Patents by Inventor Yukio Nishihara

Yukio Nishihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrolessly solder plating composition
    Patent number: 5147454
    Abstract: The invention provides a bath composition for electroless solder plating comprising:(A) about 5 to about 120 g/l of at least one compound selected from the group consisting of alkanesulfonic acids and alkanolsulfonic acids,(B) about 10 to about 100 g/l of at least one compound selected from the group consisting of tin salts of alkanesulfonic acids and tin salts of alkanolsulfonic acids,(C) about 10 to about 100 g/l of at least one compound selected from the group consisting of lead salts of alkanesulfonic acids and lead salts of alkanolsulfonic acids,(D) about 10 to about 200 g/l of at least one compound selected from the group consisting of thiourea and thiourea derivatives, and(E) about 1 to about 250 g/l of at least one compound selected from the group consisting of monocarboxylic acids, dicarboxylic acids, tricarboxylic acids and salts thereof.
    Type: Grant
    Filed: January 17, 1990
    Date of Patent: September 15, 1992
    Assignee: Okuno Chemical Industries Co., Ltd.
    Inventors: Yukio Nishihara, Akemi Oharada