Patents by Inventor Yukinori Nakayama

Yukinori Nakayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11943871
    Abstract: A component mounter for mounting electronic components includes a mounting head with at least two suction nozzles in the multiple suction nozzles are lowered simultaneously so as to pick up at least two electronic components simultaneously. A control device, which is configured to control electronic component pickup and mounting operations, causes the mounting head to move so as to position the at least two suction nozzles that are lowered simultaneously in an electronic component pickup operation step to be located individually on at least two trays on the pallet, causes the at least two suction nozzles to be lowered simultaneously, and causes electronic components on the at least two trays to be picked up simultaneously.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: March 26, 2024
    Assignee: FUJI CORPORATION
    Inventor: Yukinori Nakayama
  • Publication number: 20230363131
    Abstract: An information processing device of the present disclosure is used in a mounting system including multiple mounting-related devices each having a display section that visually notifies an operator of information and an attachment portion to which a member is attached and related to a process of mounting a component on a processing target object, and a moving work device that is moved between the multiple mounting-related devices to automatically attach and detach the member to and from the attachment portion. The information processing device includes a control section that outputs, to the display section, notification information including work details that are substitutable by the operator in association with a status of the moving work device based on a predetermined priority order based on continuation of processes of the mounting-related devices.
    Type: Application
    Filed: March 17, 2022
    Publication date: November 9, 2023
    Applicant: FUJI CORPORATION
    Inventors: Yukinori NAKAYAMA, Mitsuaki OIKI
  • Publication number: 20220347848
    Abstract: A work management system is applied to a work area in which a predetermined work is executed by a worker and a robot. The work management system includes a control section configured to control the robot such that a specified operation set in advance is included in an operation by the robot executing the predetermined work, an information acquisition section configured to acquire work information indicating a presence or absence of the specified operation in at least one of an execution result and an execution process of the predetermined work, and an identification section configured to identify whether a work subject of the predetermined work is the worker or the robot based on the work information acquired by the information acquisition section.
    Type: Application
    Filed: July 5, 2019
    Publication date: November 3, 2022
    Applicant: FUJI CORPORATION
    Inventor: Yukinori NAKAYAMA
  • Patent number: 11417548
    Abstract: A component mounting machine includes a control device that controls a wafer supply device and a component transfer device. The control device includes a die information storage section storing the position of the dies stored in the wafer supply device associated with a rank of the dies, a block information acquisition section acquiring the condition of the dies to be mounted on a block provided on a board, a rank designation section designating the rank of the die to be picked up by the component transfer device, and a position designation section designating the position of the die to be picked up by the component transfer device. The position designation section designates the position of the die so that the die having the rank designated by the rank designation section is continuously picked up over the multiple wafers stored in the wafer supply device.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: August 16, 2022
    Assignee: FUJI CORPORATION
    Inventors: Yukinori Nakayama, Shinichi Fujii
  • Publication number: 20220132712
    Abstract: A component mounter for mounting electronic components includes a mounting head with at least two suction nozzles in the multiple suction nozzles are lowered simultaneously so as to pick up at least two electronic components simultaneously. A control device, which is configured to control electronic component pickup and mounting operations, causes the mounting head to move so as to position the at least two suction nozzles that are lowered simultaneously in an electronic component pickup operation step to be located individually on at least two trays on the pallet, causes the at least two suction nozzles to be lowered simultaneously, and causes electronic components on the at least two trays to be picked up simultaneously.
    Type: Application
    Filed: February 14, 2019
    Publication date: April 28, 2022
    Applicant: FUJI CORPORATION
    Inventor: Yukinori NAKAYAMA
  • Patent number: 11239101
    Abstract: A wafer supply device configured to supply a wafer divided into multiple dies to a supply position, the wafer supply device includes a die information storage section configured to store the number of dies for each rank allocated to each of the dies, a block information acquisition section configured to acquire a condition of dies to be mounted on a block provided on a board to be conveyed, a required block number acquisition section configured to acquire a required number of dies to be mounted on the block, and a producible number calculation section configured to calculate a number of blocks that can be produced based on a content stored in the die information storage section and a content acquired by the block information acquisition section and the required block number acquisition section.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: February 1, 2022
    Assignee: FUJI CORPORATION
    Inventors: Yukinori Nakayama, Shinichi Fujii
  • Publication number: 20200234984
    Abstract: A component mounting machine includes a control device that controls a wafer supply device and a component transfer device. The control device includes a die information storage section storing the position of the dies stored in the wafer supply device associated with a rank of the dies, a block information acquisition section acquiring the condition of the dies to be mounted on a block provided on a board, a rank designation section designating the rank of the die to be picked up by the component transfer device, and a position designation section designating the position of the die to be picked up by the component transfer device. The position designation section designates the position of the die so that the die having the rank designated by the rank designation section is continuously picked up over the multiple wafers stored in the wafer supply device.
