Patents by Inventor Yukihiro Onodera

Yukihiro Onodera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CAPACITIVE TOUCH PANEL
    Publication number: 20160202801
    Abstract: Thickness and weight are lowered while reducing warping and guaranteeing visibility of the screen. Included are a transparent panel substrate including a transparent resin base and a transparent resin layer formed on one surface of the transparent resin base; a decorative printing layer formed at an outer edge of a back surface of the transparent panel substrate; a warping prevention layer, formed to be flat and to cover the back surface of the transparent panel substrate inside the decorative printing layer and a back surface of the decorative printing layer; a transparent electrode layer formed on a back surface of the warping prevention layer; a jumper wiring layer formed on the transparent electrode layer and provided with an insulating layer; and a transparent protective layer formed on and entirely covering the jumper wiring layer except for a thermocompression bonding region of a substrate for external connection.
    Type: Application
    Filed: September 4, 2014
    Publication date: July 14, 2016
    Applicant: Dexerials Corporation
    Inventors: Hirokazu ODAGIRI, Yukio MURAKAMI, Yoshiaki IMAMURA, Yukihiro ONODERA, Masato ISHIGAKI, Makoto INOUE
  • Glass substrate and glass cutting method
    Patent number: 7479319
    Abstract: A glass substrate excellent in strength properties and a glass cutting method are provided. When a glass substrate having predetermined size is to be formed by cutting a glass plate, any crack or chip is not generated on a cut face. Therefore, a pulverized powder is prevented from being generated from this portion. A glass substrate is obtained by cutting at least with laser light radiation so that a surface roughness of cut side faces and of the glass substrate are 50 nm or less and a depth of laser marks and on the cut side faces are 0.06 mm or more.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: January 20, 2009
    Assignee: Sony Corporation
    Inventors: Tomio Hirano, Nobuyuki Oikawa, Makio Onodera, Masao Ono, Hideki Sato, Yukihiro Onodera
  • Glass substrate and glass cutting method
    Publication number: 20040086688
    Abstract: A glass substrate excellent in strength properties and a glass cutting method are provided. When a glass substrate having predetermined size is to be formed by cutting a glass plate, any crack or chip is not generated on a cut face. Therefore, a pulverized powder is prevented from being generated from this portion. A glass substrate is obtained by cutting at least with laser light radiation so that a surface roughness of cut side faces and of the glass substrate are 50 nm or less and a depth of laser marks and on the cut side faces are 0.06 mm or more.
    Type: Application
    Filed: July 18, 2003
    Publication date: May 6, 2004
    Applicant: Sony Corporation
    Inventors: Tomio Hirano, Nobuyuki Oikawa, Makio Onodera, Masao Ono, Hideki Sato, Yukihiro Onodera