Patents by Inventor Yukihisa Nakabayashi

Yukihisa Nakabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8537550
    Abstract: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: September 17, 2013
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Masato Higuchi, Yasuhiko Kawanami, Katsushi Terazono, Koji Higashikawa, Akira Sasaki, Takayuki Morihara, Takashi Aoki, Tetsuya Ito, Yukihisa Nakabayashi, Tasuku Isobe, Kiyonori Koguma
  • Publication number: 20120236500
    Abstract: A wiring board includes a conductor plate including a wiring portion and an electrode portion connected to a power conversion semiconductor element, a liquid-cooling pipe mounted near the conductor plate and causing a cooling liquid to be supplied therethrough, and an insulating resin material arranged at least between the conductor plate and the liquid-cooling pipe.
    Type: Application
    Filed: December 19, 2011
    Publication date: September 20, 2012
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Masato Higuchi, Yasuhiko Kawanami, Katsushi Terazono, Koji Higashikawa, Akira Sasaki, Takayuki Morihara, Takashi Aoki, Tetsuya Ito, Yukihisa Nakabayashi, Tasuku Isobe, Kiyonori Koguma
  • Publication number: 20120235162
    Abstract: This power converter includes a power-conversion semiconductor element, an electrode conductor having a substantially flat upper end surface, and a sealant. The sealant allows the substantially flat upper end surface of the electrode conductor to be exposed at an upper surface of the sealant, and provides electrical connection with an external device at the upper end surface of the exposed electrode conductor.
    Type: Application
    Filed: December 19, 2011
    Publication date: September 20, 2012
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Tasuku ISOBE, Yasuhiko Kawanami, Yukihisa Nakabayashi, Masato Higuchi, Koji Higashikawa, Katsushi Terazono, Akira Sasaki, Takayuki Morihara, Takashi Aoki, Tetsuya Ito, Kiyonori Koguma