    Type: Application
    Filed: March 9, 2017
    Publication date: July 23, 2020
    Applicant: FUJI CORPORATION
    Inventors: Yukinori NAKAYAMA, Shinichi FUJII
  • Publication number: 20200013651
    Abstract: A wafer supply device configured to supply a wafer divided into multiple dies to a supply position, the wafer supply device includes a die information storage section configured to store the number of dies for each rank allocated to each of the dies, a block information acquisition section configured to acquire a condition of dies to be mounted on a block provided on a board to be conveyed, a required block number acquisition section configured to acquire a required number of dies to be mounted on the block, and a producible number calculation section configured to calculate a number of blocks that can be produced based on a content stored in the die information storage section and a content acquired by the block information acquisition section and the required block number acquisition section.
    Type: Application
    Filed: March 9, 2017
    Publication date: January 9, 2020
    Applicant: FUJI CORPORATION
    Inventors: Yukinori NAKAYAMA, Shinichi FUJII
  • Patent number: 10032650
    Abstract: A die mounting system in which die supply device is set on component mounter and dies supplied from die supply device are mounted on circuit board by mounting head of component mounter, determines the next die transfer position is determined such that the longer of time required for die transfer preparation operation (die imaging and image processing, die pickup operation, and movement and vertical inverting operation of a supply head) of die supply device and time required for die mounting operation (movement and vertical motion at the mounting position of mounting head) of component mounter is made shorter, and the difference (which corresponds to the waiting time at the die transfer position) between the two times decreased, such that the cycle time is shortened.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: July 24, 2018
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Yukinori Nakayama, Kenji Nakai, Satoshi Yoshioka
  • Patent number: 9974216
    Abstract: A supply head of a die supply apparatus is detachably held by a head holding unit of a head moving mechanism. The supply head held by the head holding unit is replaceable with a supply head having the same number of nozzles as the number of nozzles of a mounting head of a component mounting machine. A nozzle arrangement of the supply head of the die supply apparatus has the same arrangement as a nozzle arrangement of the mounting head of the component mounting machine.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: May 15, 2018
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Hideyasu Takamiya, Yukinori Nakayama
  • Patent number: 9966247
    Abstract: A wafer component supply device supplying a wafer component and a feeder, such as a tape feeder supplying an electronic component, are set in a component mounting machine. When the wafer component is to be inverted and mounted on a circuit substrate, the wafer component supply device allows the wafer component present on an inverted supply head to be sucked by a mounting head of the component mounting machine at a position where the supply head and a stage are moved down by a vertical movement mechanism.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: May 8, 2018
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Yukinori Nakayama, Hideyasu Takamiya
  • Patent number: 9958799
    Abstract: An electrostatic latent image developing toner includes a plurality of toner particles each having: a sea-like domain substantially formed from a plurality of resins including at least a polyester resin containing an alcohol component having a carbon number of 2-6; and a plurality of island-like domains distributed in an island-like pattern in the sea-like domain. The island-like domains are substantially formed from a resin containing a nigrosine pigment. A dispersion diameter of the island-like domains is 0.1-1.0 ?m. The polyester resin containing the alcohol component having a carbon number of 2-6 is contained in the sea-like domain in an amount of 5-50% by mass relative to a total amount of constituent resins (the plurality of resins). A ratio of an SP value of the resins forming the sea-like domain to an SP value of the resin forming the island-like domain is no greater than 0.98 or at least 1.20.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: May 1, 2018
    Assignee: KYOCERA Document Solutions Inc.
    Inventors: Toshiki Takemori, Yukinori Nakayama
  • Patent number: 9887111
    Abstract: In a die mounting system in which a die supply device is set on a component mounter and dies supplied from a die supply device are mounted on a circuit board by a mounting head of the component mounter, the position of a die is recognized by processing an image of the die on a dicing sheet captured by a camera, a supply head is moved to a die pickup position by a supply head moving mechanism, the die is picked up, the supply head is vertically inverted and moved to a die transfer position, and the die held by the supply head is picked up by a mounting head of the component mounter at a component transfer position and mounted on the circuit board. The die transfer position is set at a position such that die transfer and die imaging are able to be performed in parallel.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: February 6, 2018
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Yukinori Nakayama, Kenji Nakai, Satoshi Yoshioka
  • Patent number: 9740128
    Abstract: A positively chargeable toner for electrostatic latent image development includes toner particles. The toner particles each include a toner core containing boron nitride and a shell layer disposed over a surface of the toner core. The boron nitride is contained in an amount of no less than 0.05% by mass and no greater than 35% by mass relative to total mass of the toner core. The boron nitride has a thermal conductivity of no less than 40 W/m·K and no greater than 220 W/m·K.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: August 22, 2017
    Assignee: KYOCERA Document Solutions Inc.
