Abstract: A defect inspection apparatus including: a first illumination optical system which is configured to illuminate the inspection area on a sample surface from a normal line direction or a direction near thereof with respect to said sample surface; a second illumination optical system which is configured to illuminate said inspection area from a slant direction with respect to said sample surface; a detection optical system having a plurality of first detectors which are located, in front of, on the sides of, and behind said inspection area, respectively, with respect to the illumination direction of said second illumination optical system, and where the regular reflected light component, from said sample surface, by illumination light of said second illumination optical system, is not converged; and a signal processing system which is configured to inspect a defect, upon basis of signals obtained from said plurality of first detectors.

Abstract: A defect inspection apparatus including: a first illumination optical system which is configured to illuminate the inspection area on a sample surface from a normal line direction or a direction near thereof with respect to said sample surface; a second illumination optical system which is configured to illuminate said inspection area from a slant direction with respect to said sample surface; a detection optical system having a plurality of first detectors which are located, in front of, on the sides of, and behind said inspection area, respectively, with respect to the illumination direction of said second illumination optical system, and where the regular reflected light component, from said sample surface, by illumination light of said second illumination optical system, is not converged; and a signal processing system which is configured to inspect a defect, upon basis of signals obtained from said plurality of first detectors.

Abstract: A defect inspection apparatus including: a first illumination optical system which is configured to illuminate the inspection area on a sample surface from a normal line direction or a direction near thereof with respect to said sample surface; a second illumination optical system which is configured to illuminate said inspection area from a slant direction with respect to said sample surface; a detection optical system having a plurality of first detectors which are located, in front of, on the sides of, and behind said inspection area, respectively, with respect to the illumination direction of said second illumination optical system, and where the regular reflected light component, from said sample surface, by illumination light of said second illumination optical system, is not converged; and a signal processing system which is configured to inspect a defect, upon basis of signals obtained from said plurality of first detectors.

Abstract: A defect inspection apparatus including: a first illumination optical system which is configured to illuminate the inspection area on a sample surface from a normal line direction or a direction near thereof with respect to said sample surface; a second illumination optical system which is configured to illuminate said inspection area from a slant direction with respect to said sample surface; a detection optical system having a plurality of first detectors which are located, in front of, on the sides of, and behind said inspection area, respectively, with respect to the illumination direction of said second illumination optical system, and where the regular reflected light component, from said sample surface, by illumination light of said second illumination optical system, is not converged; and a signal processing system which is configured to inspect a defect, upon basis of signals obtained from said plurality of first detectors.

Abstract: The invention provides a surface inspection apparatus and a method for inspecting the surface of a sample that are capable of inspecting discriminatingly between the scratch of various configuration and the adhered foreign object that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to polishing process such as CMP or grinding process in semiconductor manufacturing process or magnetic head manufacturing process.

Abstract: An apparatus for detecting defects, including: a table unit which mounts a specimen to be inspected having a linearly moving stage and a rotationally moving stage; a first illumination optical unit which illuminates an inspection region of a surface of the specimen from a normal direction or in the vicinity of the normal direction while the specimen is rotating by the rotationally moving stage and moving in one direction by the linearly moving stage; a second illumination optical unit which illuminates the inspection region from a first elevation angle toward the inspection region while the specimen is rotating and moving; a first detection optical unit which detects light reflected from the inspection region by the illumination of the first illumination optical unit or the second illumination optical unit with plural detectors arranged in plural portions of a second elevation angle toward the inspection region; a second detection optical unit which detects light reflected from the inspection region by the il

Abstract: A scanning probe microscope provided with a cantilever 21 having a probe 20 facing a sample 12, a measurement unit 24 measuring a physical quantity occurring between the probe and sample, and movement mechanisms 11, 29 changing a positional relationship between the probe and sample to cause a scanning operation and making the probe scan the surface of the sample by the movement mechanism and measure the surface of the sample by the measurement unit.

Abstract: An apparatus for detecting defects, including: a first illumination optical unit which illuminates from a normal direction or in the vicinity of the normal direction; a second illumination optical unit which illuminates from a first elevation angle; a first detection optical unit which detects light reflected by the illumination of the first illumination optical unit or the second illumination optical unit with plural detectors; a second detection optical unit which detects light reflected by the illumination of the first illumination optical unit or the second illumination optical unit with plural detectors; wherein the plural detectors of the first detection optical unit and the plural detectors of the second detection optical unit are photomultipliers, and the signal processor processes the signals outputted from the photomultipliers and are adjusted to balance in sensitivities.

Abstract: A probe is made by attaching a carbon nanotube 12 to a mounting base end 13, which eliminates the effects of a carbon contamination film, to increase the bonding strength, increase the conductivity of the probe, and strengthen the bonding performance thereof by coating the entire circumference of the nanotube and the base with a coating film, rather than coating just one side. The work of mounting the carbon nanotube and mounting base end are performed under observation by a microscope. Further, the carbon contamination film 14 formed by an electron microscope is stripped off at a stage before bonding by the coating film.

