Abstract: An optical position sensing component includes an input light guiding portion and a received light guiding portion. The input light guiding portion is constituted by a polymer waveguide and inputs a light emitted from a near-infrared light-emitting source and outputs the light to a lens for collimate through a plurality of ends. The received light guiding portion is constituted by a polymer waveguide and inputs the light output from the light guiding portion and outputs the input light to a near-infrared light-receiving device. Further, the polymer waveguide has a core portion composed of a cured photosensitive resin composition.

Abstract: A radiation-sensitive resin composition for optical waveguides having high dimensional accuracy, good transmission characteristics, and excellent bending resistance is provided. The composition comprises: (A) a poly(meth)acrylate having a repeating unit represented by the following general formula (1) (in the formula, R1 is a hydrogen atom or a methyl group, R3 is a (meth)acryloyl group, X is a bivalent organic group); (B) an urethane (meth)acrylate compound which is a reaction product of a polyester polyol compound, a polyisocyanate compound, and a (meth) acrylate having a hydroxyl group; (C) a compound having at least one ethylenically unsaturated group and having a boiling point of 130 degree C. or higher under 0.1 MPa other than components (A) and (B); and (D) a photo-radical polymerization initiator. The composition was used as the material for the lower clad layer 12 of the optical waveguide 24, and the like.

Abstract: There is provided a photosensitive resin composition for forming an optical waveguide which has high shape precision and excellent transmission characteristics under high temperature and high humidity. A composition of the present invention contains (A) a polymer having structures represented by the following general formulae (1) and (2) (in the formulae, each of R1 and R2 is independently a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; R3is an organic group containing a radical-polymerizable reactive group; X is a single bond or a bivalent organic group; and Y is a non-polymerizable organic group), (B) a compound having at least one ethylenic unsaturated group in the molecule thereof, having a molecular weight below 1,000 and having a boiling point of at least 130° C. at 0.1 MPa, and (C) a photoradical polymerization initiator.

Abstract: A component including a part having a concave and convex configuration for one of the enabling one of light convergence, light diffusion and light diffraction, being formed as a reflective film. The outline of the concave and convex configuration viewed from a right angle relative to a horizontal face has a half moon-shape, and a direction of a straight line part of the half moon-shape of each concave and convex configuration matches a direction of the horizontal face, and a plurality of the concave and convex configurations are combined.

Abstract: A microlens array having a substrate and microlenses of a substantially circular profile provided on the substrate and each arranged such that a major axis and a minor axis thereof, which pass through a center of the substantially circular profile and intersect at 90 degrees, are substantially equal in length to each other, and sectional forms at faces vertical to an axis parallel to the major axis or the minor axis are, respectively, made of the same curved shape at any position.

Abstract: A component including a part having a concave and convex configuration for one of the enabling one of light convergence, light diffusion and light diffraction, being formed as a reflective film. The outline of the concave and convex configuration viewed from a right angle relative to a horizontal face has a half moon-shape, and a direction of a straight line part of the half moon-shape of each concave and convex configuration matches a direction of the horizontal face, and a plurality of the concave and convex configurations are combined.

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.

Abstract: A microlens configuration having a substantially circular form is constituted of a part of one circle or aspheric curve at any section when a section is taken at a face which is vertical to a major axis or a minor axis of the microlens configuration. A laminate for transfer includes a concave and convex pattern having concave and convex forms of a transfer master pattern, in which a number of such configurations as mentioned above are arranged, transferred to a substrate to be transferred, and a thin film layer laminated on the concave and convex surface thereof wherein a surface of the thin film layer opposite to a surface in contact with a provisional support is used as a bonding face to an application substrate.

Abstract: A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.

Abstract: A microlens configuration having a substantially circular form is constituted of a part of one circle or aspheric curve at any section when a section is taken at a face which is vertical to a major axis or a minor axis of the microlens configuration. A laminate for transfer includes a concave and convex pattern having concave and convex forms of a transfer master pattern, in which a number of such configurations as mentioned above are arranged, transferred to a substrate to be transferred, and a thin film layer laminated on the concave and convex surface thereof wherein a surface of the thin film layer opposite to a surface in contact with a provisional support is used as a bonding face to an application substrate.

Abstract: There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process. In the present invention, a differential thermal analysis curve of a sample of the lead-free solder material is obtained by utilizing a differential thermal analysis method, and thereby a quality of the lead-free solder material used for a flow soldering process is estimated based on the obtained differential thermal analysis curve.

Abstract: A microlens configuration having a substantially circular form is constituted of a part of one circle or aspheric curve at any section when a section is taken at a face which is vertical to a major axis or a minor axis of the microlens configuration. A laminate for transfer includes a concave and convex pattern having concave and convex forms of a transfer master pattern, in which a number of such configurations as mentioned above are arranged, transferred to a substrate to be transferred, and a thin film layer laminated on the concave and convex surface thereof wherein a surface of the thin film layer opposite to a surface in contact with a provisional support is used as a bonding face to an application substrate.

Abstract: A multi-layer wiring substrate capable of high density packaging, and a method of manufacturing the same, in which a carrier substrate, in which through holes can be easily formed in high density corresponding substantially to a pitch of connecting terminals in a semiconductor chip, and build-up layers are formed on the substrate with the application of a conventional build-up technique. When the build-up technique for repeatedly forming insulating layers and wiring layers on a carrier substrate is used to manufacture a multi-layer wiring substrate, the carrier substrate is formed in the following manner. First, an insulating resin layer is formed in a copper foil, in which a plurality of first windows are regularly provided, to cover the copper foil, and the resin layer fills the interior of the windows.

Abstract: A multi-layer wiring substrate capable of high density packaging, and a method of manufacturing the same, in which a carrier substrate, in which through holes can be easily formed in high density corresponding substantially to a pitch of connecting terminals in a semiconductor chip, and build-up layers are formed on the substrate with the application of a conventional build-up technique. When the build-up technique for repeatedly forming insulating layers and wiring layers on a carrier substrate is used to manufacture a multi-layer wiring substrate, the carrier substrate is formed in the following manner. First, an insulating resin layer is formed in a copper foil, in which a plurality of first windows are regularly provided, to cover the copper foil, and the resin layer fills the interior of the windows.

Abstract: A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material.

Abstract: It is realized that a solder material is sufficiently supplied to a through hole formed through a board by a spraying mode flux applying method in a flow soldering process for mounting an electronic component onto the board by means of a solder material.

Abstract: An oscillating piston type compressor has a piston formed integral with a blade. The compressor accommodates in a casing a compression mechanism section and a motor section, the mechanism including the piston having a plate-shaped blade integrally formed on a cylindrical portion is fitted onto an eccentric portion of a crankshaft to perform orbital motion relative to an inner peripheral surface of a cylinder, the plate-shaped blade being formed at its radial end surface with a recess or a protrusion, which serves as a reference of position.

Abstract: An oscillating piston type compressor has a piston formed integral with a blade. The compressor accommodates in a casing a compression mechanism section and a motor section, the mechanism including the piston having a plate-shaped blade integrally formed on a cylindrical portion is fitted onto an eccentric portion of a crankshaft to perform orbital motion relative to an inner peripheral surface of a cylinder, the plate-shaped blade being formed at its radial end surface with a recess or a protrusion, which serves as a reference of position.

Abstract: There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process.