Patents by Inventor Yukiji Watanabe

Yukiji Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal core substrate and process for manufacturing same
    Patent number: 6767616
    Abstract: A metal core substrate comprises a core layer (10) consisting of first and second metal plates (11, 12) layered with a third insulating layer (13) interposed therebetween; first and second insulating layers (20, 21) formed on the first and metal plates, respectively; first and second wiring patterns (45, 46) formed on the first and second insulating layers, respectively. A conductive layer (40) formed in a through-hole (22) penetrates the first insulating layer, the first metal plate, the third insulating layer, the second metal plate and the second insulating layer for electrically connecting the first wiring pattern with the second wiring pattern. The first metal plate (11) is electrically connected with the first wiring pattern (45) and the second wiring pattern (46), respectively, by means of a via (44) and by means a via (43).
    Type: Grant
    Filed: May 13, 2003
    Date of Patent: July 27, 2004
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Kazuhiko Ooi, Masaru Yamazaki, Yukiji Watanabe, Takaaki Yazawa
  • Metal core substrate and process for manufacturing same
    Publication number: 20030215619
    Abstract: A metal core substrate comprises a core layer (10) consisting of first and second metal plates (11, 12) layered with a third insulating layer (13) interposed therebetween; first and second insulating layers (20, 21) formed on the first and metal plates, respectively; first and second wiring patterns (45, 46) formed on the first and second insulating layers, respectively. A conductive layer (40) formed in a through-hole (22) penetrates the first insulating layer, the first metal plate, the third insulating layer, the second metal plate and the second insulating layer for electrically connecting the first wiring pattern with the second wiring pattern. The first metal plate (11) is electrically connected with the first wiring pattern (45) and the second wiring pattern (46), respectively, by means of a via (44) and by means a via (43).
    Type: Application
    Filed: May 13, 2003
    Publication date: November 20, 2003
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kazuhiko Ooi, Masaru Yamazaki, Yukiji Watanabe, Takaaki Yazawa