Patents by Inventor Yukio Arimitsu

Yukio Arimitsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200230536
    Abstract: The air filter medium of the present invention is an air filter medium including a stack of a porous polytetrafluoroethylene (PTFE) membrane and an air-permeable support member, a repulsive force generated in the medium when the medium is compressed in a thickness direction thereof is equal to or greater than 30 kPa and equal to or less than 150 kPa at a compression ratio of 30%, and at least one main surface of the air filter medium is formed by the air-permeable support member and has a maximum coefficient of friction of 24 gf or less. The air filter medium of the present invention is an air filter medium that uses a porous PTFE membrane and in which a decrease in collection efficiency due to pleating is inhibited.
    Type: Application
    Filed: September 21, 2018
    Publication date: July 23, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuri HORIE, Masaaki MORI, Yukio ARIMITSU
  • Publication number: 20160285120
    Abstract: A manufacturing method for a fuel-cell membrane electrode assembly, which is excellent in handling property of a polymer electrolyte membrane, can prevent deformation of the polymer electrolyte membrane and the occurrence of a wrinkle therein, and allows efficient mounting of the polymer electrolyte membrane, a gas diffusion electrode, and/or a gas diffusion layer.
    Type: Application
    Filed: October 8, 2014
    Publication date: September 29, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takeshi NAKANO, Tsukasa SATO, Toshiaki MASAKI, Hiroyuki NISHII, Takeshi MATSUMURA, Yukio ARIMITSU
  • Publication number: 20160254559
    Abstract: Provided is a pressure-sensitive adhesive sheet for conveying an electrolyte membrane capable of contributing to improving a handling property at the time of conveyance of a polymer electrolyte membrane, and to preventing deformation of the polymer electrolyte membrane and preventing the occurrence of a wrinkle therein during processing of a membrane electrode assembly (MEA). The pressure-sensitive adhesive sheet for conveying an electrolyte membrane of the present invention includes: a base material; and a pressure-sensitive adhesive layer arranged on one surface or each of both surfaces of the base material, in which the pressure-sensitive adhesive layer has a pressure-sensitive adhesive strength which lowers or disappears through an external stimulus. In one embodiment, the pressure-sensitive adhesive layer contains thermally expandable microspheres.
    Type: Application
    Filed: October 8, 2014
    Publication date: September 1, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takeshi NAKANO, Tsukasa SATO, Toshiaki MASAKI, Hiroyuki NISHII, Takeshi MATSUMURA, Yukio ARIMITSU
  • Patent number: 9120955
    Abstract: The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet, containing a heat-releasable pressure-sensitive adhesive layer containing a heat-expandable microsphere on one side of a substrate, and a pressure-sensitive adhesive layer for temporary fixing on another side of the substrate, in which the pressure-sensitive adhesive layer for temporary fixing has a tensile pressure-sensitive adhesive strength of 2.0 to 20 N/20 mm in width and an amount of displacement of 0.3 mm/20 mm in width or less, and the pressure-sensitive adhesive layer for temporary fixing is crosslinked with an isocyanate or epoxy crosslinking agent.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: September 1, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventor: Yukio Arimitsu
  • Publication number: 20140002953
    Abstract: The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet, containing a heat-releasable pressure-sensitive adhesive layer containing a heat-expandable microsphere on one side of a substrate, and a pressure-sensitive adhesive layer for temporary fixing on another side of the substrate, in which the pressure-sensitive adhesive layer for temporary fixing has a tensile pressure-sensitive adhesive strength of 2.0 to 20 N/20 mm in width and an amount of displacement of 0.3 mm/20 mm in width or less, and the pressure-sensitive adhesive layer for temporary fixing is crosslinked with an isocyanate or epoxy crosslinking agent.
    Type: Application
    Filed: January 17, 2012
    Publication date: January 2, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventor: Yukio Arimitsu
  • Publication number: 20130344274
    Abstract: The present invention is for providing a pressure-sensitive adhesive tape for protecting the surface of semiconductor parts which transfers little foreign matter to an object (part) to be adhered in a manufacturing process, the pressure-sensitive adhesive tape comprising at least a base material film, a pressure-sensitive adhesive layer, and a peeling liner, the base material film having the pressure-sensitive adhesive layer on one surface thereof, and the peeling liner using an unprocessed plastic film which does not contain a releasing layer being formed on the pressure-sensitive adhesive layer.
    Type: Application
    Filed: January 18, 2012
    Publication date: December 26, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Junji Fukuhara, Yukio Arimitsu
  • Publication number: 20130335879
    Abstract: The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet, containing a heat-releasable pressure-sensitive adhesive layer containing a heat-expandable microsphere on one side of a substrate and a pressure-sensitive adhesive layer for temporary fixing on another side of the substrate, in which the pressure-sensitive adhesive layer for temporary fixing has a shear pressure-sensitive adhesive strength of 2.0 N/200 mm2 or more and a tensile pressure-sensitive adhesive strength of 0.01 to 2.0 N/20 mm in width, and the pressure-sensitive adhesive layer for temporary fixing is crosslinked with an isocyanate or epoxy crosslinking agent.
    Type: Application
    Filed: January 17, 2012
    Publication date: December 19, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventor: Yukio Arimitsu
  • Publication number: 20130251985
    Abstract: Provided is a laminate including a thermoplastic resin layer and a substrate, which has superior transparency, is resistant to “warping”, and is advantageous for the encapsulation and surface protection of opto-electronic devices. The laminate includes a substrate; a thermoplastic resin layer having a thickness of more than 200 ?m and less than or equal to 500 ?m; and a pressure-sensitive adhesive layer lying between the substrate and thermoplastic resin layer and bonding them to each other, in which the thermoplastic resin layer has a 180-degree peel strength of 1.0 N/25 mm or more with respect to the pressure-sensitive adhesive layer at 23° C. The laminate preferably has a total luminous transmittance of 80% or more.
