Patents by Inventor YUKIHIRO YUMISASHI

YUKIHIRO YUMISASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELEMENT ASSEMBLY, AND ELEMENT AND MOUNTING SUBSTRATE ASSEMBLY
    Publication number: 20210005799
    Abstract: An element and mounting substrate assembly includes an element assembly and a mounting substrate, in which: the element assembly includes an element 20, a mold portion 30 that covers the element 20, a bonding portion 41 provided below the mold portion 30 and electrically connected to the element 20, and a heat conversion layer 50 that is formed on or above the bonding portion 41 and that generates heat on the basis of the light emitted from above the mold portion 30 through the mold portion 30; a mounting substrate 60 includes at least a substrate 61 and a connection portion 62 formed on the substrate 61; and the bonding portion 41 is bonded to the connection portion 62.
    Type: Application
    Filed: March 6, 2019
    Publication date: January 7, 2021
    Inventors: HIROYUKI ISHIDA, YUKIHIRO YUMISASHI, HIDEYUKI NISHIOKA