Patents by Inventor Yukinori Hatori
Yukinori Hatori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955410Abstract: An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member. A first oxide film is provided on a surface of the first lead frame. A second oxide film is provided on a surface of the second lead frame. The first lead frame and the second lead frame are electrically connected to each other by the connection member.Type: GrantFiled: July 27, 2022Date of Patent: April 9, 2024Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yukinori Hatori, Yasushi Araki, Akinobu Inoue, Tsukasa Nakanishi
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Patent number: 11929342Abstract: A semiconductor device includes: a lead frame that is formed of metal; a wiring substrate that is opposed to the lead frame; an electronic component that is disposed between the lead frame and the wiring substrate; a connection member that connects lead frame and the wiring substrate; and encapsulating resin that is filled between the lead frame and the wiring substrate and covers the electronic component and the connection member. The lead frame includes: a first surface opposed to the wiring substrate and covered by the encapsulating resin; a second surface located on a back side of the first surface and exposed from the encapsulating resin; and a side surface neighboring first surface or the second surface, at least a portion of the side surface exposed from the encapsulating resin.Type: GrantFiled: October 28, 2020Date of Patent: March 12, 2024Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Futoshi Tsukada, Yukinori Hatori, Yoshiyuki Sawamura
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Publication number: 20230276575Abstract: An embedded PCB includes a first substrate, an electronic component mounted on the first substrate, a second substrate provided on a side opposite to the first substrate with the electronic component interposed therebetween, and electrically connected to the first substrate via substrate bonding members, and an encapsulating resin filled between the first and second substrates, covering the electronic component, and also filled between the electronic component and the first substrate. The first substrate includes, on a side closer to the electronic component, pads to be bonded to electrodes of the electronic component via bonding portions, and a protective insulating layer including openings. The pads include outermost peripheral pads in an outermost periphery including four corners of an approximately rectangular area in a plan view, and inner pads in an area surrounded by the outermost peripheral pads.Type: ApplicationFiled: February 15, 2023Publication date: August 31, 2023Inventors: Yukinori HATORI, Takashi KURIHARA, Kiyoshi OI
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Patent number: 11552004Abstract: A wiring substrate includes a first metal plate and a second electrode. The first metal plate includes a first electrode, a wiring, and a mount portion for an electronic component. The mount portion includes an upper surface of the wiring. The second electrode is joined to an upper surface of the first electrode. The first electrode is solid. The second electrode is solid.Type: GrantFiled: April 19, 2021Date of Patent: January 10, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takayuki Matsumoto, Tsukasa Nakanishi, Yukinori Hatori
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Publication number: 20220367326Abstract: An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member. A first oxide film is provided on a surface of the first lead frame. A second oxide film is provided on a surface of the second lead frame. The first lead frame and the second lead frame are electrically connected to each other by the connection member.Type: ApplicationFiled: July 27, 2022Publication date: November 17, 2022Inventors: Yukinori Hatori, Yasushi Araki, Akinobu Inoue, Tsukasa Nakanishi
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Patent number: 11452210Abstract: An embodiment is a wiring substrate that includes a first metal plate. The first metal plate includes a first electrode and a wiring, and the wiring includes a mount portion for an electronic component. The wiring substrate further includes a second metal plate. The second metal plate includes a second electrode diffusion-bonded to an upper surface of the first electrode. The second metal plate includes a first opening that exposes the mount portion. The first opening is large enough to accommodate the electronic component.Type: GrantFiled: November 10, 2020Date of Patent: September 20, 2022Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takayuki Matsumoto, Tsukasa Nakanishi, Yukinori Hatori
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Patent number: 11444006Abstract: An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member. A first oxide film is provided on a surface of the first lead frame. A second oxide film is provided on a surface of the second lead frame. The first lead frame and the second lead frame are electrically connected to each other by the connection member.Type: GrantFiled: June 26, 2020Date of Patent: September 13, 2022Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yukinori Hatori, Yasushi Araki, Akinobu Inoue, Tsukasa Nakanishi
