Abstract: A parallel driving device that drives parallel-connected semiconductor elements includes a control unit and a gate driving circuit. The control unit detects a temperature difference between the semiconductor elements on the basis of detected values by temperature sensors that detect temperatures of the individual semiconductor elements. The control unit generates a control signal for changing the timing at which to turn on a first semiconductor element specified from the semiconductor elements on the basis of the temperature difference. The gate driving circuit generates a first driving signal for driving the semiconductor elements, and generates a second driving signal that is the first driving signal delayed on the basis of the control signal, and applies the second driving signal to the first semiconductor element.

Abstract: A heater element includes: a honeycomb structure including an outer peripheral wall and partition walls disposed on an inner side of the outer peripheral wall, the partition walls defining a plurality of cells, each of the cells extending from a first end face to a second end face to form a flow path; a pair of electrode layers provided on the outer peripheral wall and the partition walls on the first end face and the second end face; and terminals capable of electrically connecting the electrode layers to a conducting wire. At least a part of each of the electrode layers has an extending portion extending outwardly from an outer edge of each of the first end face and the second end face. Each of the terminals is connected to the extending portion and disposed to face a side surface of the honeycomb structure.

Abstract: A power conversion apparatus includes: a converter main circuit converting AC power into DC power; an inverter main circuit converting, into AC power, the DC power obtained by conversion by the converter main circuit; and a common cooler cooling first switching elements included in the inverter main circuit and second switching elements included in the converter main circuit. The first switching elements are modularized in units of one or more elements to form first modules. The second switching elements are modularized in units of one or more elements to form second modules. The first and second modules are mounted on a first surface of a base of the cooler. The first modules are arranged in a first direction on the first surface. The second modules are arranged such that two or more second modules are continuously arranged in a second direction orthogonal to the first direction on the first surface.

Abstract: A parallel driving device that drives parallel-connected semiconductor elements includes a control unit and a gate driving circuit. The control unit detects a temperature difference between the semiconductor elements on the basis of detected values by temperature sensors that detect temperatures of the individual semiconductor elements. The control unit generates a control signal for changing the timing at which to turn on a first semiconductor element specified from the semiconductor elements on the basis of the temperature difference. The gate driving circuit generates a first driving signal for driving the semiconductor elements, and generates a second driving signal that is the first driving signal delayed on the basis of the control signal, and applies the second driving signal to the first semiconductor element.

Abstract: A cooling device includes a heat-receiving block on which a heat emitter is mounted, a first heat pipe fixed at the heat-receiving block, and a second heat pipe located adjacent to the first heat pipe. The first heat pipe accommodates a first refrigerant in the gas-liquid two-phase state, and the second heat pipe accommodates a second refrigerant in the gas-liquid two-phase state. The ratio of the amount of the second refrigerant in the liquid state to the volume of the second heat pipe is higher than the ratio of the amount of the first refrigerant in the liquid state to the volume of the first heat pipe.

Abstract: A power conversion device includes six semiconductor modules. Each of the six semiconductor modules includes a first terminal (P), a second terminal (N), and a third terminal (AC) on its surface. The first terminals of two semiconductor modules configuring a semiconductor module group of the same phase are arranged to be opposed to each other. A plurality of semiconductor module groups are arranged in a direction perpendicular to an arrangement direction of two semiconductor modules in the semiconductor module group.

Abstract: A power conversion device includes six semiconductor modules. Each of the six semiconductor modules includes a first terminal (P), a second terminal (N), and a third terminal (AC) on its surface. The first terminals of two semiconductor modules configuring a semiconductor module group of the same phase are arranged to be opposed to each other. A plurality of semiconductor module groups are arranged in a direction perpendicular to an arrangement direction of two semiconductor modules in the semiconductor module group.

Abstract: A main circuit wiring member for electrically connecting a supply source of direct-current power and a semiconductor element module to each other or semiconductor element modules to each other, includes a first conductor covered with an insulating film and configured to allow a first potential to be applied thereto, a second conductor covered with the insulating film and configured to allow a second potential to be applied thereto, the second potential being lower than the first potential, and an insulating member that has intermediate-potential layer conductors sandwiched therein and is arranged between the first conductor and the second conductor.

Abstract: A vehicle auxiliary power supply device mounted in an electric rolling stock and that includes a converter device to convert DC power supplied from a DC power supply into desired DC power, and a three-phase inverter to convert the DC power supplied from the converter device into three-phase AC power and to supply the converted power to a load, wherein a switching element of the three-phase inverter is constituted by a semiconductor module formed of a wide bandgap semiconductor.

Abstract: A power converter includes: a power converter main circuit that includes semiconductor switching elements; gate drive circuits driving the semiconductor switching elements, respectively; and one or a plurality of impedance element groups connected between at least one pair of the gate drive circuits. At least one of the gate drive circuits includes a detector that detects a voltage across the impedance element group, and changes the driving speed of the semiconductor switching elements in accordance with an output of the detector.

