Patents by Inventor Yukinori Sumi

Yukinori Sumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test method using semiconductor test apparatus
    Patent number: 6518784
    Abstract: A semiconductor test apparatus tests a semiconductor device having plate connection terminals. The apparatus includes a test substrate having deformable connection parts connected with the plate connection terminals, and an upholding substrate which has upholding parts formed to project at a position that faces the connection part and which urges, in cooperation with the test substrate, the connection parts toward the plate connection terminals of the semiconductor device so as to electrically connect the connection parts to the plate connection terminals.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: February 11, 2003
    Assignee: Fujitsu Limited
    Inventors: Norio Fukasawa, Yukinori Sumi
  • Semiconductor inspection apparatus and inspection method using the apparatus
    Patent number: 6388461
    Abstract: A semiconductor inspection apparatus performs a test on a to-be-inspected device which has a spherical connection terminal. This apparatus includes a conductor layer formed on a supporting film. The conductor layer has a connection portion. The spherical connection terminal is connected to the connection portion. At least a shape of the connection portion is changeable. The apparatus further includes a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting the connection portion.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: May 14, 2002
    Assignee: Fujitsu Limited
    Inventors: Norio Fukasawa, Yukinori Sumi
  • Semiconductor test apparatus and test method using the same
    Publication number: 20020036509
    Abstract: A semiconductor test apparatus tests a semiconductor device having plate connection terminals. The apparatus includes a test substrate having deformable connection parts connected with the plate connection terminals, and an upholding substrate which has upholding parts formed to project at a position that faces the connection part and which urges, in cooperation with the test substrate, the connection parts toward the plate connection terminals of the semiconductor device so as to electrically connect the connection parts to the plate connection terminals.
    Type: Application
    Filed: October 31, 2001
    Publication date: March 28, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Norio Fukasawa, Yukinori Sumi
  • Semiconductor test apparatus and test method using the same
    Patent number: 6333638
    Abstract: A semiconductor test apparatus tests a semiconductor device having plate connection terminals. The apparatus includes a test substrate having deformable connection parts connected with the plate connection terminals, and an upholding substrate which has upholding parts formed to project at a position that faces the connection part and which urges, in cooperation with the test substrate, the connection parts toward the plate connection terminals of the semiconductor device so as to electrically connect the connection parts to the plate connection terminals.
    Type: Grant
    Filed: October 7, 1997
    Date of Patent: December 25, 2001
    Assignee: Fujitsu Limited
    Inventors: Norio Fukasawa, Yukinori Sumi
  • Semiconductor inspection apparatus and inspection method using the apparatus
    Publication number: 20010010469
    Abstract: A semiconductor inspection apparatus performs a test on a to-be-inspected device which has a spherical connection terminal. This apparatus includes a conductor layer formed on a supporting film. The conductor layer has a connection portion. The spherical connection terminal is connected to said connection portion. At least a shape of said connection portion is changeable. The apparatus further includes a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting said connection portion.
    Type: Application
    Filed: March 14, 2001
    Publication date: August 2, 2001
    Applicant: FUJITSU LIMITED
    Inventors: Norio Fukasawa, Yukinori Sumi
  • Semiconductor inspection apparatus and inspection method using the apparatus
    Patent number: 6246249
    Abstract: A semiconductor inspection apparatus performs a test on a to-be-inspected device which has a spherical connection terminal. This apparatus includes a conductor layer formed on a supporting film. The conductor layer has a connection portion. The spherical connection terminal is connected to the connection portion. At least a shape of the connection portion is changeable. The apparatus further includes a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting the connection portion.
    Type: Grant
    Filed: October 6, 1997
    Date of Patent: June 12, 2001
    Assignee: Fujitsu Limited
    Inventors: Norio Fukasawa, Yukinori Sumi
  • Semiconductor device including pad portion for testing
    Patent number: 5767528
    Abstract: A semiconductor device includes a semiconductor element; a wiring board including a base film on which a plurality of leads are provided; projecting electrodes, provided in an array, projecting from a lower surface of the wiring board; a plurality of leads, each of which has an inner lead portion connected to the semiconductor element and an outer lead portion connected to the projecting electrodes; a mounting hole provided in the base film for mounting the semiconductor element; and a supporting member supporting the wiring board and having a cavity for accommodating the semiconductor element in a position corresponding to the mounting hole. A pad portion for measurement is provided at a position spaced from the outer lead portion.
    Type: Grant
    Filed: August 2, 1996
    Date of Patent: June 16, 1998
    Assignee: Fujitsu Limited
    Inventors: Yukinori Sumi, Norio Fukasawa