Patents by Inventor Yukiko Nishioka
Yukiko Nishioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100105154Abstract: A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.Type: ApplicationFiled: January 12, 2010Publication date: April 29, 2010Inventors: XINMING WANG, Daisuke Takagi, Akihiko Tashiro, Yukio Fukunaga, Akira Fukunaga, Akira Owatari, Yukiko Nishioka
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Publication number: 20080000509Abstract: A cleaning apparatus in which cleaning and drying can be carried out without the risk of reverse contamination of the cleaned object after the drying process. The cleaning apparatus includes a supporting device for supporting an object to be cleaned, and a cleaning cup surrounding the supporting device to prevent splashing of a cleaning liquid. The cleaning apparatus includes a cleaning device for cleaning an inner wall of the cleaning cup with a cleaning liquid.Type: ApplicationFiled: August 2, 2007Publication date: January 3, 2008Inventors: Ryosuke Yonekura, Yukiko Nishioka, Mitsuo Miyashita, Yoshikazu Ariga
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Publication number: 20080000776Abstract: A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.Type: ApplicationFiled: August 29, 2007Publication date: January 3, 2008Inventors: Xinming Wang, Daisuke Takagi, Akihiko Tashiro, Yukio Fukunaga, Akira Fukunaga, Akira Owatari, Yukiko Nishioka
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Patent number: 7285492Abstract: A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.Type: GrantFiled: January 24, 2005Date of Patent: October 23, 2007Assignee: Ebara CorporationInventors: Xinming Wang, Daisuke Takagi, Akihiko Tashiro, Yukio Fukunaga, Akira Fukunaga, Akira Owatari, Yukiko Nishioka, Tsuyoshi Sahoda
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Patent number: 7264681Abstract: A cleaning apparatus and a cleaning method wherein cleaning and drying can be carried out in the same cleaning apparatus without the risk of reverse contamination of the cleaned object after the drying process. The cleaning apparatus includes a supporting device for supporting an object to be cleaned, and a cleaning cup surrounding the supporting device to prevent splashing of a cleaning liquid. The cleaning apparatus includes a cleaning device for cleaning an inner wall of the cleaning cup with a cleaning liquid.Type: GrantFiled: July 8, 2003Date of Patent: September 4, 2007Assignee: Ebara CorporationInventors: Ryosuke Yonekura, Yukiko Nishioka, Mitsuo Miyashita, Yoshikazu Ariga
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Patent number: 7155963Abstract: The present invention relates to a cleaning evaluation method for evaluating a surface cleanliness of a substrate which has been cleaned after being polished. This method includes preparing a dummy substrate having a metal film formed on a surface thereof and a monitor substrate on which a cleaning evaluation is performed, and polishing the dummy substrate. After polishing the dummy substrate, the monitor substrate is polished without dressing a polishing surface of a polishing table, the monitor substrate is cleaned, and the surface cleanliness of the monitor substrate which has been cleaned is evaluated.Type: GrantFiled: September 2, 2004Date of Patent: January 2, 2007Assignee: Ebara CorporationInventors: Yukiko Nishioka, Yoshikazu Ariga
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Patent number: 7077730Abstract: A method and apparatus for polishing a workpiece are set forth which can polish the workpiece at a constant rate at a stable condition even when plural workpieces are continually polished. The method comprises dressing a polishing surface of a polishing table while supplying a dressing solution. After the dressing, the dressing solution remaining on the polishing surface is removed by rotating the polishing table at a dewatering rotation speed while stopping the supply of the dressing solution. Then, the workpiece is polished by making the workpiece slidingly contact with the polishing surface while supplying a polishing solution to the polishing surface.Type: GrantFiled: July 6, 2004Date of Patent: July 18, 2006Assignee: Ebara CorporationInventors: Tatsuya Kohama, Yukiko Nishioka, Yoshikazu Ariga
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Publication number: 20050252535Abstract: A substrate cleaning apparatus is used for cleaning and drying a substrate such as a semiconductor wafer used in a semiconductor fabricating process or the like. The substrate cleaning apparatus includes a substrate holding mechanism (10) configured to hold the substrate (W), and a rotating mechanism (20) configured to rotate the substrate holding mechanism (10). At least one of components of the substrate cleaning apparatus has a surface structure to which droplets are hardly attached.Type: ApplicationFiled: May 26, 2004Publication date: November 17, 2005Inventors: Yukiko Nishioka, Koji Ato, Ryosuke Yonekura, Yoshikazu Ariga
