Abstract: This invention relates to heat-resistant film adhesives for use in fabrication of printed circuit boards formulated from polyimides with silicone units and epoxy resins and, if necessary, epoxy resin curing agents. It is possible to introduce functional groups reactive with epoxy resins into the polyimide structure. The films are used by inserting them between adherends and pressing at 1 to 1,000 kg/cm.sup.2 and 20.degree. to 250.degree. C. and they show excellent heat resistance, heat resistance at soldering temperature after moisture absorption and processibility when contact-bonded at 250.degree. C. or less.

Abstract: The invention relates to milk shakes wherein ingredients of 45-70 weight % of water, 15.3-40 weight % of carbohydrates containing 15-35 weight % of sugar and 0.3-1.3 weight % of alcohol, and 1-7 weight % of protein and 1-25 weight % of oil/fat are mixed and ice cream obtained by filtering, homogenizing, sterilizing, cooling, aging, freezing at an overrun percentage of 10 to 100, kneading with tiny pieces of ice, filling in packing containers and hardened and the ice cream so obtained is shaken and mixed at a temperature in a range of -20.degree. C. to 8.degree. C. with or without addition of some syrup such as a fruit sauce or the like to make a milk shake.