Patents by Inventor Yukinobu Tarui
Yukinobu Tarui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11205623Abstract: A microwave device includes: a multilayer resin substrate being a first multilayer resin substrate; an IC being a radio frequency circuit provided on the multilayer resin substrate and electrically connected to the multilayer resin substrate; a heat spreader provided on a side opposite to the multilayer resin substrate across the IC, and in contact with the IC; a mold resin covering the periphery of the IC and the heat spreader; and a conductive film covering the mold resin and the heat spreader, where an inner side of the conductive film is in contact with the heat spreader, and the conductive film is electrically connected to a ground via hole of the multilayer resin substrate.Type: GrantFiled: February 22, 2018Date of Patent: December 21, 2021Assignee: Mitsubishi Electric CorporationInventors: Yukinobu Tarui, Makoto Kimura, Katsumi Miyawaki, Kiyoshi Ishida, Hiroaki Matsuoka
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Patent number: 11152310Abstract: A microwave device includes: a multilayer resin substrate being a first multilayer resin substrate; an IC being a radio frequency circuit provided on the multilayer resin substrate and electrically connected to the multilayer resin substrate; a heat spreader provided on a side opposite to the multilayer resin substrate across the IC, and in contact with the IC; a mold resin covering the periphery of the IC and the heat spreader; and a conductive film covering the mold resin and the heat spreader, where an inner side of the conductive film is in contact with the heat spreader, and the conductive film is electrically connected to a ground via hole of the multilayer resin substrate.Type: GrantFiled: February 22, 2018Date of Patent: October 19, 2021Assignee: Mitsubishi Electric CorporationInventors: Yukinobu Tarui, Makoto Kimura, Katsumi Miyawaki, Kiyoshi Ishida, Hiroaki Matsuoka
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Patent number: 11083079Abstract: Lossy members, which are disposed to overlap with a part of branch conductors in a signal conductor, respectively, and cause a loss of the power of signals flowing in the branch conductors, and via holes connecting each of the output terminals of the signal conductor and the ground conductor are included. The branch conductor includes a delay circuit having an electrical length of 90 degrees.Type: GrantFiled: December 26, 2016Date of Patent: August 3, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Hidenori Ishibashi, Yukinobu Tarui, Yuko Onodera, Hiroyuki Aoyama, Naofumi Yoneda
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Publication number: 20210233865Abstract: A microwave device includes: a first multilayer resin substrate including a ground via hole; a semiconductor substrate provided at the first multilayer resin substrate and including a high frequency circuit; and a conductive heat spreader provided at an opposite face of the semiconductor substrate from a face of the semiconductor substrate facing the first multilayer resin substrate. The microwave device includes: a resin provided over the first multilayer resin substrate and covering the semiconductor substrate and the heat spreader such that an opposite face of the heat spreader from a face of the heat spreader facing the semiconductor substrate is exposed as an exposed face; and a conductive film covering the resin and the heat spreader and touching the exposed face. The semiconductor substrate includes a ground through hole extending through the semiconductor substrate. The conductive film is electrically connected to the ground via hole via the heat spreader and the ground through hole.Type: ApplicationFiled: September 12, 2018Publication date: July 29, 2021Applicant: Mitsubishi Electric CorporationInventors: Yukinobu TARUI, Makoto KIMURA, Katsumi MIYAWAKI, Kiyoshi ISHIDA, Hiroaki MATSUOKA
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Patent number: 11062832Abstract: A cavity is formed in a surface of a dielectric component on the permanent magnet side. The cavity has a bottom surface extending in a direction along one main surface and a side surface extending in a thickness direction crossing the bottom surface. At least a part of the permanent magnet is disposed in the cavity. A surface of at least a part of the permanent magnet disposed in the cavity is fixed to both of the bottom surface and the side surface through an adhesive.Type: GrantFiled: February 26, 2018Date of Patent: July 13, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Tetsuya Ueda, Hironobu Shibata, Yukinobu Tarui, Hidenori Ishibashi
