Patents by Inventor Yukihisa Mohara
Yukihisa Mohara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240027361Abstract: The purpose of the present disclosure is to provide a defect inspection device with which it is possible to suppress variation in an output signal occurring when an imaging operation condition for an image sensor is changed. The defect inspection device according to the present disclosure comprises a detector that outputs a detection signal for signal light generated by irradiating a sample with light. The detector is controlled so that a first operation state of the detector in a first signal acquisition condition and a second operation state of the detector in a second signal acquisition condition are the same.Type: ApplicationFiled: October 30, 2020Publication date: January 25, 2024Inventors: Kazuhide SATO, Yukihisa MOHARA, Masami MAKUUCHI
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Patent number: 10458924Abstract: A defect inspection apparatus includes a light irradiation unit irradiating a sample placed on a table unit with illumination light, a detection optical system forming a scattered light image from the sample and detecting the generated scattered light image through an image sensor, a processing unit receiving a signal from the image sensor of the detection optical system that detects the scattered light image, generating an image of the scattered light, and detecting a defect of the sample by processing the generated image, an output unit outputting the defect image processed by the image processing unit, and a control unit controlling the stable unit, the light irradiation unit, the detection optical system, and the image processing unit. The image processing unit includes an image generation unit that receives the signal and generates the image, a correction unit that corrects lightness discontinuity and a defect detection unit for image processing.Type: GrantFiled: July 4, 2016Date of Patent: October 29, 2019Assignee: Hitachi High-Technologies CorporationInventors: Hisaaki Kanai, Masami Makuuchi, Yukihisa Mohara, Eiji Imai
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Publication number: 20190178813Abstract: A defect inspection apparatus includes a light irradiation unit irradiating a sample placed on a table unit with illumination light, a detection optical system forming a scattered light image from the sample and detecting the generated scattered light image through an image sensor, a processing unit receiving a signal from the image sensor of the detection optical system that detects the scattered light image, generating an image of the scattered light, and detecting a defect of the sample by processing the generated image, an output unit outputting the defect image processed by the image processing unit, and a control unit controlling the stable unit, the light irradiation unit, the detection optical system, and the image processing unit. The image processing unit includes an image generation unit that receives the signal and generates the image, a correction unit that corrects lightness discontinuity and a defect detection unit for image processing.Type: ApplicationFiled: July 4, 2016Publication date: June 13, 2019Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Hisaaki KANAI, Masami MAKUUCHI, Yukihisa MOHARA, Eiji IMAI
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Patent number: 9097686Abstract: This optical inspection device has: a line sensor on which channels are arranged; a moving means for moving a wafer mounted on a stage relative to the line sensor; a stage position detection means for detecting the on-stage positions of pseudo-defects in images formed on the channels as pseudo-defect stage coordinates, said coordinate management wafer being a wafer on which one pseudo-defect die is formed per row and column of a matrix of dies and each pseudo-defect die has a plurality of pseudo-defects formed in a line in the columnar direction; a coordinate transformation means for transforming the pseudo-defect stage coordinates into pseudo-defect die coordinates; a difference computation means for computing the differences of the pseudo-defect die coordinates from design coordinates; and a characteristic pattern acquisition means for obtaining a coordinate error characteristic pattern in which the differences from the pseudo-defect stage coordinates increase or decrease along a straight line.Type: GrantFiled: June 22, 2012Date of Patent: August 4, 2015Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Yoshio Bamba, Yukihisa Mohara, Kowa Tabei
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Publication number: 20140192352Abstract: This optical inspection device has: a line sensor on which channels are arranged; a moving means for moving a wafer mounted on a stage relative to the line sensor; a stage position detection means for detecting the on-stage positions of pseudo-defects in images formed on the channels as pseudo-defect stage coordinates, said coordinate management wafer being a wafer on which one pseudo-defect die is formed per row and column of a matrix of dies and each pseudo-defect die has a plurality of pseudo-defects formed in a line in the columnar direction; a coordinate transformation means for transforming the pseudo-defect stage coordinates into pseudo-defect die coordinates; a difference computation means for computing the differences of the pseudo-defect die coordinates from design coordinates; and a characteristic pattern acquisition means for obtaining a coordinate error characteristic pattern in which the differences from the pseudo-defect stage coordinates increase or decrease along a straight line.Type: ApplicationFiled: June 22, 2012Publication date: July 10, 2014Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Yoshio Bamba, Yukihisa Mohara, Kowa Tabei
