Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.

Abstract: A flame-retardant thermoplastic resin composition comprising at least a plant-derived resin (A) and a flame retardant (B), wherein the weight proportions of the individual components in the flame-retardant thermoplastic resin composition are: 30?W1<55.5 44.5<X1?70 wherein W1 is the percentage by mass of the plant-derived resin (A) and X1 is the percentage by mass of the flame retardant (B), and 90% by mass or more of the flame retardant (B) is composed of a metal hydrate containing an alkali metal-based substance in an amount of 0.2% by mass or less.

Abstract: The present invention relates to an aliphatic polyester resin composition having excellent hydrolysis resistance, added to an aliphatic polyester resin (A), a reactive monomer (B) (e.g. a monocarbodiimide compound) and a reactive polymer (C) (e.g. a polycarbodiimide compound).

Abstract: Provided is a plant-derived resin composite material which has a sufficiently fast crystallization rate and excellent moldability and heat resistance by using a thermoplastic resin composition containing a plant-derived thermoplastic resin and an organic crystal nucleating agent which is composed of one or more low molecular weight compounds comprising at least two polar groups in the molecule, a spacing between any two of the polar groups being 34±4 angstroms.

Abstract: The present invention relates to a polylactic acid-modified polycarbodiimide compound which imparts hydrolysis resistance by formulation with a polylactic acid resin and also thereby improves mechanical property. The present invention also relates to a polylactic acid resin composition and a molded article comprising the same.

Abstract: A flame-retardant thermoplastic resin composition comprising at least a plant-derived resin (A) and a flame retardant (B), wherein the weight proportions of the individual components in the flame-retardant thermoplastic resin composition are: 30?W1<55.5 44.5<X1?70 wherein W1 is the percentage by mass of the plant-derived resin (A) and X1 is the percentage by mass of the flame retardant (B), and 90% by mass or more of the flame retardant (B) is composed of a metal hydrate containing an alkali metal-based substance in an amount of 0.2% by mass or less.

Abstract: In a semiconductor device (1), a package board (2) is provided in which a plurality of wiring layers are layered, a plurality of mounting pads (5) arranged in a matrix are provided to the uppermost wiring layer of the package board (2), and solder bumps (7) are connected to the mounting pads (5). A semiconductor chip (9) is mounted on the package board (2) via the solder bumps (7). The uppermost wiring layer of the package board (2) is formed from a resin material in which the Young's modulus is 1 GPa or lower when the temperature is 10 to 30° C., and the elongation at break is 50% or higher.

Abstract: In a semiconductor device, the topmost wiring layer of the package board is formed from an insulation material in which the elongation at break is 20% or higher and Young's modulus is 1 GPa or less when the temperature is 10 to 30° C. This insulation material contains a reactive elastomer that reacts with epoxy resin or an epoxy resin curing agent; an epoxy resin; an epoxy resin curing agent; and a crosslinked styrene-butadiene rubber having a double bond and a hydroxyl group, a carboxylic group, or another polar group. It is therefore possible to provide a semiconductor device that has a wiring board in which the connection reliability in relation to temperature cycles is high and the adhesiveness between the insulation layer and the electroless copper plating layer is also high.

Abstract: An epoxy resin composition which comprises an epoxy resin (A) and a curing agent (B) for epoxy resins, wherein the curing agent (B) for epoxy resins comprises a phenol-based resin (F) which contains at least either of a structural unit (X) represented by a given general formula obtained by reacting a biphenyl isomer or a mixture of biphenyl isomers with a phenol-based compound and a structural unit (Y) represented by a given general formula obtained by reacting a benzene isomer or a mixture of benzene isomers with a phenol-based compound, the sum of the number of repetitions of the structural unit (X) and that of the structural unit (Y) (n or m+m?) being larger than 10 and smaller than 75.

Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.

Abstract: A flame-retardant epoxy resin composition includes an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent as a phenolic resin (C) containing, in the molecular chain, structural units derived from a phenol (A) and structural units derived from an aromatic compound (B) other than the phenol (A), or the epoxy resin is a novolac epoxy resin CD) obtained by subjecting the phenolic hydroxyl groups of the phenolic resin (C) to etherification with glycidyl. The composition has a high degree of flame retardancy.

Abstract: A flame-retardant epoxy resin composition comprising an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent is a phenolic resin (C) containing, in the molecular chain, structural units derived from a phenol (A) and structural units derived from an aromatic compound (B) other than the phenol (A), or the epoxy resin is a novolac epoxy resin (D) obtained by subjecting the phenolic hydroxyl groups of the phenolic resin (C) to etherification with glycidyl. The composition has a high degree of flame retardancy.

Abstract: The present invention provides a flame retardant phenol resin material which includes a phenol condensate, wherein a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D), and also provides a flame retardant epoxy resin material which includes an epoxy resin obtained by glycidyl-etherification of at least a part of phenolic hydroxyl groups of a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D).

Abstract: The present invention provides a flame retardant phenol resin material which includes a phenol condensate, wherein a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D), and also provides a flame retardant epoxy resin material which includes an epoxy resin obtained by glycidyl-etherification of at least a part of phenolic hydroxyl groups of a poly-aromatic compound obtained by a reaction of phenols (A) to aromatics (B) except for phenols and a heterocyclic compound (C) including nitrogen as heteroatom are condensed via aldehydes (D).

Abstract: The present invention provides an epoxy resin composition for encapsulating a semiconductor, which has excellent flame retardancy without containing any flame retardant such as halogen type, antimony trioxide or the like. The present invention lies in an epoxy resin composition for encapsulating a semiconductor, comprising as essential components: (A) a phenolic resin containing, in the total phenolic resin amount, 30 to 100% by weight of a phenolic resin of novolac structure containing, in the molecule, a biphenyl derivative and/or a naphthalene derivative, (B) an epoxy resin containing, in the total epoxy resin amount, 30 to 100% by weight of an epoxy resin of novolac structure containing, in the molecule, a biphenyl derivative and/or a naphthalene derivative, (C) an inorganic filler, and (D) a curing accelerator.