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Publication number: 20210142935Abstract: A cavity is formed in a surface of a dielectric component on the permanent magnet side. The cavity has a bottom surface extending in a direction along one main surface and a side surface extending in a thickness direction crossing the bottom surface. At least a part of the permanent magnet is disposed in the cavity. A surface of at least a part of the permanent magnet disposed in the cavity is fixed to both of the bottom surface and the side surface through an adhesive.Type: ApplicationFiled: February 26, 2018Publication date: May 13, 2021Applicant: Mitsubishi Electric CorporationInventors: Tetsuya Ueda, Hironobu Shibata, Yukinobu Tarui, Hidenori Ishibashi
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Publication number: 20210134733Abstract: A microwave device includes: a multilayer resin substrate being a first multilayer resin substrate; an IC being a radio frequency circuit provided on the multilayer resin substrate and electrically connected to the multilayer resin substrate; a heat spreader provided on a side opposite to the multilayer resin substrate across the IC, and in contact with the IC; a mold resin covering the periphery of the IC and the heat spreader; and a conductive film covering the mold resin and the heat spreader, where an inner side of the conductive film is in contact with the heat spreader, and the conductive film is electrically connected to a ground via hole of the multilayer resin substrate.Type: ApplicationFiled: February 22, 2018Publication date: May 6, 2021Applicant: Mitsubishi Electric CorporationInventors: Yukinobu TARUI, Makoto KIMURA, Katsumi MIYAWAKI, Kiyoshi ISHIDA, Hiroaki MATSUOKA
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Patent number: 10944143Abstract: In a non-reciprocal circuit element, a permanent magnet is connected to one main surface of a magnetic plate, and a circuit board is connected to the other main surface of the magnetic plate, with a solder bump lying between the circuit board and the other main surface. The permanent magnet can control the transmission of electrical signal from each of a plurality of signal conductors of circuit board to a corresponding one of a plurality of input/output terminals of the magnetic plate. The non-reciprocal circuit element further includes an underfill material arranged between the magnetic plate and the circuit board. The magnetic plate has a through hole formed therein, the through hole extending from one main surface to the other main surface. The through hole has an empty space in which at least a part of a conductive film arranged in the through hole is exposed.Type: GrantFiled: April 21, 2017Date of Patent: March 9, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Tetsuya Ueda, Hironobu Shibata, Yukinobu Tarui, Hidenori Ishibashi
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Patent number: 10916520Abstract: A semiconductor device includes a substrate, a semiconductor element, a ground pad, an insulating coating member, a conductive bonding member, and a conductive cap. The inner peripheral end of a bottom of the conductive cap is disposed at a side close to the inner periphery of the insulating coating member relative to the outer peripheral end of the insulating coating member. The bottom has a shape in which the distance between the main surface and itself decreases continuously from its outer peripheral end toward its inner peripheral end.Type: GrantFiled: June 1, 2016Date of Patent: February 9, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Kiyoshi Ishida, Makoto Kimura, Katsumi Miyawaki, Yukinobu Tarui, Keiko Shirafuji
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Patent number: 10756026Abstract: A semiconductor device functioning properly by maintaining an electromagnetic shielding structure by a conductor layer is provided. A semiconductor device includes a wiring board having a surface, a semiconductor element, an insulating layer, and a conductor layer. The semiconductor element is arranged on the surface of the wiring board. The insulating layer is located on the surface of the wiring board and arranged to surround the semiconductor element. The conductor layer covers an outer peripheral surface of the insulating layer, and is connected to the wiring board. The outer peripheral surface of the insulating layer includes an upper surface located over the semiconductor element, and a side surface connecting the upper surface and the wiring board. The side surface includes a reverse tapered portion. The conductor layer is in contact with a surface of the reverse tapered portion.Type: GrantFiled: May 29, 2017Date of Patent: August 25, 2020Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Kiyoshi Ishida, Yukinobu Tarui
