Patents by Inventor Yukiko Hyodo

Yukiko Hyodo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit substrate
    Patent number: 7292448
    Abstract: A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a flexible wiring board sandwiched by the first and second rigid substrates and which has a plurality of third land portions corresponding to the first land portions on one surface and a plurality of fourth land portions corresponding to the second land portions on the other surface. In this circuit substrate, the second and fourth land portions are displaced from each other relative to the first and third land portions and at least part of the first and third land portions and at least part of the second and fourth land portions are electrically connected to each other, respectively.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: November 6, 2007
    Assignee: Sony Corporation
    Inventors: Toshichika Urushibara, Koji Shiozawa, Masakazu Okabe, Yukiko Hyodo, Yusuke Masuda, Tadayuki Miyamoto
  • Circuit substrate
    Publication number: 20070081309
    Abstract: A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a flexible wiring board sandwiched by the first and second rigid substrates and which has a plurality of third land portions corresponding to the first land portions on one surface and a plurality of fourth land portions corresponding to the second land portions on the other surface. In this circuit substrate, the second and fourth land portions are displaced from each other relative to the first and third land portions and at least part of the first and third land portions and at least part of the second and fourth land portions are electrically connected to each other, respectively.
    Type: Application
    Filed: August 24, 2006
    Publication date: April 12, 2007
    Applicant: Sony Corporation
    Inventors: Toshichika Urushibara, Koji Shiozawa, Masakazu Okabe, Yukiko Hyodo, Yusuke Masuda, Tadayuki Miyamoto