Abstract: The invention provides a dielectric substrate; a ground conductor pattern is formed on one surface of the dielectric substrate and which has a ground conductor pattern omission portion; a strip conductor pattern formed on a surface of the dielectric substrate opposite to the surface having the ground conductor pattern; a conductor pattern for shorting of a waveguide formed so as to be continuously connected to the strip conductor pattern; connecting conductors for connecting the ground conductor pattern and the conductor pattern to each other within the dielectric substrate; and a waveguide connected to the dielectric substrate so as to correspond to the ground conductor pattern omission portion. Also, a microstrip line is constituted by the strip conductor pattern, the ground conductor pattern, and the dielectric substrate. Further, a dielectric waveguide shorting portion is constituted by the conductor pattern, the ground conductor pattern, and the connecting conductors.

Abstract: The invention provides a dielectric substrate; a ground conductor pattern is formed on one surface of the dielectric substrate and which has a ground conductor pattern omission portion; a strip conductor pattern formed on a surface of the dielectric substrate opposite to the surface having the ground conductor pattern; a conductor pattern for shorting of a waveguide formed so as to be continuously connected to the strip conductor pattern; connecting conductors for connecting the ground conductor pattern and the conductor pattern to each other within the dielectric substrate; and a waveguide connected to the dielectric substrate so as to correspond to the ground conductor pattern omission portion. Also, a microstrip line is constituted by the strip conductor pattern, the ground conductor pattern, and the dielectric substrate. Further, a dielectric waveguide shorting portion is constituted by the conductor pattern, the ground conductor pattern, and the connecting conductors.

Abstract: A nonreflective waveguide terminator includes a waveguide portion and an electromagnetic wave absorber. The portion has a rectangular opening in a plane perpendicular to a radio-wave propagation direction. The portion has one open end in the direction and the other end closed by a terminating metal internal wall. The portion has a radio-wave propagation space surrounded by first and second metal internal walls parallel to a radio-wave electric field, and third and fourth metal internal walls perpendicular to the field. The exterior shape of the absorber is a parallelepiped. The absorber has a rear-end surface positioned at a predetermined distance from the terminating wall and parallel to the terminating wall or is provided against the terminating wall. The surface of the absorber having the largest rectangular area is on the third or the fourth metal internal wall.

Abstract: A nonreflective waveguide terminator includes a waveguide portion and an electromagnetic wave absorber. The portion has a rectangular opening in a plane perpendicular to a radio-wave propagation direction. The portion has one open end in the direction and the other end closed by a terminating metal internal wall. The portion has a radio-wave propagation space surrounded by first and second metal internal walls parallel to a radio-wave electric field, and third and fourth metal internal walls perpendicular to the field. The exterior shape of the absorber is a parallelepiped. The absorber has a rear-end surface positioned at a predetermined distance from the terminating wall and parallel to the terminating wall or is provided against the terminating wall. The surface of the absorber having the largest rectangular area is on the third or the fourth metal internal wall.

Abstract: A connection structure is provided, which can perform an electrical connection between high-frequency circuit substrates in a manner of high workability and productivity. A connection structure comprises: a high-frequency transmission line lead frame connecting a first high-frequency transmission line formed on a first high-frequency circuit substrate to a second high-frequency transmission line formed on a second high-frequency circuit substrate; a plurality of GND electrode lead frames disposed in parallel to the high-frequency transmission line lead frame on both sides thereof, and providing a connection between a first GND electrode of the first high-frequency circuit substrate and a second GND electrode of the second high-frequency circuit substrate; and a reinforcing substrate integrally securing the high-frequency transmission line lead frame and a plurality of GND electrode lead frames.

Abstract: The invention provides a dielectric substrate; a ground conductor pattern is formed on one surface of the dielectric substrate and which has a ground conductor pattern omission portion; a strip conductor pattern formed on a surface of the dielectric substrate opposite to the surface having the ground conductor pattern; a conductor pattern for shorting of a waveguide formed so as to be continuously connected to the strip conductor pattern; connecting conductors for connecting the ground conductor pattern and the conductor pattern to each other within the dielectric substrate; and a waveguide connected to the dielectric substrate so as to correspond to the ground conductor pattern omission portion. Also, a microstrip line is constituted by the strip conductor pattern, the ground conductor pattern, and the dielectric substrate. Further, a dielectric waveguide shorting portion is constituted by the conductor pattern, the ground conductor pattern, and the connecting conductors.

Abstract: A connection structure is provided, which can perform an electrical connection between high-frequency circuit substrates in a manner of high workability and productivity. A connection structure comprises: a high-frequency transmission line lead frame connecting a first high-frequency transmission line formed on a first high-frequency circuit substrate to a second high-frequency transmission line formed on a second high-frequency circuit substrate; a plurality of GND electrode lead frames disposed in parallel to the high-frequency transmission line lead frame on both sides thereof, and providing a connection between a first GND electrode of the first high-frequency circuit substrate and a second GND electrode of the second high-frequency circuit substrate; and a reinforcing substrate integrally securing the high-frequency transmission line lead frame and a plurality of GND electrode lead frames.

Abstract: The prior art has a problem in which an isolation between output terminals is deteriorated when a thin film resistor is used as an isolation resistor. Such being the case, in a power divider/combiner comprising an input terminal, two output terminals, two branch lines each connecting the input terminal and one of the output terminals and having a line length that is ¼ of a set wavelength or a multiple of integer of half a wavelength and ¼ of the set wavelength, and an isolation resistor connected to between the output terminals, there is provided an improved power divider/combiner further comprising a transmission line interposed between each of the output terminals and the branch lines. Consequently, even when using the isolation resistor having a length that can not be ignored as compared with a wavelength of a high-frequency signal in use, the isolation between the output terminals can be ensured.

Abstract: Capacitors 8, each of which is connected from a position between each of input/output terminals 5a, 5b, 5c, 5d and a coupled line 6 to an ground conductor pattern 7, are provided.

Abstract: A reflection characteristic in a high frequency region at a feeding point into a strip line is improved and the assembly of a strip line feeding apparatus facilitated by the method and apparatus herein. The strip line includes a strip line pattern on a surface of a first dielectric substrate having a ground conductor pattern disposed on the opposite surface thereof, and a second ground conductor pattern disposed on a surface of a second dielectric substrate. A serial high impedance portion is disposed at an area near the tip portion of the strip line pattern. The high impedance portion includes a portion of the strip line pattern having narrowed width or a hole disposed under a through-hole for an inner conductor, which electrically connects the strip line pattern and an inner conductor. Dimensions of the high impedance portion are controlled to cancel out parasitic susceptance due to the discontinuous structure.