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Patent number: 10707910Abstract: A microwave module includes an RF device and a multilayer resin substrate. The device includes a metal cover covering at least an internal circuit. The substrate includes a first end face on a side of the device, a second end face on a side opposite to the first end face, a signal through-holes surrounding the circuit and connected to the circuit, ground through-holes surrounding the signal through-holes and connected to the cover, a first surface ground provided on the first end face and connected to the cover, an inner layer surface ground connected to ground through-holes, and an RF transmission line surrounded by the ground through-holes, the first surface ground, and the inner layer surface ground, and connected to the signal through-hole.Type: GrantFiled: December 7, 2016Date of Patent: July 7, 2020Assignee: Mitsubishi Electric CorporationInventors: Yukinobu Tarui, Makoto Kimura, Isamu Ryokawa, Akimichi Hirota, Hiroyuki Mizutani
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Patent number: 10512153Abstract: A printed wiring board includes conductor layers, a core layer having an opening, and a build-up layer. A high frequency device placed within the opening is installed such that a mirror surface is thermally connected to a conductor layer for heat dissipation facing the opening from a lower surface side of the core layer, and terminals on the terminal surface are electrically connected to conductor layers formed on an upper surface side of the core layer.Type: GrantFiled: April 27, 2016Date of Patent: December 17, 2019Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Hidenori Ishibashi, Kiyoshi Ishida, Eigo Kuwata, Yukinobu Tarui, Hideharu Yoshioka, Hiroyuki Aoyama, Masaomi Tsuru
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Publication number: 20190306969Abstract: Lossy members, which are disposed to overlap with a part of branch conductors in a signal conductor, respectively, and cause a loss of the power of signals flowing in the branch conductors, and via holes connecting each of the output terminals of the signal conductor and the ground conductor are included. The branch conductor includes a delay circuit having an electrical length of 90 degrees.Type: ApplicationFiled: December 26, 2016Publication date: October 3, 2019Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Hidenori ISHIBASHI, Yukinobu TARUI, Yuko ONODERA, Hiroyuki AOYAMA, Naofumi YONEDA
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Publication number: 20190295959Abstract: A semiconductor device functioning properly by maintaining an electromagnetic shielding structure by a conductor layer is provided. A semiconductor device includes a wiring board having a surface, a semiconductor element, an insulating layer, and a conductor layer. The semiconductor element is arranged on the surface of the wiring board. The insulating layer is located on the surface of the wiring board and arranged to surround the semiconductor element. The conductor layer covers an outer peripheral surface of the insulating layer, and is connected to the wiring board. The outer peripheral surface of the insulating layer includes an upper surface located over the semiconductor element, and a side surface connecting the upper surface and the wiring board. The side surface includes a reverse tapered portion. The conductor layer is in contact with a surface of the reverse tapered portion.Type: ApplicationFiled: May 29, 2017Publication date: September 26, 2019Applicant: Mitsubishi Electric CorporationInventors: Kiyoshi ISHIDA, Yukinobu TARUI
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Publication number: 20190159332Abstract: A printed wiring board includes conductor layers, a core layer having an opening, and a build-up layer. A high frequency device placed within the opening is installed such that a mirror surface is thermally connected to a conductor layer for heat dissipation facing the opening from a lower surface side of the core layer, and terminals on the terminal surface are electrically connected to conductor layers formed on an upper surface side of the core layer.Type: ApplicationFiled: April 27, 2016Publication date: May 23, 2019Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Hidenori ISHIBASHI, Kiyoshi ISHIDA, Eigo KUWATA, Yukinobu TARUI, Hideharu YOSHIOKA, Hiroyuki AOYAMA, Masaomi TSURU
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Publication number: 20190139702Abstract: An irreversible circuit element that can reduce manufacturing costs by preventing faults that lead to product defects includes a magnetic body, a magnetic body securing casing, and a magnet. The magnetic body securing casing is arranged so as to surround the magnetic body. The magnet is arranged on one side of the magnetic body. The magnetic body securing casing includes a first electrode on one casing main surface arranged on the one side, a second electrode on the other casing main surface arranged on the other side opposite to the one side, and a through-conductor that passes through the magnetic body securing casing and electrically connects the first electrode to the second electrode. The first electrode is connected to a first wiring arranged on the one side of the magnetic body.Type: ApplicationFiled: November 4, 2016Publication date: May 9, 2019Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Yoichi KITAMURA, Tetsuya UEDA, Hironobu SHIBATA, Yukinobu TARUI
