Abstract: A reflector for lighting has shape holding property, flexibility and lightweight property. That is, a reflector for lighting includes: a reflective material made of a polymer membrane of which an average reflectance of 400 to 700 nm wavelength of at least one surface side is 85% or more and having a ridge-shaped uneven shape; and a reinforcing material having flexibility, and the reinforcing material connects the bottom parts of concave parts with each other from the back side of the one surface side of the reflective material to reinforce the uneven shape.

Abstract: The present invention provides a method for alkaline saponification of a polymer film, comprising the steps of: alkaline saponification of the polymer film with an alkaline solution; and washing away the alkaline solution from the alkali-saponified polymer film, wherein the washing step includes a plurality of water-washing steps of washing the alkaline solution coated on the polymer film away using washing water, along the travel direction of the polymer film, and the used washing water is reused in order to perform alkaline saponification of a polymer film which allow efficient use of washing water and realize low cost and low environmental load while maintaining quality stability.

Abstract: An article support having a mount section comprising: a first engaging element (18) that has a pillar protruding from a base and a first hook extending from the pillar so that it can be displaced elastically; and a second engaging element that has a pillar protruding from the base and a second hook extending from the pillar so that it can be displaced elastically. The first hook and the second hook can be displaced elastically independently of each other and are disposed on the sides opposite to each other with respect to the pillars and. When the mount section is attached to an object, the pillar of the first engaging element bears a load on the object and the first hook and the second hook are engaged with the object to fixedly hold the article support on the object.

Abstract: It is an object of the present invention to provide a reflector for lighting which has shape holding property, flexibility and lightweight property. That is, a reflector for lighting of the present invention comprises: a reflective material 1 made of a polymer membrane of which an average reflectance of 400 to 700 nm wavelength of at least one surface side is 85% or more and having a ridge-shaped uneven shape; and a reinforcing material having flexibility, and the reinforcing material connects the bottom parts of concave parts with each other from the back side of the one surface side of the reflective material 1 to reinforce the uneven shape.

Abstract: The present invention provides a method for alkaline saponification of a polymer film, comprising the steps of: alkaline saponification of the polymer film with an alkaline solution; and washing away the alkaline solution from the alkali-saponified polymer film, wherein the washing step includes a plurality of water-washing steps of washing the alkaline solution coated on the polymer film away using washing water, along the travel direction of the polymer film, and the used washing water is reused in order to perform alkaline saponification of a polymer film which allow efficient use of washing water and realize low cost and low environmental load while maintaining quality stability.

Abstract: An electronic apparatus has a wiring board and connector units which are mounted at a case unit. The connector unit has an external connection surface connected with the external and a terminal installation surface, which is substantially flat and positioned at an opposite side to the external connection surface. A terminal of the connector unit is electrically connected with a pad positioned at a first surface of the wiring board via a connection member. The wiring board and the connector unit which are integrated are mounted at the case unit, with the first surface and the terminal installation surface facing the case unit. The case unit has an installation surface at which a recess for accommodating therein the connection member is arranged.

Abstract: A semiconductor device includes: first to fourth vertical type semiconductor elements having first and second electrodes; a metallic lead; a resin mold; a circuit board; an electric circuit on the circuit board; and an electronic chip on the circuit board. The electronic chip drives and controls each semiconductor element through the electric circuit. The first to fourth semiconductor elements are arranged to be a stack construction in the resin mold. The first to fourth semiconductor elements provide a H-bridge circuit. Each of the first and second electrodes in each semiconductor element is directly connected to the metallic lead so that heat generated in the semiconductor element is radiated through the metallic lead.

Abstract: An electronic apparatus has a wiring board and connector units which are mounted at a case unit. The connector unit has an external connection surface connected with the external and a terminal installation surface, which is substantially flat and positioned at an opposite side to the external connection surface. A terminal of the connector unit is electrically connected with a pad positioned at a first surface of the wiring board via a connection member. The wiring board and the connector unit which are integrated are mounted at the case unit, with the first surface and the terminal installation surface facing the case unit. The case unit has an installation surface at which a recess for accommodating therein the connection member is arranged.

Abstract: An information providing system comprises a two-dimensional encoding section which converts at least the information to be provided to the user into two-dimensional codes, a printed sheet producing section which prints the two-dimensional codes on paper, an image reading device which optically reads the two-dimensional codes printed on the paper, and a CPU which restoring the information to be provided to the user based on the two-dimensional codes read by the image reading device.

Abstract: Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts and the bonding wires are covered with an enclosing member on every ceramic substrate, and an inside of the enclosing member is filled with silicone gel for sealing. The ceramic substrates are bonded to a radiation fin together, and are mounted on a motherboard perpendicularly to the motherboard.