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Patent number: 8525984Abstract: An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.Type: GrantFiled: May 10, 2012Date of Patent: September 3, 2013Assignee: Hitachi High-Technologies CorporationInventors: Hiroyuki Yamashita, Yukihisa Mohara, Eiji Imai
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Publication number: 20130194579Abstract: In a conventional art, vibrations of compositions (for example, a Z-stage, a ?-stage, a wafer chuck, and a detection optical system mounted above a stage linear scale) within a device are not precisely fed back to a coordinate value.Type: ApplicationFiled: July 19, 2011Publication date: August 1, 2013Inventors: Yukihisa Mohara, Hidetoshi Nishiyama, Shuichi Chikamatsu, Eiji Imai, Koichi Taniguchi
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Patent number: 8289507Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.Type: GrantFiled: May 27, 2011Date of Patent: October 16, 2012Assignee: Hitachi High-Technologies CorporationInventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi
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Publication number: 20120224173Abstract: An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.Type: ApplicationFiled: May 10, 2012Publication date: September 6, 2012Inventors: Hiroyuki Yamashita, Yukihisa Mohara, Eiji Imai
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Publication number: 20110285989Abstract: An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.Type: ApplicationFiled: August 3, 2011Publication date: November 24, 2011Inventors: Hiroyuki YAMASHITA, Yukihisa MOHARA, Eiji IMAI
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Publication number: 20110228258Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.Type: ApplicationFiled: May 27, 2011Publication date: September 22, 2011Inventors: Akira HAMAMATSU, Minori NOGUCHI, Yoshimasa OHSHIMA, Sachio UTO, Taketo UENO, Hiroyuki NAKANO, Takahiro JINGU, Hisashi HATANO, Yukihisa MOHARA, Seiji OTANI, Takahiro TOGASHI
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Patent number: 7999932Abstract: An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.Type: GrantFiled: April 30, 2010Date of Patent: August 16, 2011Assignee: Hitachi High-Technologies CorporationInventors: Hiroyuki Yamashita, Yukihisa Mohara, Eiji Imai
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Patent number: 7952700Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.Type: GrantFiled: October 19, 2010Date of Patent: May 31, 2011Assignee: Hitachi High-Technologies CorporationInventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi
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Publication number: 20110032515Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.Type: ApplicationFiled: October 19, 2010Publication date: February 10, 2011Inventors: Akira HAMAMATSU, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi
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Patent number: 7817261Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.Type: GrantFiled: May 2, 2008Date of Patent: October 19, 2010Assignee: Hitachi High-Technologies CorporationInventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi
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Publication number: 20100208251Abstract: An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage,a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.Type: ApplicationFiled: April 30, 2010Publication date: August 19, 2010Inventors: Hiroyuki YAMASHITA, Yukihisa MOHARA, Eiji IMAI
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Patent number: 7733473Abstract: An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.Type: GrantFiled: March 27, 2008Date of Patent: June 8, 2010Assignee: Hitachi High-Technologies CorporationInventors: Hiroyuki Yamashita, Yukihisa Mohara, Eiji Imai
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Publication number: 20080239319Abstract: An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.Type: ApplicationFiled: March 27, 2008Publication date: October 2, 2008Inventors: Hiroyuki YAMASHITA, Yukihisa MOHARA, Eiji Imai
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Publication number: 20080204724Abstract: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.Type: ApplicationFiled: May 2, 2008Publication date: August 28, 2008Inventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi
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Patent number: 7369223Abstract: An apparatus for inspecting a pattern to detect a small pattern defect has an illuminating light source, as illuminating optical system having a plurality of illuminating portions for switching an optical path of illuminating light flux to a surface of board constituting the inspected object from a plurality of directions different from each other, a detecting optical system having a variable magnification using an object lens for condensing reflected diffracted light from the illuminated board, a focusing optical system having a variable magnification capable of focusing an optical image by converged reflected diffracted light with a desired focusing magnification and an optical detector for detecting the optical image focused by the focusing optical system to convert it into an image signal, an A/D converter for converting the image signal into a digital image signal, and an image signal processor for processing the digital image signal to detect the defect.Type: GrantFiled: March 23, 2005Date of Patent: May 6, 2008Assignee: Hitachi High-Technologies CorporationInventors: Akira Hamamatsu, Minori Noguchi, Yoshimasa Ohshima, Sachio Uto, Taketo Ueno, Hiroyuki Nakano, Takahiro Jingu, Hisashi Hatano, Yukihisa Mohara, Seiji Otani, Takahiro Togashi