Abstract: Measurement/analysis unit in a Java virtual machine has the function of measuring data when an event of garbage collection occurs, and the function of periodically measuring data. The measurement/analysis unit analyzes the measured data and predicts a danger of a memory shortage, and predicts a danger using an algorithm depending on the type of garbage collection used by the Java virtual machine. An application server is notified of a warning of the predicted danger of a memory shortage by an analysis result notification means by an inter-process communication, or the like. The measurement/analysis unit calculates a memory capacity required to avoid the predicted danger of a memory shortage, and the calculated memory capacity is transmitted to the application server by the analysis result notification means by an inter-process communication, or the like in the same way as the warning.

Abstract: An intermediate substrate includes a substrate core formed by a main core body portion constructed of a sheet of polymer material and having a subsidiary core accommodation portion formed therein. A ceramic subsidiary core portion, which is constructed of a ceramic sheet, is accommodated in the subsidiary core accommodation portion and is of a thickness matching that of the main core body portion. A thin film capacitor is formed on a first main surface side of a plate-like base of the core portion and includes first and second thin film electrodes separated from each other by a thin film dielectric layer so as to provide direct current isolation between the electrodes. First and second direct current isolated terminals of a first terminal array are electrically connected to the first and second thin film electrodes.

Abstract: A capacitor includes a capacitor main body having a front surface on which a semiconductor device is to be mounted and a rear surface at which the capacitor main body is to be mounted on a first main surface of a circuit substrate, a plurality of internal electrodes disposed within the capacitor main body, and a plurality of via conductors penetrating the capacitor main body between the front surface and the rear surface and electrically connected to the internal electrodes, wherein the capacitor main body has a first dielectric layer located on a side of the capacitor main body closer to the front surface and a second dielectric layer located on a side of the first dielectric layer closer to the rear surface, the second dielectric layer having a higher thermal expansion coefficient and a higher dielectric constant than the first dielectric layer.

Abstract: A circuit board having a plurality of solder bumps is provided. The solder bumps are flattened and leveled at the tops so that the coplanarity of the solder bumps is 0.5 &mgr;m or less per 1 mm. The flattened and leveled tops of the solder bumps are formed by cold pressing, hot pressing or grinding. Method of forming such solder bumps and jigs used for carrying out such methods are also provided.

Abstract: A wiring board comprising: a metal core substrate shaped like a rectangle in plan view and having a front surface and a rear surface; and a buildup layer comprising an electrically insulating layer and a wiring layer, the buildup layer being formed on the front surface or the rear surface of the metal core substrate, wherein the metal core substrate has an extension formed on its side surface.

Abstract: A wiring substrate is configured such that a build-up layer is formed only on a front surface (a single side) of a core substrate and such that the distance between a semiconductor device mounted on the front surface thereof and an electronic component mounted on the back surface thereof or incorporated therein behind the back surface is reduced to thereby enhance electrical characteristics of an electrically continuous path therebetween, and whose overall strength is enhanced so as not to be prone to deflection or warpage. The wiring substrate includes a relatively thin first core substrate 2 having a front surface 3 and a back surface 4; a relatively thick second core substrate 6 superposed on the back surface 4 of the first core substrate 2 and having a through opening 9 formed therein, the first substrate 2 and the through opening 9 defining a recess 9; and a build-up layer BU formed on the front surface 3 of the first core substrate 2 and including wiring layers 16 and 25 and dielectric layers 23 and 26.

Abstract: A printed wiring board includes a core substrate including a laminated capacitor. The laminated capacitor includes a plurality of composite dielectric layers and a plurality of metal layers stacked alternately. Three types through-hole conductors are provided which extend between the upper and lower surfaces of the core substrate. The first through-hole conductors are directly connected to first metal layers serving one electrode of the laminated capacitor, the second through-hole conductors are directly connected to second metal layers serving the other electrode of the laminated capacitor, and the third through-hole conductors are not connected to any of the first and second metal layers. The first and second through-hole conductors are used for establishing electrical connections between power supply and ground lines and an IC chip mounted on the printed wiring board. The third through-hole conductor is used as a signal line.

Abstract: An electrode plate for display device includes a substrate and a multi-layered conductive film. The multi-layered conductive film includes a lower side amorphous oxide layer, a silver-based layer, and an upper side amorphous oxide layer. The lower side amorphous oxide layer and the upper side amorphous oxide layer are formed of an amorphous and amorphous-like material. The film thickness of the upper side amorphous oxide layer is not larger than 20 nm.

Abstract: A compile processing apparatus compiles a program formed of a plurality of classes having initializing procedures. The compile processing apparatus includes a specifying unit for specifying an initializing procedure when a statement to be compiled requires the initializing procedure, a determination unit for executing a determination process for determining whether the initializing procedure specified by the specifying unit can be considered to not affect other classes, and a changing unit for changing the statement so that the statement does not access the initializing procedure when the determination unit determines that the initializing procedure can be considered to not affect the other classes.

Abstract: An electrode plate for display device includes a substrate and a multi-layered conductive film. The multi-layered conductive film includes a lower side amorphous oxide layer, a silver-based layer, and an upper side amorphous oxide layer. The lower side amorphous oxide layer and the upper side amorphous oxide layer are formed of an amorphous and amorphous-like material. The film thickness of the upper side amorphous oxide layer is not larger than 20 nm.