Abstract: The probe tip movement control method of the scanning probe microscope is used for a scanning probe microscope provided with a cantilever 21 having a probe tip 20 facing a sample 12. The atomic force occurring between the probe tip and sample is measured when the probe tip scans the surface of the sample. X-, Y-, and Z-fine movement mechanisms 23, 29, and 30 are used to relatively change the positions of the probe tip and sample. It is possible to maintain a high measurement accuracy and enable scan movement of a probe tip on a sample surface by simple control when measuring a part having a gradient in measurement of an uneven shape on a sample surface.

Abstract: A scanning probe microscope has a cantilever with a probe facing a sample and a measurement section for measuring a physical quantity occurring between the probe and the sample when the probe scans a surface of the sample, holding the physical quantity constant to measure the surface of the sample. The above microscope further has a probe tilt mechanism, an optical microscope etc. for detecting a position of the probe when the probe is tilted, and a control section for setting the probe in a first tilt posture and second tilt posture, measuring a surface of the sample by the measurement section at each tilt posture, detecting the position of the probe at least at the second tilt posture by the optical microscope etc., and making a measurement location at the second tilt posture match with a measurement location at the first tilt posture for measurement.

Abstract: A surface inspection apparatus and a method for inspecting the surface of a sample are capable of inspecting discriminatingly between scratches of various configuration and adhered foreign objects that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to a polishing process such as CMP or a grinding process, in semiconductor manufacturing process or magnetic head manufacturing process. In the invention, the scratch and foreign object that occur on the polished or ground surface of the sample is epi-illuminated and slant-illuminated by use of approximately same light flux, the difference between the scattered light intensity from the shallow scratch and from the foreign object is applied to thereby discriminate between the shallow scratch and the foreign object, and the directionality of the scattered light is detected to discriminate between the linear scratch and the foreign object.

Abstract: An apparatus for detecting defects, including: a first illumination optical unit which illuminates from a normal direction or in the vicinity of the normal direction; a second illumination optical unit which illuminates from a first elevation angle; a first detection optical unit which detects light reflected by the illumination of the first illumination optical unit or the second illumination optical unit with plural detectors; a second detection optical unit which detects light reflected by the illumination of the first illumination optical unit or the second illumination optical unit with plural detectors; wherein the plural detectors of the first detection optical unit and the plural detectors of the second detection optical unit are photomultipliers, and the signal processor processes the signals outputted from the photomultipliers and are adjusted to balance in sensitivities.

Abstract: The probe tip movement control method of the scanning probe microscope is used for a scanning probe microscope provided with a cantilever 21 having a probe tip 20 facing a sample 12. The atomic force occurring between the probe tip and sample is measured when the probe tip scans the surface of the sample. X-, Y-, and Z-fine movement mechanisms 23, 29, and 30 are used to relatively change the positions of the probe tip and sample. It is possible to maintain a high measurement accuracy and enable scan movement of a probe tip on a sample surface by simple control when measuring a part having a gradient in measurement of an uneven shape on a sample surface.

Abstract: A method of producing a probe by attaching a carbon nanotube etc. to a mounting base end and bonding it there using a carbon film etc., which method of producing a probe eliminates the effects of a carbon contamination film to increase the bonding strength, increases the conductivity of the probe, and strengthens the bonding performance by coating the entire circumference rather than coating one side, the probe, and a scanning probe microscope are provided. The method of producing a probe is a method of producing a probe comprised of a carbon nanotube 12, a mounting base ends 13 holding this carbon nanotube, and a coating film 17 bonding the carbon nanotube to a mounting base, comprising performing the mounting work of the carbon nanotube and mounting base end under observation by a microscope and stripping off the carbon contamination film 14 formed by an electron microscope at a stage before bonding by the coating film.

Abstract: A surface inspection apparatus and a method for inspecting the surface of a sample are capable of inspecting discriminatingly between scratches of various configuration and adhered foreign objects that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to a polishing process such as CMP or a grinding process, in semiconductor manufacturing process or magnetic head manufacturing process. In the invention, the scratch and foreign object that occur on the polished or ground surface of the sample is epi-illuminated and slant-illuminated by use of approximately same light flux, the difference between the scattered light intensity from the shallow scratch and from the foreign object is applied to thereby discriminate between the shallow scratch and the foreign object, and the directionality of the scattered light is detected to discriminate between the linear scratch and the foreign object.

Abstract: The invention provides a surface inspection apparatus and a method for inspecting the surface of a sample that are capable of inspecting discriminatingly between the scratch of various configuration and the adhered foreign object that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to polishing process such as CMP or grinding process in semiconductor manufacturing process or magnetic head manufacturing process.

Abstract: A scanning probe microscope has a cantilever with a probe facing a sample and a measurement section for measuring a physical quantity occurring between the probe and the sample when the probe scans a surface of the sample, holding the physical quantity constant to measure the surface of the sample. The above microscope further has a probe tilt mechanism, an optical microscope etc. for detecting a position of the probe when the probe is tilted, and a control section for setting the probe in a first tilt posture and second tilt posture, measuring a surface of the sample by the measurement section at each tilt posture, detecting the position of the probe at least at the second tilt posture by the optical microscope etc., and making a measurement location at the second tilt posture match with a measurement location at the first tilt posture for measurement.

Abstract: The invention provides a surface inspection apparatus and a method for inspecting the surface of a sample that are capable of inspecting discriminatingly between the scratch of various configuration and the adhered foreign object that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to polishing process such as CMP or grinding process in semiconductor manufacturing process or magnetic head manufacturing process.