Abstract: A holding device includes a supporter, a gripper, and a first driver. The supporter supports a weight of a workpiece in a first direction. The gripper includes a gripping surface that grips the workpiece in a second direction crossing the first direction. The first driver moves the supporter with respect to the gripper in the second direction. A tilt of the supporter is changeable with respect to the gripping surface along a plane including the first and second directions.

Abstract: According to one embodiment, a transfer apparatus includes a suction hand, a moving device, a first detector, and a controller. The suction hand includes a first and second suction units. The first and second suction units are configured to contact with an article in a first direction and a second direction, respectively. the first suction unit and the second suction unit each are provided multiply in a third direction. The controller performs at least a first operation and a second operation. In the first operation, the first suction units respectively suction first surfaces of the articles, the second suction units respectively suction second surfaces of the articles, and the articles are moved. In the second operation, one of the first suction units suctions the first surface of one of the articles, the second suction units do not suction the articles, and the one of the articles is moved.

Abstract: According to one embodiment, a hand includes a first holding unit, and a second holding unit. The first holding unit includes a plurality of first holding portions capable of holding an article. A plurality of the first holding units is provided in a second direction and is movable independently of each other in a first direction crossing the second direction. The second holding unit is movable in a third direction crossing a plane parallel to the first direction and the second direction. The second holding unit includes a plurality of second holding portions capable of holding the article.

Abstract: According to one embodiment, a holding device includes a first holder configured to hold an upper surface of an article, and a second holder configured to hold a side surface of the article. The holding device performs at least a first operation of the first and second holders holding the article, and a second operation of only the first holder holding the article.

Abstract: A holding device includes a supporter, a gripper, and a first driver. The supporter supports a weight of a workpiece in a first direction. The gripper includes a gripping surface that grips the workpiece in a second direction crossing the first direction. The first driver moves the supporter with respect to the gripper in the second direction. A tilt of the supporter is changeable with respect to the gripping surface along a plane including the first and second directions.

Abstract: According to one embodiment, a suction gripping device includes a pad mechanism mounted to a base. The pad mechanism includes a sliding part and a first guide. The sliding part includes a suction pad and a pipe and is slidable in a first direction with respect to the base. The suction pad attaches to a workpiece and is connected to the pipe at one end of the pipe. The first guide guides a sliding direction of the pipe to be in the first direction. The first guide is fixed with respect to the base. An attachment surface of the suction pad contacts a first surface of a workpiece and is tiltable due to a weight of the sliding part when gripping the workpiece. The first surface crosses a sliding direction of the sliding part.

Abstract: According to an embodiment, a surface treatment apparatus includes a surface treatment portion, a supporter, and a carrying portion. The surface treatment portion has a treatment surface. The supporter has a support surface facing a second surface opposite to the first surface of the work. A frictional coefficient of the second surface and the support surface is higher than a frictional coefficient of the first surface and the treatment surface. The carrying portion applies a load in a direction in which the support surface is relatively pressed on the treatment surface, moves the support surface in a carrying direction different from the direction of the load, and thereby moves the work in the carrying direction.

Abstract: The present invention provides a battery including a container, an electrode group including a positive electrode and a negative electrode, multiple current collecting tabs being extended from any one of the positive electrode and the negative electrode of the electrode group, and overlapped with one another; a lead bonded to at least one of the current collecting tabs by ultrasonic bonding, a lid configured to close an opening portion of the container, and an external terminal provided on the lid and connected to the at least one current collecting tab via the lead, in which the lead has a cross-sectional area that is increased in a middle of extension of the lead from an ultrasonic-bonded portion to the at least one of the current collecting tabs to the external terminal.