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Publication number: 20210335695Abstract: A wiring substrate includes a first metal plate and a second electrode. The first metal plate includes a first electrode, a wiring, and a mount portion for an electronic component. The mount portion includes an upper surface of the wiring. The second electrode is joined to an upper surface of the first electrode. The first electrode is solid. The second electrode is solid.Type: ApplicationFiled: April 19, 2021Publication date: October 28, 2021Inventors: Takayuki Matsumoto, Tsukasa Nakanishi, Yukinori Hatori
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Publication number: 20210153355Abstract: An embodiment is a wiring substrate that includes a first metal plate. The first metal plate includes a first electrode and a wiring, and the wiring includes a mount portion for an electronic component. The wiring substrate further includes a second metal plate. The second metal plate includes a second electrode diffusion-bonded to an upper surface of the first electrode. The second metal plate includes a first opening that exposes the mount portion. The first opening is large enough to accommodate the electronic component.Type: ApplicationFiled: November 10, 2020Publication date: May 20, 2021Inventors: Takayuki Matsumoto, Tsukasa Nakanishi, Yukinori Hatori
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Publication number: 20210134754Abstract: A semiconductor device includes: a lead frame that is formed of metal; a wiring substrate that is opposed to the lead frame; an electronic component that is disposed between the lead frame and the wiring substrate; a connection member that connects lead frame and the wiring substrate; and encapsulating resin that is filled between the lead frame and the wiring substrate and covers the electronic component and the connection member. The lead frame includes: a first surface opposed to the wiring substrate and covered by the encapsulating resin; a second surface located on a back side of the first surface and exposed from the encapsulating resin; and a side surface neighboring first surface or the second surface, at least a portion of the side surface exposed from the encapsulating resin.Type: ApplicationFiled: October 28, 2020Publication date: May 6, 2021Inventors: Futoshi Tsukada, Yukinori Hatori, Yoshiyuki Sawamura
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Publication number: 20200411419Abstract: An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member. A first oxide film is provided on a surface of the first lead frame. A second oxide film is provided on a surface of the second lead frame. The first lead frame and the second lead frame are electrically connected to each other by the connection member.Type: ApplicationFiled: June 26, 2020Publication date: December 31, 2020Inventors: Yukinori Hatori, Yasushi Araki, Akinobu Inoue, Tsukasa Nakanishi
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Patent number: 10818580Abstract: An electronic component device includes a first lead frame having a first connection terminal and an electronic component. The first connection terminal includes a first metal electrode, a first pad part formed on an upper surface of the first metal electrode and formed by a metal plated layer, and a first metal oxide layer formed on an upper surface of the first metal electrode in a surrounding region of the first pad part so as to surround an outer periphery of the first pad part. The electronic component has a first terminal part provided on its lower surface. The first terminal part of the electronic component is connected to the first pad part of the first connection terminal via a metal joining material.Type: GrantFiled: July 6, 2018Date of Patent: October 27, 2020Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Yukinori Hatori
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Publication number: 20190013262Abstract: An electronic component device includes a first lead frame having a first connection terminal and an electronic component. The first connection terminal includes a first metal electrode, a first pad part formed on an upper surface of the first metal electrode and formed by a metal plated layer, and a first metal oxide layer formed on an upper surface of the first metal electrode in a surrounding region of the first pad part so as to surround an outer periphery of the first pad part. The electronic component has a first terminal part provided on its lower surface. The first terminal part of the electronic component is connected to the first pad part of the first connection terminal via a metal joining material.Type: ApplicationFiled: July 6, 2018Publication date: January 10, 2019Inventor: Yukinori Hatori