Abstract: A hybrid printing apparatus and related control method have a first print section 1a composed of a plurality of printing machines located in parallel to one another, and a second print section 1b composed of one printing machine and connected to the first print section, via a print medium transfer section 1c having a transfer passage 31 composed of discrete passage components which include change-over rollers 32 to change over start/stop operations in transfer of print media and medium detection sensors 33 to detect leading edges of the print media discharged from the respective printing machines of the first print section 1a, respectively. A control section 1d controls timings at which the change-over rollers 32 are changed over, so as to sequentially transfer the printing media from the first section 1a to the second print section 1b in response to detection signals from the medium detection sensors 33.

Abstract: A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the pads. The thickness of the Au plating layer that is bonded with the Al wiring is less than 0.5 &mgr;m. Thickness of the Au plating layer that is bonded with the Au wiring is 0.05 &mgr;m or more.

Abstract: At the step of printing a wiring portion of a ceramic substrate with a conductive adhesive for mounting an IC chip or a part such as a capacitor other than the IC chip, a wire bonding pad made of gold is formed by the ball bonding method or the like at the portion of the wiring portion to be wire-bonded. After the pad was formed and before the conductive adhesive is printed, a heat treatment is performed to cause a thermal diffusion between the wiring portion and the pad to improve the jointability therebetween.

Abstract: A hybrid printing apparatus and related control method have a first print section 1a composed of a plurality of printing machines located in parallel to one another, and a second print section 1b composed of one printing machine and connected to the first print section, via a print medium transfer section 1c having a transfer passage 31 composed of discrete passage components which include change-over rollers 32 to change over start/stop operations in transfer of print media and medium detection sensors 33 to detect leading edges of the print media discharged from the respective printing machines of the first print section 1a, respectively. A control section 1d controls timings at which the change-over rollers 32 are changed over, so as to sequentially transfer the printing media from the first section 1a to the second print section 1b in response to detection signals from the medium detection sensors 33.

Abstract: A stencil printer includes a printing drum which is rotated bearing a stencil wound around the printing drum, a pair of paper feed rollers which are rotated in contact with each other to supply a printing paper to the printing drum, and a press roller which is rotated in contact with the printing drum to convey the printing paper supplied to the printing drum with the printing paper pressed against the stencil on the printing drum. A paper feed roller driver drives the paper feed rollers, and a paper feed roller controller controls the paper feed roller driver to rotate the paper feed rollers at a peripheral speed higher than that of the printing drum at least from the time the leading end of the printing paper reaches the printing drum to the time the trailing end of the printing paper passes the paper feed rollers.

Abstract: A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the pads. The thickness of the Au plating layer that is bonded with the Al wiring is less than 0.5 &mgr;m. Thickness of the Au plating layer that is bonded with the Au wiring is 0.05 &mgr;m or more.

Abstract: Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts and the bonding wires are covered with an enclosing member on every ceramic substrate, and an inside of the enclosing member is filled with silicone gel for sealing. The ceramic substrates are bonded to a radiation fin together, and are mounted on a motherboard perpendicularly to the motherboard.

Abstract: A stencil printer includes a printing drum which is rotated bearing a stencil wound around the printing drum, a pair of paper feed rollers which are rotated in contact with each other to supply a printing paper to the printing drum, and a press roller which is rotated in contact with the printing drum to convey the printing paper supplied to the printing drum with the printing paper pressed against the stencil on the printing drum. A paper feed roller driver drives the paper feed rollers, and a paper feed roller controller controls the paper feed roller driver to rotate the paper feed rollers at a peripheral speed higher than that of the printing drum at least from the time the leading end of the printing paper reaches the printing drum to the time the trailing end of the printing paper passes the paper feed rollers.

Abstract: At the step of printing a wiring portion of a ceramic substrate with a conductive adhesive for mounting an IC chip or a part such as a capacitor other than the IC chip, a wire bonding pad made of gold is formed by the ball bonding method or the like at the portion of the wiring portion to be wire-bonded. After the pad was formed and before the conductive adhesive is printed, a heat treatment is performed to cause a thermal diffusion between the wiring portion and the pad to improve the jointability therebetween.

Abstract: The present invention relates to a polyester product excellent in resilient elasticity, shape retainability and shape stability, and a process for producing the same. The invention provides a polyester product with high resilient elasticity, shape retainability, and shape stability, which is produced by heat-treating a product comprising polyester fibers or a film prepared by taking up a molten polyester at a take-up speed of 2000 m/min to 4000 m/min, in wet heat and/or dry heat at not lower than 120° C. with the product maintained in a loose or constrained condition without being drawn. The product is very suitable, for example, as a collar interlining cloth of a shirt, a base fabric of a shirt, or a fabric of a lady's dress, etc.