Abstract: A multilayer ceramic capacitor includes an element body which is constituted by dielectric layers stacked alternately with internal electrode layers having different polarities and whose shape is roughly a rectangular solid having a pair of principle faces, a pair of end faces, and a pair of side faces, wherein the multilayer ceramic capacitor is such that the pair of side faces of the element body has a pair of side margins whose thickness is 30 ?m or less, and external electrodes are formed on the pair of end faces, and at least one of the pair of principle faces, of the element body. Despite the multilayer ceramic capacitor whose side margins are as thin as 30 ?m or less, leak current can be suppressed.

Abstract: A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities and which has a pair of principle faces, a pair of end faces, and a pair of side faces, wherein the multilayer ceramic capacitor is such that: external electrodes are formed on the pair of end faces and one principle face of the element body; and on a cross section taken in parallel with one end face of the multilayer ceramic capacitor near the end face, the ratio of area A constituted by the internal electrode layers connected to the external electrode on this end face side and the dielectric layers present between the internal electrode layers, and area B covering the part of the section excluding the external electrodes, A/B, is 0.75 or more.

Abstract: A multilayer ceramic capacitor includes ceramic grains forming a dielectric layer of the multilayer ceramic capacitor, which ceramic grains contain a coarse ceramic grain SPr having a coarse grain size Dcoa that satisfies the condition of Tmin ?Dcoa ?Tmax where Tmax is the maximum thickness of the dielectric layer and Tmin is the minimum thickness of the dielectric layer. The multilayer ceramic capacitor is capable of inhibiting deterioration of capacitance and capacity-temperature characteristics even when the internal electrode layer is made thin.

Abstract: A multilayer capacitor has dielectric layers and multiple internal electrode layers. The laminate includes a stack of multiple dielectric layers made of dielectric material and has a first principal face and a second principal face on the opposite side of the first principal face. In an embodiment, the multiple internal electrode layers have Ni as a primary component, contain at least one metal element selected from Pt, Ru, Rh, Re, Ir, Os, and Pd, and are arranged in parallel with the first principal face and second principal face inside the laminate in such a way that they alternate from the opposing sides with the dielectric layers placed in between, wherein each of the internal electrode layer closest to the first principal face and the internal electrode layer closest to the second principal face has a distance of 30 ?m or less from the corresponding principal face.

Abstract: A multilayer ceramic capacitor has a laminate including dielectric layers laminated alternately with internal electrode layers of different polarities, wherein the dielectric layer contains ceramic grains having Ba, Ti, and X (wherein X represents at least one type of element selected from the group consisting of Mo, Ta, Nb, and W) and a variation in the concentration distribution of X above in the ceramic grain is within ±5%. The multilayer ceramic capacitor can offer excellent service life characteristics even when the thickness of the dielectric layer is 0.8 ?m or less, as well as excellent bias characteristics.

Abstract: A laminated ceramic electronic component has electrode layers stacked with ceramic layers, where the thickness of each electrode layer is controlled to 0.5 ?m or less and the average size of crystal grains constituting the electrode layer is controlled to 0.1 ?m or less. The occurrence of structural defects in the laminated ceramic electronic component can be suppressed and high continuity of the electrode layers stacked with the ceramic layers is ensured.

Abstract: A dielectric ceramic whose primary component is an ABO3 compound (A contains Ba and B contains Ti) has a per-layer thickness of approx. 0.5 ?m or less, where the volume ratio to all dielectric sintered grains of those whose grain size is in a range of 0.02 ?m to 0.15 ?m is adjusted to a grain size distribution of 1% to 10%. High dielectric constant and high reliability can be achieved at the same time with the dielectric ceramic.

Abstract: A multilayer ceramic capacitor includes ceramic grains forming a dielectric layer of the multilayer ceramic capacitor, which ceramic grains contain a coarse ceramic grain SPr having a coarse grain size Dcoa that satisfies the condition of Tmin Dcoa Tmax where Tmax is the maximum thickness of the dielectric layer and Tmin is the minimum thickness of the dielectric layer. The multilayer ceramic capacitor is capable of inhibiting deterioration of capacitance and capacity-temperature characteristics even when the internal electrode layer is made thin.

Abstract: A laminated ceramic electronic component has electrode layers stacked with ceramic layers, where the thickness of each electrode layer is controlled to 0.5 ?m or less and the average size of crystal grains constituting the electrode layer is controlled to 0.1 ?m or less. The occurrence of structural defects in the laminated ceramic electronic component can be suppressed and high continuity of the electrode layers stacked with the ceramic layers is ensured.

Abstract: A dielectric ceramic whose primary component is an ABO3 compound (A contains Ba and B contains Ti) has a per-layer thickness of approx. 0.5 ?m or less, where the volume ratio to all dielectric sintered grains of those whose grain size is in a range of 0.02 ?m to 0.15 ?m is adjusted to a grain size distribution of 1% to 10%. High dielectric constant and high reliability can be achieved at the same time with the dielectric ceramic.

Abstract: There is provided a piezoelectric transformer capable of not only operating at low frequencies and realizing the reduction in size but also decreasing the required mounting area and improving the productivity. Lead wires (18), (20) and (22) are respectively connected to external electrodes (14), (14) and (16) with a conductive resin, and the primary-side end of a baked piezoelectric element (12) is attached to a fixing resin (24) with an adhesive (26). In this condition, the application of a driving voltage to the lead wires (18) and (20) connected to the external electrodes (14) produces mechanical vibrations in the primary side due to an electro-mechanical coupling action of the baked piezoelectric element (12). When these mechanical vibrations are transmitted to the secondary side, an output voltage is generated due to a mechano-electrical coupling action and it is delivered from the lead wire (22) connected to the secondary-side external electrode (16).