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Publication number: 20190123413Abstract: In a non-reciprocal circuit element, a permanent magnet is connected to one main surface of a magnetic plate, and a circuit board is connected to the other main surface of the magnetic plate, with a solder bump lying between the circuit board and the other main surface. The permanent magnet can control the transmission of electrical signal from each of a plurality of signal conductors of circuit board to a corresponding one of a plurality of input/output terminals of the magnetic plate. The non-reciprocal circuit element further includes an underfill material arranged between the magnetic plate and the circuit board. The magnetic plate has a through hole formed therein, the through hole extending from one main surface to the other main surface. The through hole has an empty space in which at least a part of a conductive film arranged in the through hole is exposed.Type: ApplicationFiled: April 21, 2017Publication date: April 25, 2019Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tetsuya Ueda, Hironobu Shibata, Yukinobu Tarui, Hidenori Ishibashi
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Publication number: 20180351595Abstract: A microwave module includes an RF device and a multilayer resin substrate. The device includes a metal cover covering at least an internal circuit. The substrate includes a first end face on a side of the device, a second end face on a side opposite to the first end face, a signal through-holes surrounding the circuit and connected to the circuit, ground through-holes surrounding the signal through-holes and connected to the cover, a first surface ground provided on the first end face and connected to the cover, an inner layer surface ground connected to ground through-holes, and an RF transmission line surrounded by the ground through-holes, the first surface ground, and the inner layer surface ground, and connected to the signal through-hole.Type: ApplicationFiled: December 7, 2016Publication date: December 6, 2018Applicant: Mitsubishi Electric CorporationInventors: Yukinobu TARUI, Makoto KIMURA, Isamu RYOKAWA, Akimichi HIROTA, Hiroyuki MIZUTANI
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Publication number: 20180158794Abstract: A semiconductor device includes a substrate, a semiconductor element, a ground pad, an insulating coating member, a conductive bonding member, and a conductive cap. The inner peripheral end of a bottom of the conductive cap is disposed at a side close to the inner periphery of the insulating coating member relative to the outer peripheral end of the insulating coating member. The bottom has a shape in which the distance between the main surface and itself decreases continuously from its outer peripheral end toward its inner peripheral end.Type: ApplicationFiled: June 1, 2016Publication date: June 7, 2018Applicant: Mitsubishi Electric CorporationInventors: Kiyoshi ISHIDA, Makoto KIMURA, Katsumi MIYAWAKI, Yukinobu TARUI, Keiko SHIRAFUJI
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Patent number: 7612633Abstract: The present invention provides a high-frequency switch including: a first switching element connected between a first input/output terminal and a second input/output terminal; a second switching element connected between the second input/output terminal and the first switching element; a high-frequency line provided between the first input/output terminal, the first switching element, and a third input/output terminal; and a third switching element connected between the third input/output terminal, the high-frequency line, and a ground. By connecting the first switching element, the second switching element, the high-frequency line, and the third switching element, because there exists no FET through which a large current flows when a state between the first input/output terminal and the third input/output terminal is set to a transmission state which requires high power handling capability, there is no need to use an FET having a large gate width, which is effective in reducing a loss of the switch.Type: GrantFiled: May 15, 2007Date of Patent: November 3, 2009Assignee: Mitsubishi Electric CorporationInventors: Masatake Hangai, Yukinobu Tarui, Tamotsu Nishino, Yoshitsugu Yamamoto, Moriyasu Miyazaki, Yoji Isota