Abstract: A processing method of a workpiece for processing the workpiece including a substrate and a film made on a back surface of the substrate is provided. The processing method includes a sheet sticking step of sticking a sheet to the film, a protective film forming step of forming a protective film that covers the front surface side of the substrate, a mask pattern forming step of removing a part corresponding to planned dividing lines in the protective film and forming a mask pattern on the front surface side, an etching step of carrying out dry etching for the substrate from the front surface side and forming etching grooves and a film dividing step of dividing the film along the etching grooves by pressing the workpiece by an edge of a tip part of a pressing member having the tip part in which the edge has a curved shape.

Abstract: A processing method of a workpiece for processing the workpiece including a substrate and a film made on a back surface of the substrate is provided. The processing method includes a sheet sticking step of sticking a sheet to the film, a protective film forming step of forming a protective film that covers the front surface side of the substrate, a mask pattern forming step of removing a part corresponding to planned dividing lines in the protective film and forming a mask pattern on the front surface side, an etching step of carrying out dry etching for the substrate from the front surface side and forming etching grooves and a film dividing step of dividing the film along the etching grooves by pressing the workpiece by an edge of a tip part of a pressing member having the tip part in which the edge has a curved shape.

Abstract: A semiconductor device includes: a first semiconductor chip having an upper face on which at least one first electrode pad is formed; a second semiconductor chip provided above the first semiconductor chip and having an upper face on which at least one second electrode pad is formed; a conductive film external to the first semiconductor chip and the second semiconductor chip; and a wire. The wire electrically connects the first electrode pad and the second electrode pad to each other via the conductive film.

Abstract: A setting information notifying method that enables safely and easily exchanging appliance setting information between appliances connected to a home network, the said method comprising steps of that: a portable data media is connected to a first appliance which provides a service in a communication network; the first appliance writes on the data media an appliance setting application which is used in notifying the appliance setting information to the other appliance, a host name of the first appliance, and a digital certification with a first cryptographic key; the data media is reconnected to a second appliance which uses the service of the first appliance; and the second appliance identifies a network address of the first appliance based on its host name, and establishes a cryptographic communication using the first cryptographic key over the communication network, and automatically sends the appliance setting information to the first appliance.