Patents by Inventor Yukihiro USUI

Yukihiro USUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9732183
    Abstract: A redundant part of a plated through hole that is formed in a printed wiring board is removed by a back drilling method; a penetration hole is filled entirely with a curable resin composition for hole filling; the curable resin composition is initially heated at a temperature less than 100° C. so that a curing rate of the curable resin composition may be 60% to 85%; and the curable resin composition is subsequently heated at a temperature 130° C. to 200° C. so that the curable resin composition may be cured completely, where the curable resin composition contains 1 part by mass to 200 parts by mass of a curing agent with respect to 100 parts by mass of liquid epoxy resin, and contains no solvent.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: August 15, 2017
    Assignee: SAN-EI KAGAKU CO., LTD.
    Inventors: Yukihiro Usui, Kazuya Takahashi, Kazunori Kitamura
  • Publication number: 20170066868
    Abstract: A redundant part of a plated through hole that is formed in a printed wiring board is removed by a back drilling method; a penetration hole is filled entirely with a curable resin composition for hole filling; the curable resin composition is initially heated at a temperature less than 100° C. so that a curing rate of the curable resin composition may be 60% to 85%; and the curable resin composition is subsequently heated at a temperature 130° C. to 200° C. so that the curable resin composition may be cured completely, where the curable resin composition contains 1 part by mass to 200 parts by mass of a curing agent with respect to 100 parts by mass of liquid epoxy resin, and contains no solvent.
    Type: Application
    Filed: August 31, 2016
    Publication date: March 9, 2017
    Inventors: Yukihiro USUI, Kazuya TAKAHASHI, Kazunori KITAMURA
  • Patent number: 9201299
    Abstract: A curable resin composition comprises: (I) 100 parts by weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 ?m, wherein a content weight ratio of the components (II) and (III) is 1 to 41.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: December 1, 2015
    Assignee: SAN-EI KAGAKU CO., LTD.
    Inventors: Toshimitsu Kounou, Yasuhiro Kuroyanagai, Yukihiro Usui, Makoto Obunai
  • Publication number: 20110008759
    Abstract: According to an embodiment, an instructor support system has a plant simulation device used for plant operation training, an instructor support device, a dialog display device, a video device, and an operator position detection means that picks up an image of an operator with an operation detection video camera and carries out image processing for the image. The instructor support device has an operator position judgment means that judges an operator position in accordance with the information received from the operator position detection means, an operator information saving means that records a corresponding table between an ID code and an operator name, an operator name display data generation means, and an operation history display screen that shows the generated operator name display data to an instructor.
    Type: Application
    Filed: July 13, 2010
    Publication date: January 13, 2011
    Inventors: Yukihiro USUI, Hirokazu Otsuka, Takahisa Kato, Hiroki Ueda, Seiko Wajima
  • Publication number: 20090087775
    Abstract: A curable resin composition comprises: (I) 100 parts by-weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 ?m, wherein a content weight ratio of the components (II) and (III) is 1 to 41.
    Type: Application
    Filed: September 5, 2008
    Publication date: April 2, 2009
    Applicant: SAN-EI KAGAKU CO., LTD.
    Inventors: Toshimitsu KUNOU, Yasuhiro KUROYANAGI, Yukihiro USUI, Makoto OBUNAI