Patents by Inventor Yukinobu Ohura
Yukinobu Ohura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230154794Abstract: A method of processing a wafer having a plurality of devices provided in respective areas demarcated on a face side of the wafer by a plurality of projected dicing lines. The method includes coating the face side with a protective film agent and thereafter drying the protective film agent into a protective film covering the face side, applying a laser beam having a wavelength absorbable by the wafer to the wafer along the projected dicing lines on the face side, thereby producing a plurality of laser-processed slots in the wafer, cleaning away the protective film, applying ultraviolet rays to the face side to remove an organic substance deriving from the protective film and remaining on the face side, and covering coverage areas corresponding to the respective devices on the face side with an encapsulating resin.Type: ApplicationFiled: November 3, 2022Publication date: May 18, 2023Inventors: Yukinobu OHURA, Senichi RYO
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Patent number: 11637033Abstract: A manufacturing method of a protective film agent for laser dicing that includes a solution preparation step of preparing a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed; and an ion-exchange treatment step of carrying out ion exchange of sodium ions in the solution by using a cation-exchange resin.Type: GrantFiled: January 14, 2022Date of Patent: April 25, 2023Assignee: DISCO CORPORATIONInventors: Senichi Ryo, Yukinobu Ohura, Hiroto Yoshida, Tomoaki Endo
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Publication number: 20230091496Abstract: There is provided a protective film agent with which a workpiece is coated when the workpiece is processed. The protective film agent includes a water-soluble resin, a light absorbing agent having a flavone structure, a flavonol structure, or an isoflavone structure, and a solvent that dissolves the resin and the light absorbing agent.Type: ApplicationFiled: September 6, 2022Publication date: March 23, 2023Inventors: Sho OSAWA, Senichi RYO, Yukinobu OHURA
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Publication number: 20220392805Abstract: A protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a light absorbent. The solution has an absorbance, i.e., an absorbance converted for a solution diluted 200 times, equal to 0.05 or more per an optical path length of 1 cm at a wavelength of 532 nm. Alternatively, the protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a polyhydroxyanthraquinone derivative.Type: ApplicationFiled: May 2, 2022Publication date: December 8, 2022Inventors: Senichi RYO, Yuki IKEDA, Yukinobu OHURA, Toshiyuki YOSHIKAWA
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Publication number: 20220139754Abstract: A protective film agent for laser dicing that includes a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed and in which the content of sodium (Na) of the solution is equal to or lower than 100 ppb in weight ratio. Preferably, the solution further includes an antioxidant.Type: ApplicationFiled: January 14, 2022Publication date: May 5, 2022Inventors: Senichi Ryo, Yukinobu Ohura, Hiroto Yoshida, Tomoaki Endo
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Patent number: 11322383Abstract: A protective film agent for laser dicing that includes a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed and in which the content of sodium (Na) of the solution is equal to or lower than 100 ppb in weight ratio. Preferably, the solution further includes an antioxidant.Type: GrantFiled: January 16, 2020Date of Patent: May 3, 2022Assignee: DISCO CORPORATIONInventors: Senichi Ryo, Yukinobu Ohura, Hiroto Yoshida, Tomoaki Endo
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Patent number: 10858524Abstract: Disclosed herein is a protective film forming resin agent to be used for laser processing including a water-soluble resin, and particulates of a metal oxide which are dispersed in an aqueous solution of the resin and a section of which has an elongated shape having a major axis and a minor axis orthogonal to the major axis. The particulates of the metal oxide the section of which has the elongated shape having the major axis and the minor axis orthogonal to the major axis are dispersed in the aqueous solution of the resin. When the aqueous solution is applied to a workpiece to form a protective film on the workpiece and then the workpiece is subjected to laser processing, therefore, absorbance of a laser beam in the protective film is enhanced, so that processing efficiency is enhanced.Type: GrantFiled: November 15, 2016Date of Patent: December 8, 2020Assignee: DISCO CORPORATIONInventors: Yukinobu Ohura, Senichi Ryo, Yohei Yamashita
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Patent number: 10811458Abstract: A method of processing a wafer having devices disposed in respective regions demarcated on a front face thereof by a grid of a plurality of projected dicing lines on the front face, the method includes a mask layer forming step of covering the front face of the wafer except for the regions where grooves are to be formed along the projected dicing lines with a resin material mixed with an ultraviolet ray absorber, and forming a mask layer on the front face of the wafer, a plasma etching step of performing plasma etching on the wafer from the mask layer side using a fluorine-based stable gas as an etching gas, and forming grooves in the wafer along the projected dicing lines, and a mask layer removing step of removing the mask layer after the plasma etching step is performed.Type: GrantFiled: October 4, 2018Date of Patent: October 20, 2020Assignee: DISCO CORPORATIONInventors: Ryugo Oba, Yukinobu Ohura, Hideyuki Sandoh
