Abstract: A method for manufacturing a light emitting device includes providing a frame having a through hole extending from a frame upper surface to a frame lower surface in a height direction. The frame has a communication path extending from a frame outer lateral surface to a frame inner lateral surface on the frame lower surface. A support body is provided on the frame lower surface. A light emitting element is provided on a support body upper surface in the through hole. Resin is injected into the through hole via the communication path to provide a covering member in the through hole such that at least a part of an element upper surface of the light emitting element is exposed from the covering member. A light-transmissive member is provided on the element upper surface and the covering member. The support body is removed.

Abstract: A soluble member is provided on a light emitting surface of a light emitting element. The soluble member is soluble in a solvent. The soluble member has a first surface facing the light emitting surface, a second surface opposite to the first surface in the light emitting direction, and a soluble member outer peripheral side surface provided between the first surface and the second surface. A light-blocking member made of a material which is not soluble in the solvent is provided to cover a light emitting element outer peripheral side surface and the soluble member outer peripheral side surface so that an inner side wall of the light-blocking member contacts the soluble member outer peripheral side surface. The soluble member is removed using the solvent to provide a recess surrounded by the inner side wall of the light-blocking member. A first light-transmissive member is provided in the recess.

Abstract: A method for manufacturing a light emitting device includes providing a frame having a through hole extending from a frame upper surface to a frame lower surface in a height direction. The frame has a communication path extending from a frame outer lateral surface to a frame inner lateral surface on the frame lower surface. A support body is provided on the frame lower surface. A light emitting element is provided on a support body upper surface in the through hole. Resin is injected into the through hole via the communication path to provide a covering member in the through hole such that at least a part of an element upper surface of the light emitting element is exposed from the covering member. A light-transmissive member is provided on the element upper surface and the covering member. The support body is removed.

Abstract: A light emitting device includes a light emitting element, a frame, a first light-transmissive member, and a second light-transmissive member. The light emitting element includes an element upper surface from which a light is configured to be emitted, an element bottom surface opposite to the element upper surface, and an element lateral surface connecting the element upper surface and the element bottom surface. The frame is provided to surround the light emitting element to be opposite to the element lateral surface. The first light-transmissive member is provided on the element upper surface and the element lateral surface to contact the frame. The first light-transmissive member covers the element upper surface and the element lateral surface. The second light-transmissive member is provided on the first light-transmissive member.

Abstract: A carrier tape is provided from which LEDs can be easily picked up. A carrier tape for accommodating an LED includes a sheet defining recessed embossed portions that can accommodate the LED. The embossed portion is formed to accommodate the LED which includes a light emitting portion having light-transmissive resin and arranged on its lateral surface as viewed in plan view. The embossed portion includes a protruding part that is arranged on one of the interior surfaces of the recessed embossed portion and can face the light emitting portion of the LED. Depressed parts are provided on the both sides of the protruding part so that the depressed surfaces can be spaced away from the LED when the LED is accommodated in the embossed portion. The width of the protruding part is smaller than the width of the light emitting portion of the LED as viewed in plan view.

Abstract: A light emitting device includes a light emitting element, a frame, a first light-transmissive member, and a second light-transmissive member. The light emitting element includes an element upper surface from which a light is configured to be emitted, an element bottom surface opposite to the element upper surface, and an element lateral surface connecting the element upper surface and the element bottom surface. The frame is provided to surround the light emitting element to be opposite to the element lateral surface. The first light-transmissive member is provided on the element upper surface and the element lateral surface to contact the frame. The first light-transmissive member covers the element upper surface and the element lateral surface. The second light-transmissive member is provided on the first light-transmissive member.

Abstract: A method for manufacturing a light emitting device includes: mounting a light emitting element on the support body upper surface such that a light emitting element lower surface of light emitting element is opposite to the support body upper surface in a height direction, a frame and the light emitting element being mounted such that the light emitting element is located in an opening of the frame; injecting a resin into an inner space provided between the frame and the light emitting element through an inlet to form a covering member which covers the light emitting element such that at least a part of a light emitting element upper surface is exposed, the inlet connecting the inner space and an outer space opposite to the inner space with respect to the frame wall; and providing a light-transmissive member on the light emitting element.

Abstract: A soluble member is provided on a light emitting surface of a light emitting element. The soluble member is soluble in a solvent. The soluble member has a first surface facing the light emitting surface, a second surface opposite to the first surface in the light emitting direction, and a soluble member outer peripheral side surface provided between the first surface and the second surface. A light-blocking member made of a material which is not soluble in the solvent is provided to cover a light emitting element outer peripheral side surface and the soluble member outer peripheral side surface so that an inner side wall of the light-blocking member contacts the soluble member outer peripheral side surface. The soluble member is removed using the solvent to provide a recess surrounded by the inner side wall of the light-blocking member. A first light-transmissive member is provided in the recess.

Abstract: A method for manufacturing a light emitting device includes: mounting a light emitting element on the support body upper surface such that a light emitting element lower surface of light emitting element is opposite to the support body upper surface in a height direction, a frame and the light emitting element being mounted such that the light emitting element is located in an opening of the frame; injecting a resin into an inner space provided between the frame and the light emitting element through an inlet to form a covering member which covers the light emitting element such that at least a part of a light emitting element upper surface is exposed, the inlet connecting the inner space and an outer space opposite to the inner space with respect to the frame wall; and providing a light-transmissive member on the light emitting element.

Abstract: A carrier tape is provided from which LEDs can be easily picked up. A carrier tape for accommodating an LED includes a sheet defining recessed embossed portions that can accommodate the LED. The embossed portion is formed to accommodate the LED which includes a light emitting portion having light-transmissive resin and arranged on its lateral surface as viewed in plan view. The embossed portion includes a protruding part that is arranged on one of the interior surfaces of the recessed embossed portion and can face the light emitting portion of the LED. Depressed parts are provided on the both sides of the protruding part so that the depressed surfaces can be spaced away from the LED when the LED is accommodated in the embossed portion. The width of the protruding part is smaller than the width of the light emitting portion of the LED as viewed in plan view.