Abstract: The present invention relates to a stacked piezoelectric ceramic element and can provide a stacked piezoelectric ceramic element produced by stacking two or more ceramic green sheets, the stacked piezoelectric ceramic element having a structure in which a ceramic porous or defective part constituting the stacked piezoelectric ceramic element is impregnated with an organic resin, thereby improving waterproof performance capable of preventing the deterioration of insulation resistance in a highly humid environment.

Abstract: The present invention relates to a stacked piezoelectric ceramic element and can provide a stacked piezoelectric ceramic element produced by stacking two or more ceramic green sheets, the stacked piezoelectric ceramic element having a structure in which a ceramic porous or defective part constituting the stacked piezoelectric ceramic element is impregnated with an organic resin, thereby improving waterproof performance capable of preventing the deterioration of insulation resistance in a highly humid environment.

Abstract: A vibration module based on a piezoelectric device includes: a piezoelectric device; a vibration plate connected to one side of the piezoelectric device by a medium of an adhesive and an intermediate material; the intermediate material interposed between the piezoelectric device and the vibration plate; and a molding part formed on the side of the piezoelectric device where the intermediate material is not formed.

Abstract: A vibration module based on a piezoelectric device includes: a piezoelectric device; a vibration plate connected to one side of the piezoelectric device by a medium of an adhesive and an intermediate material; the intermediate material interposed between the piezoelectric device and the vibration plate; and a molding part formed on the side of the piezoelectric device where the intermediate material is not formed.

Abstract: A stacked piezoelectric speaker device having a structure where a piezoelectric ceramic plate and an internal electrode plate are stacked, in which an inactive dummy electrode is disposed around an active internal electrode on the same layer to ensure uniform plastic shrinkage. The stacked piezoelectric speaker device has a structure in which an inactive dummy electrode that does not contribute to polarization is disposed around an active internal electrode that contributes to the polarization, the active internal electrode and the inactive dummy electrode being stacked on the same layer.

Abstract: Disclosed is a laminated inductor that has good direct current superimposition characteristics, does not cause a variation in temperature characteristics, suppresses the occurrence of delamination, and can be stably manufactured. Also disclosed are a method for manufacturing the laminated inductor and a laminated choke coil. A laminated inductor (10) for use as a choke coil in a power supply circuit includes a rectangular parallelepiped-shaped laminated chip (1) and at least one pair of external electrodes (8) that are provided at the end of the laminated chip (1) and are conductively connected to the end of a coil. The laminated chip (1) includes a plurality of magnetic material layers (3) formed of an Ni—Zn—Cu ferrite, a plurality of conductive layers (2), which are laminated through the magnetic material layers (3) to constitute a coil, and at least one nonmagnetic layer (4) formed of a Ti—Ni—Cu—Mn—Zr—Ag-base dielectric material and formed in contact with a plurality of the magnetic material layers (3).

Abstract: Disclosed is a laminated inductor that has good direct current superimposition characteristics, does not cause a variation in temperature characteristics, suppresses the occurrence of delamination, and can be stably manufactured. Also disclosed are a method for manufacturing the laminated inductor and a laminated choke coil. A laminated inductor (10) for use as a choke coil in a power supply circuit includes a rectangular parallelepiped-shaped laminated chip (1) and at least one pair of external electrodes (8) that are provided at the end of the laminated chip (1) and are conductively connected to the end of a coil. The laminated chip (1) includes a plurality of magnetic material layers (3) formed of an Ni—Zn—Cu ferrite, a plurality of conductive layers (2), which are laminated through the magnetic material layers (3) to constitute a coil, and at least one nonmagnetic layer (4) formed of a Ti—Ni—Cu—Mn—Zr—Ag-base dielectric material and formed in contact with a plurality of the magnetic material layers (3).