Patents by Inventor Yukinobu Sato

Yukinobu Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230213125
    Abstract: A pinch valve 1 comprises a tube body 3 made of an elastic material having a flow path formed inside, a pressing part 4, a rod member 6 attached to a front end of the pressing part 4, and a coupling part 35 provided on the outer surface of the tube body 3 and coupling the rod member 6 to the tube body 3 in a transverse arrangement with respect to the tube body 3, wherein pressing or releasing the tube body 3 by the pressing part 4 through the rod member 6 makes the tube body 3 deform and opens or closes the flow path.
    Type: Application
    Filed: March 9, 2021
    Publication date: July 6, 2023
    Applicant: ASAHI YUKIZAI CORPORATION
    Inventors: Yukinobu SATO, Kenji KURODA
  • Publication number: 20210215260
    Abstract: A pinch valve free of outflow of fluid at the inside of a tubing to the outside of the pinch valve even if the tubing ruptures. The pinch valve 1 comprises a valve part 2, a tubing 3 inside of which a flow path is formed and accommodated in the valve part 2, a pressing part 4 pressing the tubing 3 or releasing the pressing to cause the tubing 3 to deform and open and close the flow path, and a drive part 5 driving the pressing part 4, the pinch valve further comprising a seal part sealing a fluid connection between a space near an outside surface of the tubing 3 and an outside of the pinch valve 1.
    Type: Application
    Filed: May 30, 2019
    Publication date: July 15, 2021
    Applicant: ASAHI YUKIZAI CORPORATION
    Inventors: Yukinobu SATO, Kensuke MASUDA
  • Patent number: 7775505
    Abstract: A butterfly valve includes a seat ring fitted to an inner peripheral surface of a hollow cylindrical valve body, and a discal valve disc in which a shaft is mounted. The shaft is rotatably mounted in through-holes of the seat ring. An annular protrusion having a first tapered surface inclined at 20°-40° with respect to the valve axis is formed at the peripheral edge of each of the through holes of the seat ring. A bowl-shaped annular depression at each end of the valve shaft hole includes a second tapered surface inclined at 25°-45° with respect to the axis and engaged with a respective first tapered surface.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: August 17, 2010
    Assignee: Asahi Organic Chemicals Industry Co., Ltd.
    Inventors: Akihiro Shakagori, Yukinobu Sato
  • Publication number: 20090039305
    Abstract: A butterfly valve, in which fluid leakage inside a valve disc and from a shaft seal part between through holes of a seat ring and a stem is prevented, when the valve disc is displaced under fluid pressure with the valve closed. Without increasing the operation torque of the stem, the fluid leakage is prevented even after continuous on/off (open/close) operations over a long period of time. The butterfly valve includes the seat ring fitted to the inner peripheral surface of the hollow cylindrical valve body, the stem supported on the valve body via the through holes of the seat ring, and the discal valve disc with the stem mounted and supported in the valve shaft hole. The annular protrusion having the tapered surface with the outer periphery thereof inclined with respect to the valve axis is formed radially inward of the peripheral edge of the through holes on the inner periphery of the seat ring.
    Type: Application
    Filed: March 28, 2006
    Publication date: February 12, 2009
    Applicant: ASAHI ORGANIC CHEIMICALS INDUSTRY CO. LTD.
    Inventors: Akihiro Shakagori, Yukinobu Sato
  • Patent number: 6452264
    Abstract: An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: September 17, 2002
    Assignee: Murata Manufacturing Co. Ltd
    Inventors: Mitsuyoshi Nishide, Jun Urakawa, Yukinobu Sato
  • Publication number: 20020011659
    Abstract: An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.
    Type: Application
    Filed: March 2, 2001
    Publication date: January 31, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Mitsuyoshi Nishide, Jun Urakawa, Yukinobu Sato
  • Patent number: D810879
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: February 20, 2018
    Assignee: ASAHI YUKIZAI CORPORATION
    Inventor: Yukinobu Sato
  • Patent number: D817454
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: May 8, 2018
    Assignee: ASAHI YUKIZAI CORPORATION
    Inventor: Yukinobu Sato
  • Patent number: D895072
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: September 1, 2020
    Assignee: ASAHI YUKIZAI CORPORATION
    Inventors: Yukinobu Sato, Kensuke Masuda, Nobuyuki Matsukuma
  • Patent number: D999366
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: September 19, 2023
    Assignee: ASAHI YUKIZAI CORPORATION
    Inventor: Yukinobu Sato
  • Patent number: D1015490
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: February 20, 2024
    Assignee: ASAHI YUKIZAI CORPORATION
    Inventor: Yukinobu Sato
  • Patent number: D1021318
    Type: Grant
    Filed: February 3, 2022
    Date of Patent: April 2, 2024
    Assignee: Hitachi Channel Solutions, Corp.
    Inventors: Yoko Sato, Shigetaka Kimura, Yukinobu Okada