Patents by Inventor Yukinobu Murakami

Yukinobu Murakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nb3Sn superconducting wire and precursor for the same
    Publication number: 20070163675
    Abstract: A precursor for manufacturing a Nb3Sn superconducting wire by bronze method, in which plural Nb or Nb-based alloy cores are buried in a Cu—Sn-based alloy base material. The Cu—Sn-based alloy base material comprises Ti and/or Zr in addition to Sn, and these components satisfy the equations (1) and (2) below: 0.4?(X?15.6)/Y?1.9??(1) and 15.6<X?19 ??(2) where the symbol X denotes the content of Sn in mass % and the symbol Y denotes the total content of Ti and Zr in mass %.
    Type: Application
    Filed: November 7, 2006
    Publication date: July 19, 2007
    Inventors: Takashi Hase, Yukinobu Murakami, Hiroyuki Yasunaka, Takayoshi Miyazaki, Hiroyuki Kato, Kyoji Zaitsu
  • Under-hood material for motorcars comprising polyamide resin having hydrocarbon end groups
    Patent number: 4722996
    Abstract: Disclosed herein is an under-hood material for motorcars, prepared by molding a polymide resin comprising a caproamide component and/or a hexamethylene adipamide component as the major component thereof and having hydrocarbon groups of 6 to 22 carbon atoms as the end groups thereof, wherein (a) the number of the hydrocarbon groups is 5 to 100% of the total number of the end groups of the polyamide and (b) a relative viscosity of the polyamide is 2 to 6.
    Type: Grant
    Filed: April 9, 1986
    Date of Patent: February 2, 1988
    Assignee: Mitsubishi Chemical Industries Limited
    Inventors: Hideo Kanai, Yukinobu Murakami, Norimichi Koga
  • Polyamide resin composition
    Patent number: 4298518
    Abstract: A polyamide resin composition comprises melamine cyanurate with or without a copper compound, an alkali metal halide, a tin compound, a bisamide compound or a bisureido compound.
    Type: Grant
    Filed: August 24, 1977
    Date of Patent: November 3, 1981
    Assignee: Mitsubishi Chemical Industries, Ltd.
    Inventors: Yasuhiro Ohmura, Yukinobu Murakami, Ryoji Hidaka