Abstract: A cooling structure is provided. The cooling structure includes cooling surfaces on two confronting side surfaces; a plurality of double-sided-cooling power module, the heat receiving block pinching the heating elements arranged in a vertical direction on the confronting side surfaces, first and second cooling devices, each including the heat radiating fins, disposed above the heating elements, extending in a horizontal direction, and a pressure contacting part configured to contact the heating elements and the receiving block with a pressure force. The heat radiation fins are blown from a side of the electric terminal.

Abstract: A cooling structure of a heating element includes: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate which has a shape complying with the cooling surface and in which holes are formed at positions facing each pin fin, each pin fin being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heating element and the heat receiving plate while pressing the heating element and the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element.

Abstract: A module of conversion circuit includes a High side IGBT, a Low side IGBT connected in series to the High side IGBT, a first terminal connected to the High side IGBT, a second terminal connected to the Low side IGBT, a capacitor connected to the first terminal and the second terminal, and a third terminal connected to a connection point between the High side IGBT and the Low side IGBT. A fourth terminal is engaged with the first terminal. A fifth terminal is engaged with the second terminal. A sixth terminal is engaged with the third terminal. The first and second terminals have at portions thereof between front edges and rear edges high-resistance parts having higher resistance than other portions.

Abstract: An electric power converter is provided with: a power semiconductor module, which has a power semiconductor element that converts a direct current into an alternating current; a capacitor module, which has a capacitor element that smooths the direct current; and a cooling body, which cools the power semiconductor module and the capacitor module. The capacitor module has: a case, which has an approximately rectangular shape, has an opening formed in one surface, and has a space for housing the capacitor element; and a DC conductor for electrically connecting the power semiconductor element and the capacitor element to each other. The cooling body is formed to face the bottom surface on the inner wall of the case, and both the side surfaces of the case, the side surfaces facing each other. Between the capacitor element and the inner wall surfaces of the case, the direct current conductor is formed along the bottom surface and both the side surfaces of the case.

Abstract: To improve accessibility with respect to a power conversion unit in a power converter. The power converter includes a circuit, connection part including a positive electrode conductor, a negative electrode conductor and an AC conductor, a power semiconductor module positioned in a particular direction with respect to the circuit connection part and connected to the positive electrode conductor, the negative electrode conductor and the AC conductor and a capacitor positioned in the particular direction with respect to the circuit connection part and connected to the positive electrode conductor and the negative electrode conductor. The positive electrode conductor is connected to a positive electrode conductor of another power conversion unit through a unit connection part positioned in an opposite direction of the particular direction with respect to the circuit connection part.

Abstract: The purpose of the present invention is to reduce the wiring inductance of a power semiconductor module.

Abstract: A cooling structure of a heating element includes: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate which has a shape complying with the cooling surface and in which holes are formed at positions facing each pin fin, each pin fin being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heating element and the heat receiving plate while pressing the heating element and the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element.

Abstract: A power conversion device capable of reducing a temperature variation between a plurality of semiconductor modules is provided. The power conversion device comprises condensers 121, 122, a plurality of semiconductor modules 101, 102, heat dissipation units 103 to 109, a bus bar 140 connecting the condensers 121, 122 with the plurality of the semiconductor modules 101, 102, and a ventilation unit having cool wind blow. The power conversion module has features that the plurality of semiconductor modules 101, 102 are arranged apart from the condensers 121, 122 and in a line in a longitudinal direction of the bus bar 140 and that the cool wind 150 blows in a direction from the condensers 121, 122 toward the plurality of semiconductor modules 101, 102 that are mounted.

Abstract: A cooling structure is provided. The cooling structure includes cooling surfaces on two confronting side surfaces; a plurality of double-sided-cooling power module, the heat receiving block pinching the heating elements arranged in a vertical direction on the confronting side surfaces, first and second cooling devices, each including the heat radiating fins, disposed above the heating elements, extending in a horizontal direction, and a pressure contacting part configured to contact the heating elements and the receiving block with a pressure force. The heat radiation fins are blown from a side of the electric terminal.

Abstract: The purpose of the present invention is to reduce the wiring inductance of a power semiconductor module.