Abstract: According to an embodiment, a surface treatment apparatus includes a surface treatment portion, a supporter, and a carrying portion. The surface treatment portion has a treatment surface. The supporter has a support surface facing a second surface opposite to the first surface of the work. A frictional coefficient of the second surface and the support surface is higher than a frictional coefficient of the first surface and the treatment surface. The carrying portion applies a load in a direction in which the support surface is relatively pressed on the treatment surface, moves the support surface in a carrying direction different from the direction of the load, and thereby moves the work in the carrying direction.

Abstract: According to one embodiment, an assembly machine of a rotating electrical machine includes: a coil alignment portion that aligns coils, when aligning coils in a ring shape, such that one side of a circumferential direction in the ring is made to lay over a top surface side of an adjacent coil, and the other side of the circumferential direction of the coils is made to lay under a bottom surface side of an adjacent coil so as to form mutually overlapping regions in a thickness direction between the adjacent coils; an insertion part having columnar parts inserted into the interior of the mutually overlapping regions; and a pressing part which inserts the insertion part in an axial direction thereof, mutually overlapping in the thickness direction between the adjacent coils, from the insertion part into the interior of a slot in the core of the rotating electrical machine.

Abstract: The present invention provides a battery including a container, an electrode group including a positive electrode and a negative electrode, multiple current collecting tabs being extended from any one of the positive electrode and the negative electrode of the electrode group, and overlapped with one another; a lead bonded to at least one of the current collecting tabs by ultrasonic bonding, a lid configured to close an opening portion of the container, and an external terminal provided on the lid and connected to the at least one current collecting tab via the lead, in which the lead has a cross-sectional area that is increased in a middle of extension of the lead from an ultrasonic-bonded portion to the at least one of the current collecting tabs to the external terminal.

Abstract: A method for manufacturing an LED device, includes: mounting an LED chip, which emits a first light, on a bottom surface of a recess formed in an upper surface of a package, pouring a resin liquid containing phosphor particles, which emits a second light upon incidence of the first light, into the recess, fixing the package to a package fixing plate of an apparatus of the LED device, precipitating the phosphor particles in the resin liquid with a centrifugal force applying to the package in a direction from the upper surface to the lower surface of the package by rotating a rotary member with a rotary driving unit, and curing the resin liquid.

Abstract: A semiconductor package includes a plate-like semiconductor element having a first power terminal and a control terminal on a main surface, and a second power terminal on a rear surface; a first power electrode plate positioned to face with the main surface of the semiconductor element, and including a first power electrode joined to the first power terminal by soldering; a second power electrode plate positioned to face with the rear surface of the semiconductor element, and including a second power electrode joined to the second power terminal by soldering; and an insulating substrate positioned between the semiconductor element and the first electrode plate, and including a control electrode joined to the control terminal by soldering.

Abstract: An apparatus for manufacturing a semiconductor device comprises a planarization mechanism section which pressurizes a top of a bump that is provided onto at least one of a substrate and a semiconductor chip and makes the top of the bump flat, and a bonding mechanism section which bonds the substrate with the semiconductor chip via the bump whose top has been made flat by the planarization mechanism section. The planarization mechanism section has a bump recognition camera which takes an image of bumps, a planarization tool with a pressurizing surface which pressurizes the top of the bump, and a driving mechanism which controls to move the planarization tool to a position of the bump detected by the bump recognition camera, the driving mechanism comprising a pressurization mechanism which presses the pressurizing surface of the planarization tool against the bump.

Abstract: A method of bonding a semiconductor chip, including step of photographing a surface of a semiconductor chip, on which an electrode is formed, and detecting a relative position of the electrode with respect to the semiconductor chip, a bonding step of making the electrode of the semiconductor chip to face a circuit pattern provided on a substrate, and bonding the electrode to the circuit pattern, a step of photographing the substrate on which the semiconductor chip is formed, and detecting a relative position of the semiconductor chip with respect to the substrate. Also included is a step of evaluating a bonding accuracy by calculating a relative position of the electrode with respect to the substrate from the relative position of the semiconductor chip with respect to the substrate and the relative position of the electrode with respect to the semiconductor chip.