Abstract: A power converter includes a power module having a positive electrode of a positive-side switching device connected to a first terminal, a negative electrode of the positive-side switching device and a positive electrode of a negative-side switching device connected to a second terminal, and a negative electrode of the negative-side switching device connected to a third terminal. The first terminal is connected to a P terminal of a filter capacitor via a first conductor of a bus bar that is a parallel flat plate conductor. The third terminal is connected to an N terminal of the filter capacitor via a second conductor of the bus bar. The bus bar as the parallel flat plate conductor has an L shape. The second terminal is connected to a load via a conductor bar physically different from the bus bar.

Abstract: A main circuit wiring member for electrically connecting a supply source of direct-current power and a semiconductor element module to each other or semiconductor element modules to each other, includes a first conductor covered with an insulating film and configured to allow a first potential to be applied thereto, a second conductor covered with the insulating film and configured to allow a second potential to be applied thereto, the second potential being lower than the first potential, and an insulating member that has intermediate-potential layer conductors sandwiched therein and is arranged between the first conductor and the second conductor.

Abstract: A power converter includes a power module having a positive electrode of a positive-side switching device connected to a first terminal, a negative electrode of the positive-side switching device and a positive electrode of a negative-side switching device connected to a second terminal, and a negative electrode of the negative-side switching device connected to a third terminal. The first terminal is connected to a P terminal of a filter capacitor via a first conductor of a bus bar that is a parallel flat plate conductor. The third terminal is connected to an N terminal of the filter capacitor via a second conductor of the bus bar. The bus bar as the parallel flat plate conductor has an L shape. The second terminal is connected to a load via a conductor bar physically different from the bus bar.

Abstract: A power conversion apparatus includes a main capacitor to store therein DC power, and an inverter circuit to convert the DC power stored in the main capacitor to AC power. The main capacitor and a power semiconductor element that constitutes the inverter circuit are connected to each other by a P-side common wire through which a switching current flows. A switching-current shunt component is connected in parallel to the P-side common wire.

Abstract: A power semiconductor module having switching elements includes: a collector main terminal and a collector auxiliary terminal connected to a collector potential of the switching element; a gate auxiliary terminal connected to a gate potential of the switching element; and an emitter main terminal and an emitter auxiliary terminal connected to an emitter potential of the switching element. A power converter includes a voltage dividing circuit board that generates a divided voltage obtained by dividing a voltage between the collector auxiliary terminal and the emitter auxiliary terminal and transmits to a gate driving circuit. The voltage dividing circuit board is electrically connected to the collector auxiliary terminal and the emitter auxiliary terminal. A gate driving circuit changes a driving speed of the switching element according to the divided voltage.

Abstract: First and second element pairs formed by connecting FWDs and MOSFETs in antiparallel are connected in series and sealed by resin to configure a core module. In the core module, a first drain electrode, a first source electrode, a second drain electrode, and a second source electrode are exposed to the surface. A cover with terminals is put on the core module. At this time, each of the direct-current positive electrode terminal, the direct-current negative electrode terminal, and the alternating-current terminal of the cover with terminals is electrically connected to each of the first drain electrode, the second source electrode, and the first source electrode and the second drain electrode.

Abstract: A power conversion device includes a filter capacitor to accumulate therein DC power, and an element unit including a semiconductor element module to perform a switching operation for converting the DC power accumulated in the filter capacitor into AC power. The filter capacitor and the element unit are disposed in the same casing. A heat-resistant capacitor having a higher heat resistance than the filter capacitor is connected to the element portion by using a connection conductor, and is also connected to a busbar different from the connection conductor. An electrical connection between the filter capacitor and the element unit is established through the busbar, the connection conductor, and the heat-resistant capacitor.

Abstract: A cooling device for a railroad vehicle that cools a heat generating body housed in a storage box set on the floor of the railroad vehicle includes a heat conduction plate configuring a part of a side surface of the storage box, the heat generating body being mounted on one surface side of the heat conduction plate, a plurality of heat pipes inclined to project from the other surface side to an upper side of the heat conduction plate, a plurality of fins fixed to the plurality of heat pipes, and a cover that includes opening sections, and covers the cooling device. A total of areas of the opening sections located on the base side of the heat pipes is formed larger than a total of areas of the opening sections located on the distal end portion side of the heat pipes.

Abstract: First and second element pairs formed by connecting FWDs and MOSFETs in antiparallel are connected in series and sealed by resin to configure a core module. In the core module, a first drain electrode, a first source electrode, a second drain electrode, and a second source electrode are exposed to the surface. A cover with terminals is put on the core module. At this time, each of the direct-current positive electrode terminal, the direct-current negative electrode terminal, and the alternating-current terminal of the cover with terminals is electrically connected to each of the first drain electrode, the second source electrode, and the first source electrode and the second drain electrode.

Abstract: A power converter includes: a power converter main circuit that includes semiconductor switching elements; gate drive circuits driving the semiconductor switching elements, respectively; and one or a plurality of impedance element groups connected between at least one pair of the gate drive circuits. At least one of the gate drive circuits includes a detector that detects a voltage across the impedance element group, and changes the driving speed of the semiconductor switching elements in accordance with an output of the detector.