Abstract: A printed wiring board includes a core substrate, one or more insulating resin layers laminated on at least one side of the core substrate, and a wiring layer formed at least between the core substrate and the insulating resin layer or between the insulating resin layers. The core substrate includes a composite dielectric layer that contains resin and a high-permittivity powder, and a plurality of metal layers disposed such that the composite dielectric layer is sandwiched therebetween. The composite dielectric layer and the metal layers constitute a laminated capacitor.

Abstract: A device which outputs initial values of a data statement corresponding to a source program that has been converted into an intermediate program. The intermediate program contains initial value data corresponding to the initial values of the data statement. A taking-out mechanism takes out the initial value data from the intermediate program. An initial value storing mechanism prepares an initial value storage table and sets the initial value data taken out by the taking-out mechanism in the initial value storage table. An object program output mechanism generates an object program based on the initial value data set in the initial value storage table. The initial value storing mechanism sets an iteration count of the initial values in the initial value storage table, and increases the iteration count in correspondence with the respective initial values so that the initial values can be stored in the initial value storage table.

Abstract: A multilayered conductive film has a silver-based layer formed of a silver-based metallic material. A first transparent oxide layer is provided on one surface of the silver-based layer, and a second transparent oxide layer is provided on the other surface of the silver-based layer. The first and second transparent oxide layers are independently formed of a compound oxide material of indium oxide with at least one secondary metal oxide whose metallic element has substantially no solid solubility in silver.

Abstract: In a substrate having built-in capacitor which is incorporated in and united with an insulator, the capacitor has a dielectric layer made of a silicon nitride-based ceramic containing silicon carbide in an amount of from 13 to 30% by weight.

Abstract: The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noises between the conductor poles. The conductor poles are received within holes in an insulating substrate. The insulating substrate has a laminated, multi-layer ceramic substrate structure comprising insulating plates having metallized layers thereon which constitute a portion of the walls of the holes. In addition, insulating layers for insulating the metallized layers from the conductor poles are formed within a selected number of the holes.

Abstract: The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noise between the conductor poles. The conductor poles are arranged within a selected number of holes in an insulating substrate. Metallized layers for shielding the conductor poles are provided on the walls of the holes in the insulating substrate which receive the conductor poles. In addition, an insulating layer is provided on the inner circumferences of the metallized layers, which insulating layers directly surround the conductor poles to preclude direct contact between the conductor poles and the metallized layers.

Abstract: A method of producing a sintered body by molding a mixture of a ceramic base powder, a sintering assistant powder and an organic binder and sintering the molded body in a non-oxidizing atmosphere is disclosed in which the ceramic base powder has such a particle size distribution that the amount of powder particles not greater than 1.0 .mu.m in size is not more than 15% by weight and the average particle diameter is not greater than 5 .mu.m. According to the method, therefore, sufficient passage of gas is secured in a degreasing step, resulting in an enhanced degreasing efficiency and exellent sintering properties. Where the sintering assistant powder has such a particle size distribution that the amount of powder particles not greater than 10 .mu.m in size is not more than 5% by weight, the amount of coarse powder is extremely small and, therefore, large voids are not formed.

Abstract: For use in a character display device, a modifying device comprises first and second memories. The first memory memorizes a character code representative of a character which should be displayed. The second memory memorizes an attribute or characteristic code and a selection code which cooperatively determine modification of the character. The character code, the attribute code and the selection code are read out of the first and the second memories by an address signal which is supplied from a supplying section. Responsive to the character code, a character pattern generating circuit generates a character pattern to supply the character pattern to first through N-th modifying circuits, where N represents a positive integer which is not less than two. Responsive to the attribute code, the first through the N-th modifying circuits modify the character pattern into first through N-th modification signals, respectively, to supply the first through the N-th modification signals to a selecting circuit.

Abstract: A multilayer ceramic wiring board including a ceramic board having a plurality of through-holes and formed by laminating three or more green sheets of a ceramic material and burning a laminate of the green sheets, and a plurality of conductors provided in the through-holes. Each of the conductors is formed of a ceramic material and a conductive material in combination. The ceramic board is composed of a pair of upper and lower layer portions each having at least an outermost surface layer and an inner layer portion disposed between the upper and lower portions. The conductors are composed of an outer conductor portion formed in the upper and lower layer portions and an inner conductor portion formed in the inner layer portion. The outer conductor portion has a content ratio of the ceramic material higher than that of the inner conductor portion.

Abstract: The invention relates to a ceramic heater element consisting of a sintered body of a silicon nitride base ceramic and a resistance heating wire such as a tungsten wire embedded in the ceramic body. The ceramic contains Al.sub.2 O.sub.3 and AlN besides Si.sub.3 N.sub.4 and is produced by using Y.sub.2 O.sub.3 as sintering aid. The ceramic body is improved in strength and also in stability of the ceramic structure at temperatures up to about 1300.degree. C. by rendering the grain boundary phase of the sintered ceramic a crystalline phase comprising either 2Y.sub.2 O.sub.3.Si.sub.2-x Al.sub.x N.sub.2-x O.sub.1-x (0.ltoreq.x<2) or 3Y.sub.2 O.sub.3.5Al.sub.2 O.sub.3. The heater element is produced by preparing a powder mixture in which (Si.sub.3 N.sub.4 +Al.sub.2 O.sub.3 +AlN) amounts to 90-98 wt %, the balance being the sintering aid, with proviso that (Al.sub.2 O.sub.3 +AlN)/Si.sub.3 N.sub.4 is from 0.02 to 0.08 by weight and that (Al.sub.2 O.sub.3 /AlN) is from 0.2 to 2.