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Publication number: 20200234994Abstract: A protective film agent for laser dicing that includes a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed and in which the content of sodium (Na) of the solution is equal to or lower than 100 ppb in weight ratio. Preferably, the solution further includes an antioxidant.Type: ApplicationFiled: January 16, 2020Publication date: July 23, 2020Inventors: Senichi RYO, Yukinobu OHURA, Hiroto YOSHIDA, Tomoaki ENDO
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Publication number: 20190109173Abstract: A method of processing a wafer having devices disposed in respective regions demarcated on a front face thereof by a grid of a plurality of projected dicing lines on the front face, the method includes a mask layer forming step of covering the front face of the wafer except for the regions where grooves are to be formed along the projected dicing lines with a resin material mixed with an ultraviolet ray absorber, and forming a mask layer on the front face of the wafer, a plasma etching step of performing plasma etching on the wafer from the mask layer side using a fluorine-based stable gas as an etching gas, and forming grooves in the wafer along the projected dicing lines, and a mask layer removing step of removing the mask layer after the plasma etching step is performed.Type: ApplicationFiled: October 4, 2018Publication date: April 11, 2019Inventors: Ryugo OBA, Yukinobu OHURA, Hideyuki SANDOH
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Patent number: 10086474Abstract: A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. If the controller decides that the thickness of the protective film does not fall in the predetermined range, the controller operates the protective film forming and cleaning unit to clean away the protective film, performs a pretreating process selected depending on the film thickness on the surface, and operates the protective film forming and cleaning unit to form a protective film again on the surface of the wafer.Type: GrantFiled: June 15, 2017Date of Patent: October 2, 2018Assignee: Disco CorporationInventors: Senichi Ryo, Kenta Nakano, Yukinobu Ohura, Toshiyuki Yoshikawa
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Patent number: 9976951Abstract: A method detects whether or not a workpiece is coated with a water-soluble protective film. The method includes a preparatory step before detection and a detecting step. The preparatory step includes irradiating with infrared light a first region coated with the water-soluble protective film and a second region not coated with the water-soluble protective film for a reference, receiving the reflected light, and thereby acquiring an intensity of reflection from the first region and an intensity of reflection from the second region; and a threshold determining step of determining a threshold from the intensity of reflection from the first region and the intensity of reflection from the second region at a wavenumber of 3000 cm?1 to 3600 cm?1. The detecting step includes irradiating a surface of the workpiece with the infrared light, receiving the reflected light, and comparing the thus obtained intensity of reflection with the threshold.Type: GrantFiled: March 10, 2016Date of Patent: May 22, 2018Assignee: DISCO CORPORATIONInventors: Senichi Ryo, Yusaku Ito, Tomoaki Endo, Yukinobu Ohura, Kentaro Odanaka
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Publication number: 20180134905Abstract: Disclosed herein is a protective film forming resin agent to be used for laser processing including a water-soluble resin, and particulates of a metal oxide which are dispersed in an aqueous solution of the resin and a section of which has an elongated shape having a major axis and a minor axis orthogonal to the major axis. The particulates of the metal oxide the section of which has the elongated shape having the major axis and the minor axis orthogonal to the major axis are dispersed in the aqueous solution of the resin. When the aqueous solution is applied to a workpiece to form a protective film on the workpiece and then the workpiece is subjected to laser processing, therefore, absorbance of a laser beam in the protective film is enhanced, so that processing efficiency is enhanced.Type: ApplicationFiled: November 15, 2016Publication date: May 17, 2018Inventors: Yukinobu Ohura, Senichi Ryo, Yohei Yamashita
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Publication number: 20170368636Abstract: A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. If the controller decides that the thickness of the protective film does not fall in the predetermined range, the controller operates the protective film forming and cleaning unit to clean away the protective film, performs a pretreating process selected depending on the film thickness on the surface, and operates the protective film forming and cleaning unit to form a protective film again on the surface of the wafer.Type: ApplicationFiled: June 15, 2017Publication date: December 28, 2017Inventors: Senichi Ryo, Kenta Nakano, Yukinobu Ohura, Toshiyuki Yoshikawa
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Patent number: 9847257Abstract: There is provided a laser processing method of laser-processing a wafer along a plurality of streets formed in a lattice manner on a top surface of the wafer, the wafer having devices formed in a plurality of regions partitioned by the streets, the laser processing method including: a wafer holding step of holding an undersurface of the wafer by a chuck table; a resin supplying step of supplying a water-soluble liquid resin to the top surface of the wafer; a protective film forming step of forming a protective film P on the wafer as a result of drying the water-soluble liquid resin by irradiating the water-soluble liquid resin with light from a xenon flash lamp; a laser irradiating step of irradiating the wafer with a laser beam through the protective film along the streets; and a cleaning step of cleaning the wafer after the laser irradiating step.Type: GrantFiled: July 25, 2016Date of Patent: December 19, 2017Assignee: DISCO CORPORATIONInventors: Yukinobu Ohura, Senichi Ryo