    Inventors: Toshiki Takemori, Yukinori Nakayama, Masaki Okita, Hiroki Uemura, Takamichi Mori
  • Publication number: 20170235241
    Abstract: An electrostatic latent image developing toner includes a plurality of toner particles each having: a sea-like domain substantially formed from a plurality of resins including at least a polyester resin containing an alcohol component having a carbon number of 2-6; and a plurality of island-like domains distributed in an island-like pattern in the sea-like domain. The island-like domains are substantially formed from a resin containing a nigrosine pigment. A dispersion diameter of the island-like domains is 0.1-1.0 ?m. The polyester resin containing the alcohol component having a carbon number of 2-6 is contained in the sea-like domain in an amount of 5-50% by mass relative to a total amount of constituent resins (the plurality of resins). A ratio of an SP value of the resins forming the sea-like domain to an SP value of the resin forming the island-like domain is no greater than 0.98 or at least 1.20.
    Type: Application
    Filed: February 8, 2017
    Publication date: August 17, 2017
    Applicant: KYOCERA Document Solutions Inc.
    Inventors: Toshiki TAKEMORI, Yukinori NAKAYAMA
  • Publication number: 20170140960
    Abstract: In a die mounting system in which a die supply device is set on a component mounter and dies supplied from a die supply device are mounted on a circuit board by a mounting head of the component mounter, the position of a die is recognized by processing an image of the die on a dicing sheet captured by a camera, a supply head is moved to a die pickup position by a supply head moving mechanism, the die is picked up, the supply head is vertically inverted and moved to a die transfer position, and the die held by the supply head is picked up by a mounting head of the component mounter at a component transfer position and mounted on the circuit board. The die transfer position is set at a position such that die transfer and die imaging are able to be performed in parallel.
    Type: Application
    Filed: March 24, 2014
    Publication date: May 18, 2017
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Yukinori NAKAYAMA, Kenji NAKAI, Satoshi YOSHIOKA
  • Patent number: 9632442
    Abstract: An electrostatic latent image developing toner includes toner particles that each include a toner core containing a binder resin and a shell layer disposed over a surface of the toner core. The binder resin includes a crystalline polyester resin and an amorphous polyester resin. The crystalline polyester resin has a melting point of at least 80° C. and no greater than 120° C. When the electrostatic latent image developing toner is measured using a differential scanning calorimeter, a glass transition point is observed in a first run but is not observed in a second run. The shell layer contains a resin including a thermosetting component and a thermoplastic component.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: April 25, 2017
    Assignee: KYOCERA Document Solutions Inc.
    Inventors: Masaki Okita, Yukinori Nakayama, Toshiki Takemori, Takamichi Mori, Hiroki Uemura
  • Publication number: 20170110342
    Abstract: A die mounting system in which die supply device is set on component mounter and dies supplied from die supply device are mounted on circuit board by mounting head of component mounter, determines the next die transfer position is determined such that the longer of time required for die transfer preparation operation (die imaging and image processing, die pickup operation, and movement and vertical inverting operation of a supply head) of die supply device and time required for die mounting operation (movement and vertical motion at the mounting position of mounting head) of component mounter is made shorter, and the difference (which corresponds to the waiting time at the die transfer position) between the two times decreased, such that the cycle time is shortened.
    Type: Application
    Filed: March 24, 2014
    Publication date: April 20, 2017
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Yukinori NAKAYAMA, Kenji NAKAI, Satoshi YOSHIOKA
  • Patent number: 9383667
    Abstract: An electrostatic latent image developing toner includes toner particles. Each of the toner particles includes a toner core containing a binder resin and a releasing agent, and a shell layer coating the toner core. The releasing agent has a melting point Mpr of no less than 50° C. and no greater than 100° C. The releasing agent has a number average dispersion diameter of no less than 30 nm and no greater than 500 nm. The shell layer is made from a resin including a unit derived from a monomer of a thermosetting resin. The thermosetting resin is one or more amino resins from among a melamine resin, a urea resin, and a glyoxal resin.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: July 5, 2016
    Assignee: KYOCERA Document Solutions Inc.
    Inventors: Toshiki Takemori, Masashi Yamashita, Hiroki Uemura, Yukinori Nakayama, Masaki Okita
  • Publication number: 20160139524
    Abstract: An electrostatic latent image developing toner includes toner particles that each include a toner core containing a binder resin and a shell layer disposed over a surface of the toner core. The binder resin includes a crystalline polyester resin and an amorphous polyester resin. The crystalline polyester resin has a melting point of at least 80° C. and no greater than 120° C. When the electrostatic latent image developing toner is measured using a differential scanning calorimeter, a glass transition point is observed in a first run but is not observed in a second run. The shell layer contains a resin including a thermosetting component and a thermoplastic component.
    Type: Application
    Filed: November 16, 2015
    Publication date: May 19, 2016
    Applicant: KYOCERA DOCUMENT SOLUTIONS INC.
    Inventors: Masaki OKITA, Yukinori NAKAYAMA, Toshiki TAKEMORI, Takamichi MORI, Hiroki UEMURA