an electrical connection with an electronic component. The terminal is constituted including a peripheral frame and a contact portion contacting a connection end terminal. One end of the contact portion is fixed on the peripheral frame and the other end of the contact portion is provided spirally extended toward a center of an opening of the peripheral frame so as to universally move in a perpendicular direction for an opening face of the peripheral frame. And a thickness of the contact portion becomes thinner as the contact portion proceeds from one end toward the other end.

Abstract: The present invention relates to a terminal for a spiral contactor performing an electrical connection with an electronic component. The terminal is constituted including a peripheral frame and a contact portion contacting a connection end terminal. One end of the contact portion is fixed on the peripheral frame and the other end of the contact portion is provided spirally extended toward a center of an opening of the peripheral frame so as to universally move in a perpendicular direction for an opening face of the peripheral frame. And a thickness of the contact portion becomes thinner as the contact portion proceeds from one end toward the other end.

Abstract: A spiral contactor for establishing an electric connection with a semiconductor device or an electronic part including a solder ball includes a spiral probe having a spiral shape, as viewed from the top. The spiral probe is embedded in an insulating substrate in a manner that permits resilient deformation thereof in accordance with a shape of the solder ball. An edge of the spiral probe is pressed to engage the solder ball, and slides along a periphery of the solder ball, thereby cutting an oxide membrane thereon. The spiral contactor may be manufactured by combination of the photolithography technique and the plating process, and used for a semiconductor inspecting apparatus and an electronic part.

Abstract: To provide a spiral contactor 1 characterized as comprising of making an electrical connection with semiconductor devices or electronic parts having solder balls, and equipping with a spiral probe 2 having a spiral shape seen in top view to connect with raised solder balls as ductility in response to the shape of this spiral probe when connecting with this solder probe on the insulting substrate, A spiral contactor, a semiconductor inspection device (test socket, test board, Probe card) and electronic parts (mounting socket, mounting connector) which are capable for responding to from small semiconductor devices to packages, super smaller bear chips, moreover, to wafer also, forming carry-current circuits without causing a soft solder probe to deform or flaw, and capable for corresponding to densification of solder probes and realistic for reasonable price and high reliable inspection, can be provided.

Abstract: A spiral contactor for establishing an electric connection with a semiconductor device or an electronic part including a solder ball includes a spiral probe having a spiral shape as viewed from a top thereof. The spiral probe is embedded in an insulating substrate in a manner that permits resilient deformation thereof in accordance with a shape of the solder ball, and an edge of the spiral probe is pressed to engage into the solder ball and slides along a periphery of the solder ball, thereby cutting oxide membrane thereon. The spiral contactor may be manufactured by combination of the photolithography technique and the plating process, and used for a semiconductor inspecting apparatus and an electronic part.

Abstract: To provide a spiral contactor 1 characterized as comprising of making an electrical connection with semiconductor devices or electronic parts having solder balls, and equipping with a spiral probe 2 having a spiral shape seen in top view to connect with raised solder balls as ductility in response to the shape of this spiral probe when connecting with this solder probe on the insulting substrate, A spiral contactor, a semiconductor inspection device (test socket, test board, Probe card) and electronic parts (mounting socket, mounting connector) which are capable for responding to from small semiconductor devices to packages, super smaller bear chips, moreover, to wafer also, forming carry-current circuits without causing a soft solder probe to deform or flaw, and capable for corresponding to densification of solder probes and realistic for reasonable price and high reliable inspection, can be provided.

Abstract: A probe card including a plurality of probe blocks can be easily put together substantially in a lattice-like form, and four chips adjoining around the intersection portion of imaginary boundary lines intersecting at right angle each other form a cross-like shape to be tested simultaneously. A plurality of probe blocks with the first and second probe group including a plurality of probes are set up on a base plate substantially in the lattice-like form by a probe set-up means. The needle points of the first and second probe groups are respectively located across the imaginary line so as to oppose to each other. A probe blocks located around the lattice intersection portion are fitted to the base plate such that the needle point parts of the probes located in the vicinity of the lattice intersection portion are positioned on the same side with respect to their needle rear part.