Patents by Inventor Yukihiro SHIMADA

Yukihiro SHIMADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120247236
    Abstract: A sensor with aging function is provided wherein installation space for an apparatus to perform an aging process and the number of apparatuses can be reduced which enables easy and reliable aging processes and can improve measuring accuracy and enhance measuring reliability of the sensor. The sensor with aging function 10 is attached, through a bonding agent 15, to a high temperature measuring object 14, comprising a block body 12 constructed by integrally forming a sensor main body 11 and an electric heater 13 disposed in a manner to be close to the sensor main body 11 using a molding process, wherein a bonding surface on which the bonding agent 15 is applied is formed on the measuring object 14 side of the block body 12.
    Type: Application
    Filed: December 9, 2011
    Publication date: October 4, 2012
    Applicants: JAPAN ATOMIC ENERGY AGENCY, KUMAGAI GUMI CO., LTD.
    Inventors: Hisayoshi ISHIBASHI, Hirokazu SUZUKI, Akihiko NISHIMURA, Yukihiro SHIMADA
  • Publication number: 20120247237
    Abstract: A sensor and bonding agent for the sensor wherein thickness of the bonding agent interposed between the sensor and measuring object can be kept uniform to maintain uniform bonding force of the bonding agent and a peeling phenomenon of the bonding agent occurring due to a difference in thermal expansion between the measuring object and bonding agent and/or between the bonding agent and the sensor can be prevented. The sensor is attached, through the bonding agent, to a high-temperature measuring object, include a sensor main body having a detecting section, a block body constructed by integrally forming the sensor main body using a molding process. The block body is made of a ceramic-based bonding material that the same as a material forming the bonding agent and, on a side of the measuring object of the block body, a bonding surface of the bonding agent is formed.
    Type: Application
    Filed: December 9, 2011
    Publication date: October 4, 2012
    Applicants: JAPAN ATOMIC ENERGY AGENCY, KUMAGAI GUMI CO., LTD
    Inventors: Hisayoshi ISHIBASHI, Hirokazu SUZUKI, Akihiko NISHIMURA, Yukihiro SHIMADA