    Type: Application
    Filed: December 5, 2011
    Publication date: September 26, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tadatoshi Nakanishi, Yukio Arimitsu, Toshio Shintani, Shigeki Kawabe, Shinsuke Ikishima
  • Publication number: 20130244377
    Abstract: The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, which includes a base material layer having a glass transition temperature exceeding 180° C., and a pressure-sensitive adhesive layer having an elastic modulus at 180° C. of 1.0×105 Pa or more, which is formed on one side or both sides of the base material layer. The heat-resistant pressure-sensitive adhesive tape of the present invention can be used for temporarily fixing a chip in a production method of a substrateless semiconductor package which does not use a metal frame (for example, a production method of WLP).
    Type: Application
    Filed: March 13, 2012
    Publication date: September 19, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventor: Yukio ARIMITSU
  • Publication number: 20130237017
    Abstract: The present invention provides a pressure-sensitive adhesive tape for resin encapsulation in production of a resin encapsulation type semiconductor device, which includes a base material layer which does not have a glass transition temperature in a temperature region of 260° C. or lower and a pressure-sensitive adhesive layer laminated on the base material layer, and a method for producing a resin encapsulation type semiconductor device using the pressure-sensitive adhesive tape. The pressure-sensitive adhesive tape according to the present invention highly prevents resin leakage even under severe conditions as in MAP-QFN production process, does not affect certainty of wire bonding and has excellent peelability after resin encapsulation.
    Type: Application
    Filed: March 8, 2012
    Publication date: September 12, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroyuki KONDO, Shinji HOSHINO, Yukio ARIMITSU, Akinori NISHIO
  • Patent number: 8524007
    Abstract: A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 ?m or less and a maximum height Rz of 1.0 ?m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: September 3, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata
  • Patent number: 8524361
    Abstract: The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of ?40° C. to 30° C.
    Type: Grant
    Filed: March 3, 2010
    Date of Patent: September 3, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Kazuki Soejima, Takamasa Hirayama, Daisuke Shimokawa, Masaaki Sato, Yukio Arimitsu
  • Patent number: 8475600
    Abstract: A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 ?m or less and a maximum height Rz of 1.0 ?m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.
    Type: Grant
    Filed: October 12, 2006
    Date of Patent: July 2, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata
  • Patent number: 8436481
    Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: May 7, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Shinji Hoshino, Yukio Arimitsu, Kazuyuki Kiuchi, Akihisa Murata
  • Patent number: 8409884
    Abstract: The process for producing an organic EL panel according to the present invention is a process for producing an organic electroluminescent panel by forming an organic electroluminescent element on an ultrathin glass plate by vacuum deposition method, including forming electrodes on the ultrathin glass plate, by temporarily fixing the ultrathin glass plate to a supporting plate via a double-sided adhesive tape having a thermal release adhesive layer formed at least on one face of the base material layer, containing heat-expandable microspheres that start expansion and/or foaming at temperature higher than the vacuum deposition temperature.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: April 2, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Takamasa Hirayama, Akihisa Murata, Yukio Arimitsu, Takashi Yamaoka, Masaaki Sato
  • Publication number: 20120222805
    Abstract: The present invention provides a manufacturing method for efficiently and stably forming a pattern on a thin-film substrate. A thin-film substrate, a tackiness adhesive sheet for thin-film substrate fixing, and a hard substrate are laminated in this order and a porous base material functioning as a core material of the tackiness adhesive sheet for thin-film substrate fixing has bore holes. Therefore, even if preliminary heating and drying is not applied, air bubbles are not generated between the thin-film substrate and the tackiness adhesive sheet for fixing during pattern formation on the thin-film substrate. This makes it possible to stably and efficiently form a pattern.
    Type: Application
    Filed: March 2, 2012
    Publication date: September 6, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshio SHINTANI, Yukio ARIMITSU
  • Publication number: 20120223455
    Abstract: The present invention provides a manufacturing method for efficiently and stably forming a pattern on a thin-film substrate. The method for manufacturing the thin-film substrate includes: stacking the thin-film substrate, a tackiness/adhesive agent for temporary fixing and a hard substrate in this order; fixing the thin-film substrate on the hard substrate through the tackiness/adhesive agent; then forming the pattern; and subsequently peeling the thin-film substrate at an interface between the thin-film substrate and the tackiness/adhesive agent.
    Type: Application
    Filed: March 2, 2012
    Publication date: September 6, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshio SHINTANI, Yukio ARIMITSU
  • Publication number: 20110200744
    Abstract: The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 ?m, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 ?m. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.
    Type: Application
    Filed: April 26, 2011
    Publication date: August 18, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takamasa HIRAYAMA, Kazuyuki Kiuchi, Masaaki Sato, Yukio Arimitsu, Daisuke Shimokawa, Tomoko Kishimoto
  • Publication number: 20110151625
    Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 23, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinji HOSHINO, Yukio ARIMITSU, Kazuyuki KIUCHI, Akihisa MURATA
  • Publication number: 20110124136
    Abstract: Provided is a process for producing an organic EL panel by using an ultrathin glass plate, in which the ultrathin glass plate is not “fractured” or “cut” in the production process, the organic EL element is formed reliably when formed by vacuum deposition, and recovered without damage after the production process, and there is no need for installing an additional step of cleaning the rear face of the ultrathin glass plate.
    Type: Application
    Filed: June 30, 2009
    Publication date: May 26, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takamasa Hirayama, Akihisa Murata, Yukio Arimitsu, Takashi Yamaoka, Masaaki Sato