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Patent number: 9490233Abstract: A fingerprint recognition semiconductor device includes an insulation layer, a wiring pattern formed on a lower surface of the insulation layer, and a sensor element flip-chip-connected to the wiring pattern. The sensor element includes an active surface, including a sensor portion that recognizes a fingerprint, and a rear surface, located at a side opposite to the active surface. An encapsulation resin fills a gap between the lower surface of the insulation layer and an upper surface of a wiring substrate, facing the rear surface of the sensor element and connected to the wiring pattern by a connecting member. The entire active surface of the sensor element is covered by underfill formed between the active surface of the sensor element and the lower surface of the insulation layer. The insulation layer includes an upper surface, defining an uppermost surface and free from a wiring layer.Type: GrantFiled: September 29, 2015Date of Patent: November 8, 2016Assignee: Shinko Electric Industries Co., LTD.Inventors: Yukinori Hatori, Takashi Ozawa, Kazuya Kojima, Futoshi Tsukada
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Patent number: 9397061Abstract: A semiconductor device includes a wiring layer formed on a first surface of a first insulation layer and including an external connection pad and an internal connection pad located at an inner side of the external connection pad. A semiconductor element facing the first surface of the first insulation layer includes an electrode pad located corresponding to the internal connection pad, a bump formed on the electrode pad and connected to the internal connection pad, and a circuit element region defined in a first surface of the semiconductor element at an inner side of the electrode pad. A second insulation layer fills a gap between the first surfaces of the semiconductor element and the first insulation layer. A third insulation layer covers a second surface of the semiconductor element and the second insulation layer and includes an opening that exposes the external connection pad connected to an external connection terminal.Type: GrantFiled: January 7, 2015Date of Patent: July 19, 2016Assignee: Shinko Electric Industries Co., Ltd.Inventors: Yukinori Hatori, Takashi Ozawa
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Publication number: 20160099232Abstract: A fingerprint recognition semiconductor device includes an insulation layer, a wiring pattern formed on a lower surface of the insulation layer, and a sensor element flip-chip-connected to the wiring pattern. The sensor element includes an active surface, including a sensor portion that recognizes a fingerprint, and a rear surface, located at a side opposite to the active surface. An encapsulation resin fills a gap between the lower surface of the insulation layer and an upper surface of a wiring substrate, facing the rear surface of the sensor element and connected to the wiring pattern by a connecting member. The entire active surface of the sensor element is covered by underfill formed between the active surface of the sensor element and the lower surface of the insulation layer. The insulation layer includes an upper surface, defining an uppermost surface and free from a wiring layer.Type: ApplicationFiled: September 29, 2015Publication date: April 7, 2016Applicant: Shinko Electric Industries Co., Ltd.Inventors: Yukinori Hatori, Takashi Ozawa, Kazuya Kojima, Futoshi Tsukada
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Publication number: 20150200175Abstract: A semiconductor device includes a wiring layer formed on a first surface of a first insulation layer and including an external connection pad and an internal connection pad located at an inner side of the external connection pad. A semiconductor element facing the first surface of the first insulation layer includes an electrode pad located corresponding to the internal connection pad, a bump formed on the electrode pad and connected to the internal connection pad, and a circuit element region defined in a first surface of the semiconductor element at an inner side of the electrode pad. A second insulation layer fills a gap between the first surfaces of the semiconductor element and the first insulation layer. A third insulation layer covers a second surface of the semiconductor element and the second insulation layer and includes an opening that exposes the external connection pad connected to an external connection terminal.Type: ApplicationFiled: January 7, 2015Publication date: July 16, 2015Inventors: Yukinori HATORI, Takashi OZAWA
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Publication number: 20120126423Abstract: According to an aspect of the present invention, there is provided a semiconductor device manufacturing method, including: preparing a support plate having a mounting portion on which a mounting terminal is mountable; preparing a circuit board having a mounting surface on which a semiconductor chip is mounted and a connection pad is formed; bringing the support plate to face the mounting surface of the circuit board, and connecting the support plate to the connection pad through the mounting terminal; forming a resin layer between the support plate and the mounting surface of the circuit board to cover the mounting terminal; and removing the support plate, thereby faulting a via in the resin layer along a shape of the mounting portion so as to expose the mounting terminal therethrough.Type: ApplicationFiled: November 21, 2011Publication date: May 24, 2012Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yukinori Hatori, Takashi Ozawa