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Patent number: 9748119Abstract: Disclosed herein is a wafer processing method in which laser processing is carried out on a wafer along streets. The wafer processing method includes a step of holding the wafer by a chuck table, a protective film forming step of forming a water-soluble protective film on a surface of the wafer, a laser beam irradiating step of irradiating the wafer with a laser beam along the streets after the protective film forming step, a step of supplying a chemical having an amino group to the wafer, and a removing step of cleaning and removing a compound that is generated by the supplying of the chemical having an amino group and contains phosphorus.Type: GrantFiled: July 26, 2016Date of Patent: August 29, 2017Assignee: Disco CorporationInventors: Senichi Ryo, Hirokazu Matsumoto, Toshiyuki Yoshikawa, Yukinobu Ohura
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Patent number: 9689798Abstract: Disclosed herein is a protective film detecting method of detecting the formed condition of a protective film formed on the front side of a workpiece. The protective film detecting method includes a fluorescence intensity measuring step of forming a plurality of reference protective films having different thicknesses on the front sides of a plurality of reference workpieces, next applying excitation light absorbable by an absorbing agent contained in each reference protective film to each reference protective film, and next measuring the intensity of fluorescence emitted from the absorbing agent due to the absorption of the excitation light, and a threshold deciding step of deciding a threshold of the fluorescence intensity corresponding to a desired one of the different thicknesses of the reference protective films according to the fluorescence intensity measured above.Type: GrantFiled: December 9, 2016Date of Patent: June 27, 2017Assignee: Disco CorporationInventors: Senichi Ryo, Yukinobu Ohura
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Publication number: 20170176331Abstract: Disclosed herein is a protective film detecting method of detecting the formed condition of a protective film formed on the front side of a workpiece. The protective film detecting method includes a fluorescence intensity measuring step of forming a plurality of reference protective films having different thicknesses on the front sides of a plurality of reference workpieces, next applying excitation light absorbable by an absorbing agent contained in each reference protective film to each reference protective film, and next measuring the intensity of fluorescence emitted from the absorbing agent due to the absorption of the excitation light, and a threshold deciding step of deciding a threshold of the fluorescence intensity corresponding to a desired one of the different thicknesses of the reference protective films according to the fluorescence intensity measured above.Type: ApplicationFiled: December 9, 2016Publication date: June 22, 2017Inventors: Senichi Ryo, Yukinobu Ohura
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Patent number: 9620355Abstract: A wafer processing method includes a wafer holding step of holding a wafer having devices formed on the front side, a protective film forming step of forming a water-soluble protective film on the front side of the wafer, a laser beam applying step of applying a laser beam to the wafer along streets, a cleaning step of cleaning the wafer to then remove the protective film, and a foreign matter removing step of removing foreign matter from the wafer when a predetermined period of time has elapsed after cleaning. This period of time is set as a period of time until a phosphorus containing reaction product produced at a laser processed portion is evaporated to react with water in the air, thereby producing the foreign matter containing phosphorus on bumps formed on each device.Type: GrantFiled: July 20, 2016Date of Patent: April 11, 2017Assignee: Disco CorporationInventors: Senichi Ryo, Hirokazu Matsumoto, Toshiyuki Yoshikawa, Yukinobu Ohura
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Patent number: 9613415Abstract: Disclosed herein is a protective film detecting method including the steps of supplying a mist to a work surface of a workpiece in the condition where the work surface is coated with a protective film, applying light to the work surface of the workpiece, imaging the work surface of the workpiece after supplying the mist, and detecting an uncoated area where the protective film is not formed, by using a difference in light intensity between a coated area where the protective film is formed and the uncoated area where the protective film is not formed to cause the formation of asperities due to droplets formed from the mist supplied to the work surface of the workpiece and the occurrence of Mie scattering of the light applied to the asperities, the difference in light intensity being detected from an image obtained in the imaging step.Type: GrantFiled: October 28, 2015Date of Patent: April 4, 2017Assignee: Disco CorporationInventors: Yu Kudo, Yusaku Ito, Tomoaki Endo, Yukinobu Ohura, Ayana Nakanishi, Senichi Ryo, Kentaro Odanaka