Patents by Inventor Yukihiro Takikawa

Yukihiro Takikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring boards and processes for manufacturing wiring boards
    Patent number: 6696133
    Abstract: In wiring board 1 of the present invention, a shield film 50 is connected to a specific wiring member (ground wiring) 17 at the bottoms of openings 14 in cover film 21 and the shield film 50 is wrapped from the side of cover film 21 to the side of base film 11. Therefore, shield film 50 can be placed at ground potential on not only the side of cover film 21 but also the side of base film 11, whereby wiring board 1 can be wholly shielded from the noise emitted from other electronic components. Ground wiring 17 is patterned to be wider than the other wiring members (signal wirings) 18, which allows a large current to pass and openings 14 to be made in a large diameter, so that cover film 21 can be easily aligned and more reliably connected to shield film 50.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: February 24, 2004
    Assignee: Sony Chemicals Corp.
    Inventors: Yoshifumi Ueno, Yukihiro Takikawa
  • Wiring boards
    Publication number: 20030112617
    Abstract: In a flexible wiring board of the present invention, a first shield film is connected to a ground wiring at the bottom of an opening in a cover film. The first shield film is connected to a second shield film via a through-hole penetrating from the surface to the rear surface of a base film. Thus, the second shield film is connected to the ground wiring via the first shield film, whereby the wiring board can be wholly shielded.
    Type: Application
    Filed: January 27, 2003
    Publication date: June 19, 2003
    Inventors: Yoshifumi Ueno, Yukihiro Takikawa
  • Wiring boards and processes for manufacturing wiring boards
    Publication number: 20020041950
    Abstract: An object of the present invention is to simplify the grounding operation.
    Type: Application
    Filed: October 4, 2001
    Publication date: April 11, 2002
    Applicant: SONY CHEMICALS CORP.
    Inventors: Yoshifumi Ueno, Yukihiro Takikawa