Abstract: A template-type wafer polishing method in which a plurality of wafers are polished while they are fitted in the corresponding number of circumferentially spaced engagement holes in a template blank, with the backsides of the respective wafers held by a backing pad, wherein the backing pad has, in its one surface next to the template blank, a plurality of annular grooves each extending along a corresponding one of the engagement grooves in the template blank for relieving a stress concentrated on the peripheral edge of each wafer. The polished wafer is free from deformation, such as declination caused at the peripheral edge thereof due to stress concentration and, hence, has an extremely high degree of flatness. The backing pad and a method of making the same are also disclosed.