Patents by Inventor Yukio Maruta

Yukio Maruta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for cutting wire formed on semiconductor substrate
    Patent number: 7037732
    Abstract: Method and device for cutting a wire with a small number of processing operations. The method includes forming a cut portion by scanning the semiconductor substrate with a focused ion beam to cut the wire. The method further includes forming a clear region continuously from the cut portion by scanning the semiconductor substrate with the focused ion beam. The clear region is free of stray material of the wire.
    Type: Grant
    Filed: March 12, 2004
    Date of Patent: May 2, 2006
    Assignee: Fujitsu Limited
    Inventors: Yukio Maruta, Kinichi Mizuno
  • METHOD AND DEVICE FOR CUTTING WIRE FORMED ON SEMICONDUCTOR SUBSTRATE
    Publication number: 20050085088
    Abstract: Method and device for cutting a wire with a small number of processing operations. The method includes forming a cut portion by scanning the semiconductor substrate with a focused ion beam to cut the wire. The method further includes forming a clear region continuously from the cut portion by scanning the semiconductor substrate with the focused ion beam. The clear region is free of stray material of the wire.
    Type: Application
    Filed: March 12, 2004
    Publication date: April 21, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Yukio MARUTA, Kinichi MIZUNO