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Publication number: 20050245080Abstract: A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.Type: ApplicationFiled: January 24, 2005Publication date: November 3, 2005Inventors: Xinming Wang, Daisuke Takagi, Akihiko Tashiro, Yukio Fukunaga, Akira Fukunaga, Akira Owatari, Yukiko Nishioka, Tsuyoshi Sahoda
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Patent number: 6932946Abstract: An ozone generator comprises a pair of spaced opposing electrodes, electrically conductive members connecting the pair of electrodes to a high-voltage alternating-current power source to generate an electric discharge between the electrodes, and a dielectric provided between the opposing electrodes. A gas flow passage for allowing flow of a material gas therethrough is defined by the surfaces of the electrodes. At least one of the surfaces of the pair of electrodes has a plurality of parallel grooves. The material gas flows in a space between the plurality of grooves and the dielectric, in a direction transverse to the grooves.Type: GrantFiled: June 21, 2001Date of Patent: August 23, 2005Assignee: Ebara CorporationInventors: Ryoichi Shinjo, Minoru Harada, Yukiko Nishioka
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Publication number: 20050050946Abstract: The present invention relates to a cleaning evaluation method for evaluating a surface cleanliness of a substrate which has been cleaned after being polished. This method includes, preparing a dummy substrate having a metal film formed on a surface thereof and a monitor substrate on which a cleaning evaluation is performed, polishing the dummy substrate, after polishing the dummy substrate, polishing the monitor substrate without dressing a polishing surface of a polishing table, cleaning the monitor substrate, and evaluating the surface cleanliness of the monitor substrate which has been cleaned.Type: ApplicationFiled: September 2, 2004Publication date: March 10, 2005Inventors: Yukiko Nishioka, Yoshikazu Ariga
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Publication number: 20050020194Abstract: A method and apparatus for polishing a workpiece are set forth which can polish the workpiece at a constant rate at a stable condition even when plural workpieces are continually polished. The method comprises dressing a polishing surface of a polishing table while supplying a dressing solution. After the dressing, the dressing solution remaining on the polishing surface is removed by rotating the polishing table at a dewatering rotation speed while stopping the supply of the dressing solution. Then, the workpiece is polished by making the workpiece slidingly contact with the polishing surface while supplying a polishing solution to the polishing surface.Type: ApplicationFiled: July 6, 2004Publication date: January 27, 2005Inventors: Tatsuya Kohama, Yukiko Nishioka, Yoshikazu Ariga
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Publication number: 20040065352Abstract: In order to provide a cleaning apparatus and a cleaning method wherein cleaning and drying can be carried out in the same cleaning apparatus without risk of reverse contamination of the cleaned object after the drying process, a cleaning apparatus comprises a supporting device for supporting an object to be cleaned, and a cleaning cup surrounding said supporting device to prevent splashing of a cleaning liquid, said cleaning apparatus comprising: a cleaning device for cleaning an inner wall of said cleaning cup with a cleaning liquid.Type: ApplicationFiled: July 8, 2003Publication date: April 8, 2004Inventors: Ryosuke Yonekura, Yukiko Nishioka, Mitsuo Miyashita, Yoshikazu Ariga
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Publication number: 20020001550Abstract: An ozone generator comprises a pair of spaced opposing electrodes, electrically conductive members connecting the pair of electrodes to a high-voltage alternating-current power source to generate an electric discharge between the electrodes, a dielectric provided between the opposing electrodes, and a gas flow passage for effecting flow of a material gas defined by the surfaces of the electrodes. At least one of the surfaces of the pair of electrodes has a plurality of parallel grooves. The material gas flows in a space between the plurality of grooves and the dielectric, in a direction transverse to the grooves.Type: ApplicationFiled: June 21, 2001Publication date: January 3, 2002Inventors: Ryoichi Shinjo, Minoru Harada, Yukiko Nishioka
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Patent number: 5688289Abstract: An improved method of laundering clothes and textiles comprises: providing a washing machine having a tub furnished with a fixed outer shell 11 and an inner cylinder 12 that is provided within the outer shell 11, that is rotatably supported on a horizontal rotating shaft 13 and that has a plurality of orifices in the outer peripheral wall through which a washing solution can pass; putting the clothes and textiles into the inner cylinder 12; charging the outer shell 11 with a washing solution Q having a polyelectrolyte containing detergent dissolved therein; and laundering the clothes and textiles with ozone gas from an ozonizer 21 being introduced from an ozone gas supply port 24a directly into the washing solution Q at a temperature of from about 40.degree. C. to less than 50.degree. C., preferably from about 40.degree. C. to about 45.degree. C. between the outer shell 11 and inner cylinder 12.Type: GrantFiled: April 25, 1996Date of Patent: November 18, 1997Assignee: Ebara CorporationInventors: Yukiko Nishioka, Ryoichi Shinjo, Yoshihiro Ishii, Tadao Yamanaka
