Abstract: Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (<200 nm) particles. The compositions exhibit increased thermal conductivity.

Abstract: Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (<200 nm) particles. The compositions exhibit increased thermal conductivity.

Abstract: In an optical fiber array (1) which has a V-groove substrate (2) formed in its surface (2a) with V-grooves (3) for arranging optical fibers, a plurality of optical fiber cores (61) fixedly bonded in each individual V-groove (3) of the V-groove substrate (2), and a pressure plate (4) fixedly bonded to surfaces of the optical fiber cores (61), an adhesive comprising a resin composition (component A) having an OH group after curing and a filler (component B) is used to fixedly bond the V-groove substrate (2), the optical fiber cores (61), and the pressure plate (4). This adhesive has a glass transition temperature that is somewhat lower than the ambient test temperature and possesses somewhat higher elasticity. Therefore, large internal stress does not occur in the adhesive even under conditions of high temperature and high humidity. Consequently, no peeling occurs as a result of moisture penetration since gaps cannot form between the pressure plate (4) and the adhesive.

Abstract: In an optical fiber array (1) which has a V-groove substrate (2) formed in its surface (2a) with V-grooves (3) for arranging optical fibers, a plurality of optical fiber cores (61) fixedly bonded in each individual V-groove (3) of the V-groove substrate (2), and a pressure plate (4) fixedly bonded to surfaces of the optical fiber cores (61), an adhesive comprising a resin composition (component A) having an OH group after curing and a filler (component B) is used to fixedly bond the V-groove substrate (2), the optical fiber cores (61), and the pressure plate (4). This adhesive has a glass transition temperature that is somewhat lower than the ambient test temperature and possesses somewhat higher elasticity. Therefore, large internal stress does not occur in the adhesive even under conditions of high temperature and high humidity. Consequently, no peeling occurs as a result of moisture penetration since gaps cannot form between the pressure plate (4) and the adhesive.