Abstract: An electric power converter is provided with: a power semiconductor module, which has a power semiconductor element that converts a direct current into an alternating current; a capacitor module, which has a capacitor element that smooths the direct current; and a cooling body, which cools the power semiconductor module and the capacitor module. The capacitor module has a case, which has an approximately rectangular shape, has an opening formed in one surface, and has a space for housing the capacitor element; and a DC conductor for electrically connecting the power semiconductor element and the capacitor element to each other. The cooling body is formed to face the bottom surface on the inner wall of the case, and both the side surfaces of the case, the side surfaces facing each other. Between the capacitor element and the inner wall surfaces of the case, the direct current conductor is formed along the bottom surface and both the side surfaces of the case.

Abstract: A power conversion device comprises a power semiconductor device, first and second conductor plates joined to the power semiconductor device, first and second insulating member, a case made of metal which stores the components, and a channel-forming structure made of metal. Part of the case is fixed to the metallic channel-forming structure via a third insulating member. Leakage current caused by the switching operation of the power semiconductor device is transmitted to the channel-forming structure via a series circuit including parasitic capacitance of the first insulating member and/or parasitic capacitance of the second insulating member and parasitic capacitance of the third insulating member.

Abstract: A circuit board, included in an inverter device that outputs AC current to a motor for driving a vehicle, includes: an insulation layer; a first conductor formed on a first side of the insulation layer, and upon which a semiconductor chip included in a lower arm of an inverter circuit is mounted; a second conductor formed on a second side of the insulation layer opposite to the first side thereof, and connected to a ground of the vehicle; and an inductor connected in parallel with a parasitic capacitance created between the first conductor and the second conductor, thus constituting a parallel resonator together with the parasitic capacitance.

Abstract: A method for laying a sheet over the lower surface of a base material disposed in a generally horizontal position. According to the method, the base material is supported at the lower surface thereof by a first support means, and the sheet is placed immediately below and in facing relation to the lower surface of the base material and then supported at the lower surface thereof by a second support means. The sheet and the base material are made to be in contact with each other over partial surfaces thereof. Subsequently, the first support means is moved away from the base material and the sheet and the base material are placed together on a rigid horizontal surface so that the sheet is laid substantially over the entire lower surface of the base material.

Abstract: The present invention discloses a method for laying a sheet over the lower surface of a base material disposed in a generally horizontal position. According to the method, the base material is supported at the lower surface thereof by a first support means, and the sheet is placed immediately below and in facing relation to the lower surface of the base material and then supported at the lower surface thereof by a second support means. The sheet and the base material are made to be in contact with each other over partial surfaces thereof. Subsequently, the first support means is moved away from the base material and the sheet and the base material are placed together on a rigid horizontal surface so that the sheet is laid substantially over the entire lower surface of the base material.

Abstract: The present invention relates to diamide derivatives represented by the following general formula (1): wherein A is a phenyl group or the like, which may be substituted, B is —CH═CH—, —C≡C—, —(CH═CH)2—, —C≡C—CH═CH—, —CH═CH—C≡C—, phenylene or the like, and W is and medicines comprising such a compound. These compounds have an excellent inhibitory effect on the production of an IgE antibody and are hence useful as antiallergic agents and the like.

Abstract: The invention relates to compounds represented by the following general formula (1): wherein A is an aromatic compound which may be substituted, or the like, B is a nitrogen atom or CH, X is a lower alkylene group which may be substituted, or the like, Y is a single bond or the like; Z is a divalent residue of benzene which may be substituted, or the like, and m and n are independently an integer of 1 to 4, and medicines comprising such a compound. These compounds have an excellent inhibitory effect on the production of an IgE antibody and are hence useful as antiallergic agents and the like.

Abstract: Compounds having the formula (1): wherein A is a phenyl, naphthyl, dihydronaphthyindeny, pyridyl, indolyl,isoindolyl, quinolyl or isoquinolyl group which are optionally substituted; X is optionally substituted alicyclic, aromatic, imino or heterocyclic groups or —S— or —O—; Y is a single bond or an alkylene group; Z is an unsubstituted aliphatic group or divalent residue of benzene or pyridine, which is optionally substituted; anis hydrogen, lower alkyl, cycloalkyl, aryl or aralkyl; with certain provisos. These compounds exhibit an inhibitory effect on the production of IgE antibodies and are, hence, useful as antiallergic agents.

Abstract: A sound absorbing structure including a sound absorbing member, an air layer, and a resonant sound absorbing structure. The air layer is formed in the rear of the sound absorbing member. The resonant sound absorbing structure includes a slit and is formed in the rear of the sound absorbing member. The sound absorbing member is a surface plate covering the rear air layer and the resonant sound absorbing structure, and the sound absorbing member is shaped in one of a plate and plane.

Abstract: The invention relates to compounds represented by the following general formula (1): 1