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Patent number: 5603961Abstract: Sustained release multi-core microsphere preparation which shows high incorporation efficiency of medicament and can release the medicament at a specific rate, which comprises two or more biodegradable polymers and a pharmaceutically active ingredient, and has the medicament incorporated into microregions which are produced by one of these polymers (the first polymer), and these microregions are distributed in other biodegradable polymers (the second polymer), or a method for producing the same.Type: GrantFiled: September 30, 1993Date of Patent: February 18, 1997Assignee: Tanabe Seiyaku Co., Ltd.Inventors: Takehiko Suzuki, Yukiko Nishioka, Yasuhisa Matsukawa, Akihiro Matsumoto, Masao Kobayashi
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Patent number: 5556642Abstract: A method for producing sustained release microsphere preparation for water-soluble medicament, which has high incorporation efficiency of the medicament and low initial burst, which comprises dissolving water-soluble pharmaceutical active ingredient and water-insoluble biodegradable polymer in one or two solvents in which both can dissolve, removing the solvent to give a solid dispersion having the water-soluble pharmaceutical active ingredient dispersed into said biodegradable polymer at molecular level, and further, dissolving said solid dispersion in an organic solvent being water-immiscible and having a boiling point of below 100.degree. C., and adding the resulting oil phase into an aqueous phase containing emulsifying agent to give O/W emulsion, and followed by removing the organic solvent from the oil phase of the resulting emulsion.Type: GrantFiled: July 12, 1993Date of Patent: September 17, 1996Assignee: Tanabe Seiyaku Co., Ltd.Inventors: Masao Kobayashi, Yukiko Nishioka, Takehiko Suzuki, Yashuhisa Matsukawa
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Patent number: 5549874Abstract: A discharge reactor that generates silent discharge and/or creeping discharge between dielectric and high voltage electrode and/or grounded electrode, said dielectric being located between high voltage electrode and grounded electrode, and which generates clean ozone in the discharge space 1 as it passes through said discharge space 1 or as it is held within said discharge space 1, which discharge reactor is characterized in that the dielectric is made of highly purified quartz glass (SiO.sub.2) or single-crystal sapphire which is a highly purified crystallized aluminium oxide or high-purity alumina ceramics which is the firing of highly purified aluminum oxide. Further, in order to obtain cleaner and highly concentration ozone, at least the electrode or electrodes in the area of the discharge space which is to be exposed to discharge are made of a high-purity aluminum material and at least the area of the discharge space which is to be exposed to discharge is further coated with an anodic oxidation film.Type: GrantFiled: April 20, 1993Date of Patent: August 27, 1996Assignee: EBARA CorporationInventors: Ichiro Kamiya, Ryoichi Shinjo, Takeshi Murakami, Yukiko Nishioka, Minoru Harada
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Patent number: 5538695Abstract: In an electric discharge type ozonizer using highly pure oxygen gas having a purity of not lower than 99.99% as a raw material gas, the pressure of a gas in the discharge space of a discharger is raised to a level higher than atmospheric pressure by at least 1.1 kgf/cm.sup.2, and/or in which a liquid-cooled discharger is used, and the temperature of the cooling liquid is set at a level not lower than 15.degree. C., whereby the ozonizer is capable of stably producing ozone gas at a high ozone concentration without causing lowering of the ozone concentration with time.Type: GrantFiled: July 2, 1993Date of Patent: July 23, 1996Assignee: Ebara CorporationInventors: Ryoichi Shinjo, Ichiro Kamiya, Minoru Harada, Yukiko Nishioka
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Patent number: 5511264Abstract: The present invention provides a method for deodorizing and refreshing petroleum group solvent used in a dry cleaning apparatus, and a dry cleaning apparatus using such a method, which can maintain the circulating solvent in a fresh condition for a long time, eliminate a bad smell of the solvent, provide highly stable cleaning ability and good cleaning finish, and prevent ignition and explosion of the solvent to ensure safety.Type: GrantFiled: June 7, 1995Date of Patent: April 30, 1996Assignee: Ebara CorporationInventors: Yukiko Nishioka, Ichiro Kamiya, Ryoichi Shinjo, Yoshihiro Ishii, Koichi Kosaka