Abstract: A substrate conveyance apparatus includes a first driving shaft, an arm portion having one end connected to the first driving shaft, a substrate holding unit capable of holding a substrate, and a connecting portion that connects the other end of the arm portion and the substrate holding unit. The connecting portion includes a rotating support portion that supports the substrate holding unit rotatably with respect to the arm portion, and a moving unit that moves the substrate holding unit upward or downward with respect to the arm portion in the direction of the rotating shaft about which the substrate holding unit is rotated by the rotating support portion.

Abstract: A vacuum actuator includes a vacuum partition wall, the interior of which can be evacuated to a vacuum, a rotor supported by the vacuum partition wall to be free to rotate, a permanent magnet provided on the outer peripheral surface of the rotor, a coil opposed to the permanent magnet, and a stator provided with the coil. The stator and the vacuum partition wall are formed integrally with each other.

Abstract: A vacuum processing apparatus including at least three transfer chambers that have transfer robot arms for transferring a substrate, one or more processing chambers connected to each of the transfer chambers; one or more substrate mounts disposed in the interior thereof; a single common vacuum chamber in which the transfer robot arms of the at least three transfer chambers are disposed in positions that allow the arms to reach the substrate mount, and which is used for handing off the substrate by the transfer robot arms between at least two transfer chambers and at least one substrate mount; and load-lock chambers connected to at least one transfer chamber.

Abstract: A multichamber substrate processing apparatus in which substrates are always positioned accurately at set positions inside a process chamber is a practical apparatus that affords excellent productivity while occupying little space. A heating chamber 6 for heating a substrate Sb before a film is deposited in a sputtering chamber 8 and a CVD chamber 9 is provided with an alignment means for performing center alignment whereby the position of the center of the substrate Sb is calculated and the substrate is centered over a preset position, and for performing circumferential alignment whereby the circumferential position of the substrate Sb is calculated and this circumferential position is aligned with a preset position.